2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)最新文献

{"title":"Implementation and Practical Experience with an Automatic Secondary ESD Detection Algorithm","authors":"Shubhankar Marathe, Giorgi Maghlakelidze, D. Pommerenke, Mike Hertz","doi":"10.1109/EMCSI.2018.8495425","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495425","url":null,"abstract":"Secondary ESD from a non-grounded decorative metal structure on an electronic device often leads to very large discharge currents and a fast rise time of less than 400 picoseconds. Due to the proximity of this secondary ESD event to the electronics, it is likely to cause soft failures or latch-up. Secondary ESD can be detected in IEC 61000-4-2 setups by monitoring the currents, charge transfer, and sudden current increases due to the secondary ESD. An algorithm has been implemented in a test setup which automatically detects secondary ESD. However, due to pre-pulses, reignition of sparking within the relay, and other effects, the algorithm may lead to false positives and missed secondary ESD. This paper describes the implementation of the algorithm and presents the results of DUT testing.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121110988","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A Novel Platform Power Integrity Design Approach with Standard PI Model (SPIM) and Unified PI Dsign Target (UPIT)","authors":"X. Cai, Y. HsiaoJimmy, Chi-te Chen, Yun Ling, Denis Chen, S. Ji","doi":"10.1109/EMCSI.2018.8495406","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495406","url":null,"abstract":"A novel fast power integrity design approach has been implemented and deployed with SPIM and UPIT, to efficiently address customers' platform design differentiation for PDN design & optimization with trade-off, and review & sign off.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116498378","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Managing 802.11n Adjacent-Channel Interference via Efficient Carrier Spacing in the 2.4-GHz Band","authors":"R. Badra, Erislandy Mozo, George E. Figueras","doi":"10.1109/EMCSI.2018.8495360","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495360","url":null,"abstract":"The wide acceptance of the 802.ttn technology for provision of wireless local networks and the limited size of the 2.4-GHz band used by most of them have led to RF environments characterized by congestion and poor performance. Seeking to mitigate these effects, there has been interest in studying different frequency planning strategies in order to maximize the number of center frequencies available for 802.11n nodes while keeping the effects of adjacent channel interference at check. Inspired by this approach, this work explores via an extensive set of link-level simulations the trade-off between the different carrier spacing schemes and the maximum achievable bit rate in each of these scenarios, while quantifying the impact of such interference. Results point at the ratio of interferer power to desired signal power as a key factor in the choice of inter-carrier spacing.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129590030","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Higher-order Multipoles in the Electromagnetic Field Produced by a Wireless Power Transfer System Employing DD Polarized Couplers","authors":"J. Mclean, H. Foltz, R. Sutton","doi":"10.1109/EMCSI.2018.8495407","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495407","url":null,"abstract":"The DD coupler for magnetic field wireless power transfer (WPT) systems has been analyzed previously., and it has been shown that its electromagnetic field is dominated by a horizontal magnetic dipole moment. However., a significant contribution from a higher-order multipole is also present and is apparent in the magnetic field even at distances of 10m. Here., the deviation of the electromagnetic field from that of a horizontal magnetic dipole is quantified by subtracting the properly weighted dipolar $mathrm{TE}_{11^{-}}^{e}R$ field from numerically computed data leaving a residual field. The residual electromagnetic field clearly exhibits higher-order multipole behavior. It is anticipated that this higher-order multipole would have the form of two antiparallel vertical magnetic dipoles (one for each spiral winding) combined with two canceling images due to the effect of the conducting shield. This multipole is then an ensemble of four elementary magnetic dipole sources or two side-by-side linear., vertical., anti-phase magnetic quadrupoles and hence in terms of TE-z electric vector potential has a multipole order of $m=1$ and $n=2$. We show that such a multipole source would excite $mathrm{TE}_{13^{-}}^{e} R, mathrm{TE}_{11^{-}}^{e}R$:., and $mathrm{TM}_{12^{-}}^{o}R$ spherical modes. In order to dissect the residual field it is useful to note that radial magnetic field must be due exclusively to TE-$R$ modes while radial electric field is due solely to TM-R modes. The radial component of the residual magnetic field clearly contains tesseral harmonics $mathrm{T}_{11}^{e}$ and $mathrm{T}_{13}^{{e}}$ that is of order of $m=1, n=1$ and $m=1$., $n=3$ and thus corresponds to the $mathrm{TE}_{13^{-}}^{e}R$: and $mathrm{TE}_{11^{-}}^{e}R$ spherical modes. However., investigation of the residual radial electric field indicates that it is composed of more than just the $mathrm{TM}_{12}^{o}-R$ spherical mode. It appears that this additional component of the field is due to the spiral nature of the windings and the feed.