International Journal of Adhesion and Adhesives最新文献

{"title":"Investigation on the mechanical properties of Nano-Al2O3 particle reinforced single lap adhesive joints using digimat mean field homogenization and finite element method","authors":"İsmail Saraç ,&nbsp;Ferdi Yıldırım","doi":"10.1016/j.ijadhadh.2025.103959","DOIUrl":"10.1016/j.ijadhadh.2025.103959","url":null,"abstract":"<div><div>When the studies on particle reinforced adhesive joints are evaluated, there is a deficiency in simulation methods. Considering the diversity of particles and the variability of reinforcement ratios, obtaining the mechanical properties of particle reinforced adhesives experimentally is a costly process with a high workload. In this study, the mechanical properties of single-lap adhesive joints (SLJs) produced with pure DP460 and 4 % nano-Al₂O₃ reinforced DP460 epoxy composite adhesive were investigated using Digimat Mean Field Homogenization and Finite Element Method (FEM). At first, bulk and SLJs specimens were produced from composite and pure adhesives to perform experimental studies. Next, based on the experimental studies, finite element analysis (FEA) of the bulk specimens and SLJs was conducted. In the FEM, the Digimat-Mean Field (Digimat-MF) homogenization approach and Ansys structural analysis were employed together. In the first step of the simulation studies, the mechanical properties of the nano-composite adhesive were obtained using the Digimat-MF homeogenization method. In the second step, Digimat interface was created in the Ansys program and material properties were defined. In this way, the structural analysis of nano-Al₂O₃ reinforced bulk specimens and SLJs were accurately analyzed. In the FEA, tensile strength values of bulk specimens of pure DP460 and 4 % nano-Al₂O₃ reinforced DP460 epoxy adhesives were obtained. At the end of the study, experimental and simulation data were verified and compared. When the data acquired were evaluated, it was seen that the Digimat-MF homogenization approach and Ansys FEM were successfully applied to adhesive joints containing composite adhesives.</div></div>","PeriodicalId":13732,"journal":{"name":"International Journal of Adhesion and Adhesives","volume":"139 ","pages":"Article 103959"},"PeriodicalIF":3.2,"publicationDate":"2025-02-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143350884","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Surface plasma treatment effect on shear strength in adhesively bonded joints with modified addition curing silicone adhesive","authors":"Mohammad Hossein Jazayeri ,&nbsp;Majid Mokhtari","doi":"10.1016/j.ijadhadh.2025.103963","DOIUrl":"10.1016/j.ijadhadh.2025.103963","url":null,"abstract":"<div><div>Strong single lap bonded joints of different materials are of great importance in various advanced industries. Silicones are commonly used as reliable adhesives for this purpose. Although silicones offer excellent properties such as resistance to extreme temperatures and weather conditions, as well as flexibility, their low surface energy limits their application as adhesives. To address this issue, we added a hydrogen-containing silicone adhesion promoter to an addition-curing silicone adhesive. We also introduced functional groups on the aluminum and glass adherends through air plasma (AP) surface treatment. These modifications were made to improve the interface between the adhesive and the adherend. We also added hydrophobic fumed silica to the adhesive formulation to enhance its overall bond strength and toughness. The single lap-shear tests were carried out to study the lap-shear strength (LSS) of the adhesively bonded joints. It was shown that the presence of the adhesion promoter on AP-treated adherends results in a minimum increase of 196 % in LSS. It was observed that the adhesion promoter has a plasticizing effect in the absence of AP treatment, resulting in poor mechanical strength of the joints. Fumed silica has been shown to significantly impact the LSS of aluminum and glass adherends, increasing it by a factor of 3 and 4, respectively, at the concentration of 5 phr. In all cases, glass specimens exhibited stronger bonds.