IEEE Journal of Selected Topics in Quantum Electronics最新文献_第9页

3D-Stacked Back-Illuminated Single-Photon Avalanche Diode Pixel With a Pitch of 3.5 μm 3d堆叠背照单光子雪崩二极管像素，间距为3.5 μm

IF 5.1 2区工程技术

IEEE Journal of Selected Topics in Quantum Electronics Pub Date : 2026-01-12 DOI: 10.1109/JSTQE.2026.3651682

Eunsung Park;Hyo-Sung Park;Hyun-Seung Choi;Woo-Young Choi;Myung-Jae Lee

{"title":"3D-Stacked Back-Illuminated Single-Photon Avalanche Diode Pixel With a Pitch of 3.5 μm","authors":"Eunsung Park;Hyo-Sung Park;Hyun-Seung Choi;Woo-Young Choi;Myung-Jae Lee","doi":"10.1109/JSTQE.2026.3651682","DOIUrl":"https://doi.org/10.1109/JSTQE.2026.3651682","url":null,"abstract":"Single-photon avalanche diode (SPAD) pixel scaling is essential to meet the increasing demands for high-resolution, compact, and power-efficient time-of-flight (ToF) sensing. In particular, the 3D-stacked approach enables aggressive pixel scaling by separating the SPAD and readout circuits into different wafers, thus maximizing the fill factor while minimizing the pixel pitch. However, pixel miniaturization often leads to degraded SPAD performance due to the premature edge breakdown (PEB) and the reduced number of photon-generated carriers that go through the avalanche multiplication region. In this work, we overcome these challenges by optimizing the doping profile to enhance the carrier collection in the device. We present a detailed analysis of the optimization progress by evaluating breakdown voltage (<italic>V<sub>B</sub></i>), dark count rate (DCR), and photon detection probability (PDP), highlighting the trade-offs and recovery achieved through successive doping refinements. The optimized device achieves a PDP of 37% and a timing jitter of 85 ps at 940 nm. Compared to prior 3D-stacked back-illuminated (BI) SPADs, our work exhibits one of the smallest pixel pitches to date, yet retains competitive PDP and jitter characteristics. This combination of aggressive scaling and robust performance positions the proposed SPAD as a promising solution for LiDAR, 3D imaging, and future wearable sensing systems.","PeriodicalId":13094,"journal":{"name":"IEEE Journal of Selected Topics in Quantum Electronics","volume":"32 2: 3-D Horizons in Photonics: Integrated Circuits","pages":"1-9"},"PeriodicalIF":5.1,"publicationDate":"2026-01-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11339869","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146175898","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

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3D Heterogeneous Integration of Back-Emitting VCSEL Arrays via Flip-Chip Bonding for Co-Packaged Optics Systems 反向发射VCSEL阵列在共封装光学系统中的倒装键合三维非均匀集成

IF 5.1 2区工程技术

IEEE Journal of Selected Topics in Quantum Electronics Pub Date : 2026-01-05 DOI: 10.1109/JSTQE.2025.3650463

Kung-An Lin;Thu Huong Bui;Lucas Yang;Chao-Hsin Wu

{"title":"3D Heterogeneous Integration of Back-Emitting VCSEL Arrays via Flip-Chip Bonding for Co-Packaged Optics Systems","authors":"Kung-An Lin;Thu Huong Bui;Lucas Yang;Chao-Hsin Wu","doi":"10.1109/JSTQE.2025.3650463","DOIUrl":"https://doi.org/10.1109/JSTQE.2025.3650463","url":null,"abstract":"Flip-chip bonding is a promising technique for integrating Vertical-Cavity Surface-Emitting Lasers (VCSELs) in Co-Packaged Optics (CPO) for high-speed applications, but it requires careful optimization of Gold (Au) bumps bonding parameters to address thermal management, ensure efficient optical coupling, and enhance device performance. This study investigates the packaging performance of a VCSEL array integrated onto silicon interposers using flip-chip bonding with Au bumps under various bonding conditions. Emphasis is placed on the effects of bump flattening and alignment accuracy on bonding quality and overall device performance. Au bumps with flattened surfaces and optimized misalignment were analyzed through SEM imaging, luminescence testing, and L-I-V (Light–Current–Voltage) characterization. Results show that flattening Au bumps and a small misalignment between the two Au bumps significantly improve surface planarity and enhance both electrical and optical performance. Finite Element Analysis (FEA) simulations are also conducted to compare with experimental results and provide further insight into stress distribution and structural behavior. The findings underscore the importance of bump flattening and precise alignment in ensuring mechanical reliability and achieving optimal performance in VCSEL-based optical interconnects for next-generation CPO systems.","PeriodicalId":13094,"journal":{"name":"IEEE Journal of Selected Topics in Quantum Electronics","volume":"32 2: 3-D Horizons in Photonics: Integrated Circuits","pages":"1-8"},"PeriodicalIF":5.1,"publicationDate":"2026-01-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146026538","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