</div></div>","PeriodicalId":13732,"journal":{"name":"International Journal of Adhesion and Adhesives","volume":"139 ","pages":"Article 103963"},"PeriodicalIF":3.2,"publicationDate":"2025-02-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143376906","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Hybrid repair of primary metallic structures by combining a stress optimised cut-out and bonded patches","authors":"Paul Chang,&nbsp;John Wang,&nbsp;Manfred Heller,&nbsp;Xiaobo Yu","doi":"10.1016/j.ijadhadh.2025.103962","DOIUrl":"10.1016/j.ijadhadh.2025.103962","url":null,"abstract":"<div><div>A hybrid repair solution combining a stress optimised cut-out and a bonded patch is an effective approach for primary structure repairs, in which the optimised cut-out enhances the residual strength and helps meet certification requirement while the bonded patch provides further stress reduction in the repaired structure and promotes significant additional fatigue life enhancement. In this study, a cracked metallic specimen was repaired with an optimised cut-out at the crack tip and two boron/epoxy patches bonded back-to-back. The patches were positioned adjacent and some distance away from the cut-out and thus potential crack re-occurrence/growth can be visually monitored without the patch concealing the area. The effectiveness of the hybrid repair was assessed experimentally by comparing against three other specimen configurations namely specimens with a crack, a standard stop drill at the crack tip, and an optimum cut-out hole at the crack tip.</div><div>Finite element modelling results indicated that compared with the standard stop-hole specimen, the stress concentration factors of the specimens with optimum cut-out hole and hybrid repairs were reduced by 63 % and 73 %, respectively. Based on a simple cubic law, these stress reductions would result in the fatigue life before crack re-initiation to be 20 and 52 times longer. Fatigue tests under variable amplitude loads confirmed the significant extension of fatigue initiation life, where 28 and 53 times of enhancement were achieved for the optimum cut-out hole and hybrid repairs, respectively. The fatigue test results further showed that for the stop drill and optimum cut-out configurations, once the crack was reinitiated, its growth was relatively fast, whilst in the case of the specimen with the hybrid repair the crack growth rate was significantly slower.</div></div>","PeriodicalId":13732,"journal":{"name":"International Journal of Adhesion and Adhesives","volume":"139 ","pages":"Article 103962"},"PeriodicalIF":3.2,"publicationDate":"2025-02-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143420665","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Viscous fingering in adhesive bonding","authors":"Mohamad Al Trjman ,&nbsp;Alexander H.J. Salten ,&nbsp;Felix Beule ,&nbsp;Dominik Teutenberg ,&nbsp;Gerson Meschut ,&nbsp;Julia Riese ,&nbsp;Eugeny Y. Kenig","doi":"10.1016/j.ijadhadh.2025.103960","DOIUrl":"10.1016/j.ijadhadh.2025.103960","url":null,"abstract":"<div><div>Due to the adoption of multi-material construction methods in modern lightweight design, along with the use of adhesive bonding technology, thermally induced relative displacements between the joining components arise during the curing process. As a result, the original bond area is significantly reduced and exhibits a meandering structure. This structure, once cured, can lead to increased stress buildup in the joint due to the reduced adhesive area and the notch effect.</div><div>This work focuses on the experimental characterization and numerical description of a problem known as “viscous fingering”. To investigate this, adhesive surface reduction is experimentally investigated using a butt-bonded joint specimen (BJS) and an LWF–KS2 specimen at various displacements. Additionally, two-phase fluid simulations are carried out using computational fluid dynamics (CFD) to predict the formation of the adhesive surface. The finite element (FE) method is also used to analyze the adhesive surface reduction and simulate the mechanical properties of the bonded joint.</div></div>","PeriodicalId":13732,"journal":{"name":"International Journal of Adhesion and Adhesives","volume":"139 ","pages":"Article 103960"},"PeriodicalIF":3.2,"publicationDate":"2025-02-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143377060","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Investigation of the effect of surface roughness and plasma treatment on adhesively bonded aluminium-polyamide hybrid joints","authors":"M. Batıkan Kandemir ,&nbsp;Tolga Tavşanoğlu ,&nbsp;M. Özgür Seydibeyoğlu","doi":"10.1016/j.ijadhadh.2025.103964","DOIUrl":"10.1016/j.ijadhadh.2025.103964","url":null,"abstract":"<div><div>This study investigated the effects of roughness and plasma treatment on adhesive-bonded aluminium and polyamide samples. The surfaces were treated using sanding and plasma methods, both independently and in combination. The results showed a slight decrease in contact angle and an increase in lap shear strength (LSS) with increasing surface roughness. The roughness of aluminium increased by 51.43 % (from 0.35 μm to 0.53 μm) and that of polyamide by 46.15 % (from 0.26 μm to 0.38 μm). This resulted in a 34.09 % increase in LSS (from 2.2 MPa to 2.95 MPa) specifically. Plasma treatment was then applied, which significantly reduced contact angles and enhanced LSS on both materials. However, amplification of these effects was not observed when treating both sides. The experiment showed a decrease in contact angle on aluminium by 47.88 % (from 71.77° to 37.41°) and on polyamide by 74.28 % (from 60.48° to 15.55°). Treating only polyamide resulted in a 105.42 % increase in LSS (from 2.95 MPa to 6.06 MPa). The optimal LSS was achieved by treating polyamide with plasma and increasing the roughness of both sides to around 50 %. The failure mechanism shifted from substrate to adhesion/cohesion due to plasma treatment. Additionally, an increase in roughness promoted adhesion failure.</div></div>","PeriodicalId":13732,"journal":{"name":"International Journal of Adhesion and Adhesives","volume":"139 ","pages":"Article 103964"},"PeriodicalIF":3.2,"publicationDate":"2025-02-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143420664","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Enhancing the performance of cold-setting phenol–resorcinol–formaldehyde resin adhesives through condensation extension","authors":"Eko Setio Wibowo ,&nbsp;Byung-Dae Park ,&nbsp;Muhammad Adly Rahandi Lubis ,&nbsp;Sukma Surya Kusumah ,&nbsp;Adi Santoso ,&nbsp;Ajeng Arum Sari ,&nbsp;Apri Heri Iswanto","doi":"10.1016/j.ijadhadh.2025.103958","DOIUrl":"10.1016/j.ijadhadh.2025.103958","url":null,"abstract":"<div><div>Phenol–resorcinol–formaldehyde (PRF) are the most essential adhesives for laminated timber products. PRF resins are known for their excellent strength and durability. However, when cold-pressed, PRF resins have various issues, including free phenol in the resin solution, which cannot react with formaldehyde. Aside from decreasing reactivity, excessive amounts of free phenol will render PRF resins hazardous. In addition, using hardeners containing significant amounts of paraformaldehyde might result in high formaldehyde emissions if the resin and hardener do not react completely during curing. Therefore, this research aims to reduce the possibility of high levels of free phenol and formaldehyde in PRF resins by synthesizing the resins with various condensation times and using an oxazolidine hardener to replace paraformaldehyde. PRF resins' properties and adhesion performance with various condensation times were evaluated. The results showed that PRF resins' viscosity and solids content increased when the condensation time increased, whereas their gelation time reduced. PRF resins with a longer condensation time had a higher proportion of methylene linkage and greater reactivity, as evidenced by lower apparent activation energy during curing. Furthermore, increasing the condensation time of PRF resins enhanced the adhesion strength of glue-laminated timber products bonded with these resins. The results showed that increasing the condensation time of PRF resins significantly impacts their reactivity and performance.</div></div>","PeriodicalId":13732,"journal":{"name":"International Journal of Adhesion and Adhesives","volume":"138 ","pages":"Article 103958"},"PeriodicalIF":3.2,"publicationDate":"2025-02-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143169159","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Innovative magnetic treatment improves the dentin bonding performance of etch-and-rinse adhesives","authors":"Caroline de Oliveira Teixeira ,&nbsp;Ketelyn Kerty Moreira de Oliveira ,&nbsp;Tainah Oliveira Rifane ,&nbsp;Adyson Herbert Correia Alves ,&nbsp;Davino Machado Andrade Neto ,&nbsp;Pierre Basílio Almeida Fechine ,&nbsp;Madiana Magalhães Moreira ,&nbsp;Victor Pinheiro Feitosa","doi":"10.1016/j.ijadhadh.2025.103950","DOIUrl":"10.1016/j.ijadhadh.2025.103950","url":null,"abstract":"<div><h3>Objective</h3><div>To evaluate the effect of etch-and-rinse two-step adhesives doped with magnetic Fe₃O₄ nanoparticles (NP), associated with an external magnet, on dentin bonding.</div></div><div><h3>Material and methods</h3><div>Teeth were restored using Adper Single Bond 2 (SB) or OptiBond S (OB) according to the following groups (n = 5): SB and OB controls; SB-FeMag and OB-FeMag (NP + external magnet); SB-Fe and OB-Fe (NP without an external magnet). NP were incorporated at 2 % concentration. The external magnet was positioned below (apical) the tooth for 30 s before curing the adhesives. Resin-dentin sticks were tested for microtensile bond strength (μTBS) and nanoleakage at 24 h and after bacterial collagenase challenge. Failure modes were categorized by stereomicroscope. Data were statistically analyzed using two-way ANOVA and Tukey's test (p &lt; 0.05).