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IEEE Journal of Selected Topics in Quantum Electronics Publication Information IEEE量子电子学专题杂志出版信息

IF 4.5 2区工程技术

IEEE Journal of Selected Topics in Quantum Electronics Pub Date : 2026-01-01 Epub Date: 2026-04-15 DOI: 10.1109/JSTQE.2026.3655518

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Overview of Free-Space Laser Communications Technology State-of-the-Art: Challenges, Solutions, and Standards 自由空间激光通信技术综述：挑战、解决方案和标准

IF 5.1 2区工程技术

IEEE Journal of Selected Topics in Quantum Electronics Pub Date : 2026-01-01 Epub Date: 2026-03-17 DOI: 10.1109/JSTQE.2026.3674712

Don Boroson;Hamid Hemmati

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IEEE Journal of Selected Topics in Quantum Electronics Information for Authors IEEE量子电子信息专题杂志

IF 4.5 2区工程技术

IEEE Journal of Selected Topics in Quantum Electronics Pub Date : 2026-01-01 Epub Date: 2026-04-15 DOI: 10.1109/JSTQE.2026.3655523

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IEEE Journal of Selected Topics in Quantum Electronics Edics IEEE量子电子医学专题杂志

IF 4.5 2区工程技术

IEEE Journal of Selected Topics in Quantum Electronics Pub Date : 2026-01-01 Epub Date: 2026-04-16 DOI: 10.1109/JSTQE.2026.3655546

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Call for Papers on Photonic Thermal Devices 光子热器件征文

IF 5.1 2区工程技术

IEEE Journal of Selected Topics in Quantum Electronics Pub Date : 2026-01-01 Epub Date: 2026-04-15 DOI: 10.1109/JSTQE.2026.3672962

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Call for Papers on Selected Topics in Quantum Computing Perspective Papers 量子计算展望论文征集

IF 5.1 2区工程技术

IEEE Journal of Selected Topics in Quantum Electronics Pub Date : 2026-01-01 Epub Date: 2026-04-15 DOI: 10.1109/JSTQE.2026.3664728

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Call for Associate Editors 招聘副编辑

IF 5.1 2区工程技术

IEEE Journal of Selected Topics in Quantum Electronics Pub Date : 2026-01-01 Epub Date: 2026-04-15 DOI: 10.1109/JSTQE.2026.3664730

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Automated Calibration of Position Sensors in Coarse Pointing Assemblies for Free-Space Optical Communication Using Gaussian Process Regression 基于高斯过程回归的自由空间光通信粗点组件位置传感器自动标定

IF 5.1 2区工程技术

IEEE Journal of Selected Topics in Quantum Electronics Pub Date : 2026-01-01 Epub Date: 2026-03-18 DOI: 10.1109/JSTQE.2026.3675528

Max van Meer;Emre Deniz;Gert Witvoet;Tom Oomen

{"title":"Automated Calibration of Position Sensors in Coarse Pointing Assemblies for Free-Space Optical Communication Using Gaussian Process Regression","authors":"Max van Meer;Emre Deniz;Gert Witvoet;Tom Oomen","doi":"10.1109/JSTQE.2026.3675528","DOIUrl":"https://doi.org/10.1109/JSTQE.2026.3675528","url":null,"abstract":"Free-space optical satellite communication terminals rely on accurate metrology of their pointing mirrors to correctly aim their laser to a counter terminal, while at the same time requiring simple, lightweight and low-cost sensors. The aim of this paper is to develop an automated procedure for the calibration of these sensors in a mass production setting, using a pointing test bench (PTB) to automatically calibrate the angular sensors of many Coarse Pointing Assemblies (CPAs), which position pointing mirrors over a large field-of-regard. The PTB and CPA are aligned using feedback over an external optical position sensor (OPS) and an inverse kinematic model is learned from data, after which Gaussian Process regression models are created to predict and correct sensor errors, taking into account propagation of calibration errors from the PTB to the CPA. Experimental results show that the CPA sensor errors are reduced by two orders of magnitude by this automated calibration approach, even at orientations at which the PTB itself is uncalibrated. The developed framework is generalizable to calibration of arbitrary 2 degree of freedom (2-DOF) rotary systems and is not limited to specific types of position sensors, thereby enabling significant cost savings and increased accuracy in mass production of satellite communication terminals.","PeriodicalId":13094,"journal":{"name":"IEEE Journal of Selected Topics in Quantum Electronics","volume":"32 1: Advances in Free Space Laser Communications","pages":"1-12"},"PeriodicalIF":5.1,"publicationDate":"2026-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147665296","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0