</div></div><div><h3>Results</h3><div>OB-Fe exhibited statistically higher 24 h μTBS values compared to SB-FeMag and SB-Control. After collagenase challenge, OB-Fe and SB-FeMag achieved the highest μTBS values, significantly different from SB-Fe and SB-Control. OB-Fe, OB-FeMag and SB-FeMag maintained their bond strength (p &gt; 0.05). SB-Fe and control groups showed a significant μTBS reduction after challenge, with adhesive failures predominating in the controls. All groups exhibited silver infiltration in the hybrid layer. However, SB-control revealed a gap after collagenase challenge, while OB-FeMag reduced these silver deposits.</div></div><div><h3>Conclusions</h3><div>The incorporation of Fe₃O₄ nanoparticles into etch-and-rinse adhesives represents an innovative magnetic treatment that maintains stable bonding to dentin.</div></div>","PeriodicalId":13732,"journal":{"name":"International Journal of Adhesion and Adhesives","volume":"138 ","pages":"Article 103950"},"PeriodicalIF":3.2,"publicationDate":"2025-01-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143169158","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Thermal stability and degradation of a low refractive index photo-crosslinkable adhesive","authors":"Alexandre Godin ,&nbsp;Clément Mailhé ,&nbsp;Jérémy Barboure ,&nbsp;Cédric Le Coz ,&nbsp;Thomas Vidil ,&nbsp;Abdelhak Saci ,&nbsp;Sébastien Touzain ,&nbsp;Marie Duquesne","doi":"10.1016/j.ijadhadh.2025.103956","DOIUrl":"10.1016/j.ijadhadh.2025.103956","url":null,"abstract":"<div><div>In some laser assemblies, optical components are glued on their metal mount using a photocrosslinkable adhesive. All these components are submitted to medium to high temperatures for several hours upon laser's operation time. The subsequent thermal stresses endured by the adhesive could lead to its degradation, alter thus the functioning of the assembly and impact the alignment of the laser, key issues in laser applications. This work focuses on the investigation and the modeling of the lifespan, the degradation in the face of thermal stresses, particularly those generated by a laser, and of the ageing of a photocrosslinkable adhesive, PC373HA. The thermal characterization is performed using ThermoGravimetric Analysis and allows for the development, the validation and the comparison of three models based on Arrhenius' law to estimate the lifetime of adhesives as a function of temperature. A temperature of 150 °C is identified as a threshold to ensure limited degradation over the 15 h requested for laser operation endurances. The Ozawa-Flynn-Wall model and the Kissinger-Akahira-Sunose model correctly reproduce PC373HA's thermal behavior submitted to different thermal scenarii (temperatures, heating rates …). Both show that the higher the temperature, the faster the degradation process, approximately 10 min at 220 °C and 100 min at 180 °C, much less than the required 15 h. Besides, in the event of an incident with the laser, if the temperature exceeds 200 °C for more than 10 min or 180 °C for more than 100 min, corrective action should be taken, and the adhesive should be replaced. These models therefore provide fundamental information for laser applications and will allow the implementation of preventive solutions during use but also in case of incident.</div></div>","PeriodicalId":13732,"journal":{"name":"International Journal of Adhesion and Adhesives","volume":"139 ","pages":"Article 103956"},"PeriodicalIF":3.2,"publicationDate":"2025-01-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143270499","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"An electrically conducting adhesive paste based on adhesive exopolysaccharide of Priestia aryabhattai KAG -18","authors":"Komal Parmar ,&nbsp;C.K. Sumesh ,&nbsp;Pratik M. Pataniya ,&nbsp;Bragadish Iyer","doi":"10.1016/j.ijadhadh.2025.103957","DOIUrl":"10.1016/j.ijadhadh.2025.103957","url":null,"abstract":"<div><div>Conventionally, lead/tin alloy-based solders, lead-free (Sn/Ag, Sn/Ag/Cu) solders, and metal-based ECAs are used for fabrication of electronic circuits. However, they have limitations such as low strength of joints, toxic flux materials, higher processing temperature, and fatigue. Although, recently metal-free ECAs based on graphite/carbon black/carbon nanotubes have drawn attention, the research on such ECA pastes is mainly focused on electrical conductivity, neglecting their binding strength. In the present study, the adhesive exopolysaccharide of <em>Priestia aryabhattai</em> KAG-18 (EPS/KAG-18) (5.0 % w/v) showed highest tensile strength of 1.5 ± 0.153 MPa using paper as substrate. EPS/KAG-18 was a heteropolysaccharide containing glucose, 11.0 %; galactose, 71.0 % and glucuronic acid, 18.0 %. Three ECA pastes i.e. KAG-18/C1, KAG-18/C2, and KAG-18/C3 were prepared by blending activated charcoal (20 %, w/w) with EPS/KAG-18. Upon TGA/DSC profile indicated ECA pastes were stable up to 250 °C, without glass transition. The XRD curves of ECAs, suggested amorphous nature of ECAs. The films of ECA on PCB exposed to different temperatures showed no deformation at −80, 30 and 150 °C. Overall, films prepared using KAG-18/C3 paste was uniform as indicated by surface roughness of the films. With increase in the shear rate, the viscosity of the three ECAs was found to decrease indicating their shear thinning or pseudo plastic behavior. The ECA pastes showed higher G′ than G″, in the order KAG-18/C2&lt;KAG-18/C1&lt; KAG-18/C3 which indicated their gel-like behavior. The tensile strength of the paper specimens bonded using ECAs were found to be in the order: KAG-18/C1&lt;KAG-18/C2&lt;KAG-18/C3 i.e.0.19 ± 0.021 MPa, 0.541 ± 0.069 MPa and 1.09 ± 0.099 MPa, respectively. As the content of adhesive biopolymer EPS/KAG-18 was increased from 10.0 % (w/w) to 15.0 (w/w) in KAG-18/C1and KAG-18/C2 pastes, respectively, the conductivity of these pastes also increased. The KAG-18/C2 paste could be used also as solder paste for fabrication of electric circuit on PCB board and cellulose paper.</div></div>","PeriodicalId":13732,"journal":{"name":"International Journal of Adhesion and Adhesives","volume":"138 ","pages":"Article 103957"},"PeriodicalIF":3.2,"publicationDate":"2025-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143169157","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Physicochemical properties of experimental self-adhesive resins containing 45S5 bioglass","authors":"Yana Terra de Oliveira ,&nbsp;Ketelyn Kerty Moreira de Oliveira ,&nbsp;Tainah Oliveira Rifane ,&nbsp;Victor Pinheiro Feitosa ,&nbsp;Paulo Roberto Barroso Picanço ,&nbsp;Diego Martins de Paula","doi":"10.1016/j.ijadhadh.2025.103949","DOIUrl":"10.1016/j.ijadhadh.2025.103949","url":null,"abstract":"<div><h3>Objective</h3><div>To evaluate the physicochemical properties of self-adhesive resin composites containing tailored 45S5 bioglass (BAG).</div></div><div><h3>Materials and methods</h3><div>Three experimental composite resins were formulated, comprising 20 wt% Bis-GMA, 10 wt% TEGDMA, 0.5 wt% camphorquinone, 1 wt% tertiary amine, and 55 wt% silanized barium particles. The groups were divided according to BAG and the type of resin, adhesive or self-adhesive: 1) CONT: without BAG and MDP; 2) 45S5: containing 15 wt% BAG (AD); 3) MDP + 45S5: containing 15 wt% BAG and 3 wt% 10-MDP- self-adhesive. The adhesive utilized Primer&amp;Bond Universal, while the self-adhesive resin no prior treatment. The microtensile bond strength (μTBS) was measured at 24 h and after one year (n = 5). Failure analysis was conducted using a stereomicroscope. Flexural strength (FS) and elastic modulus (EM) was evaluated using bar-shaped samples after 24 h (n = 12). Disc-shaped samples were prepared for water sorption (WSp) and solubility (WSl) by ISO 4049 (n = 12). The degree of conversion after 24 h (DC, n = 3) and remineralization assessments were conducted via FTIR (n = 5). Statistical analysis was performed using ANOVA followed by Tukey's test (p &lt; 0.05).</div></div><div><h3>Results</h3><div>No significant differences in DC were observed among the groups (p = 0.519). The incorporation of BAG resulted in a significant reduction in FS values, with CONT showing 45.01 MPa and 45S5 23.55 MPa. For MS, CONT (791.34 MPa) and 45S5 (623.44 MPa) showed higher values (p = 0.133). This was accompanied by an increase in WS and SL, measured at 69.08 mg/mm³ and 14.67 mg/mm³, respectively, compared to CONT and MDP +45S5 (p = 0.982). Regarding remineralization, the MDP +45S5 group exhibited a notable increase in hydroxyapatite phosphate peaks at 970 and 1030 cm⁻¹. At 24 h, no significant differences were detected in μTBS among the experimental resins (p &lt; 0.05). Following aging, CONT (18.8 MPa) and 45S5 (17.20 MPa) displayed significantly higher μTBS values, predominantly characterized by mixed failure modes.</div></div><div><h3>Conclusion</h3><div>The experimental self-adhesive resin containing MDP and 45S5 exhibited satisfactory physicochemical properties, suggesting its potential as a remineralizing material.</div></div>","PeriodicalId":13732,"journal":{"name":"International Journal of Adhesion and Adhesives","volume":"138 ","pages":"Article 103949"},"PeriodicalIF":3.2,"publicationDate":"2025-01-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143168002","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}