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128890180","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Direct Illumination: A Beacon for Advanced Product Testing","authors":"J. Viel","doi":"10.1109/emcsi.2018.8495209","DOIUrl":"https://doi.org/10.1109/emcsi.2018.8495209","url":null,"abstract":"Well established test methods exist for both Radiated emissions and immunity used in every product industry.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130790924","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"EMC Leadership - Networking Skills","authors":"D. Hoolihan","doi":"10.1109/emcsi.2018.8495205","DOIUrl":"https://doi.org/10.1109/emcsi.2018.8495205","url":null,"abstract":"EMC Leadership - Networking Skills ► “Success is the Ability to go from one Failure to Another with no Loss of Enthusiasm” ◦- Winston Churchill • British Politician and Leader • 1874 – 1965","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133946984","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Interspecies Communication, Boomers and Millennials in conversation","authors":"J. Mclellan","doi":"10.1109/emcsi.2018.8495336","DOIUrl":"https://doi.org/10.1109/emcsi.2018.8495336","url":null,"abstract":"The Generations","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134173446","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"The Case for Measurement and Analysis of ESD Fields in Semiconductor Manufacturing","authors":"T. Maloney","doi":"10.1109/EMCSI.2018.8495351","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495351","url":null,"abstract":"A destructive Charged Device Model electrostatic discharge event can happen in semiconductor manufacturing and should be detectable from radiation that results from collapse of an electric dipole. The analytically describable radiation field pulse of CDM can be readily produced with a new instrument (CDM Event Simulator or CDMES) that creates dipole collapse at will. A coaxial monopole E-field antenna's transfer function gives the antenna signal in near-field, and experiments compare well with theory. These and other instruments for CDM ESD monitoring and process control are described in a newly-issued patent, reviewed here.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134107220","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"An Approximate Model for Near-Field Calculation of Phased Array","authors":"V. Chtcherbakov","doi":"10.1109/EMCSI.2018.8495345","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495345","url":null,"abstract":"This paper presents the application of an effective aperture (EA) model for the near-field (NF) calculation on the main beam axis of a scanned phased array (PA) with arbitrary aperture shape and uniform amplitude distribution. An EA model presents a realistic approximation of PA functioning principles that had earlier been applied for only far-field calculations. The proposed method is based on the scalar wave theory and a representation of a two-dimensional Rayleigh-Sommerfeld diffraction integral for the field intensity of flat aperture in the form of a one-dimensional parametric integral around the perimeter of the aperture, as obtained by Dubra and Ferrari. The method attempts to simplify the near-field calculations of PA using the general parameters of an antenna. An accuracy analysis of NF simulation results for elliptical and rectangular PA has been completed. The limitations for the minimal NF distance and the maximal scan angle as a function of array dimensions have been obtained. A comparison of the EA results of the NF calculation with NF simulations using electromagnetic software FEKO demonstrates a positive correlation. The method shows that the NF of PA with a scanned beam, as a rule, has greater field intensity in comparison with the broadside direction of radiation at the same distance from the aperture. Therefore, PA presents an increased risk of human exposure and electromagnetic interference in the NF region.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132155669","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Modeling and Analysis a of On-Die Decoupling Capacitance in the Power Delivery Network of an Integrated Chip","authors":"S. Moon, Seonha Lee","doi":"10.1109/EMCSI.2018.8495317","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495317","url":null,"abstract":"In this work, we propose an analytical approach for accurate estimation on on-die decoupling capacitance in the power delivery network (PDN) of an integrated chip (IC). This paper suggests a simplified model of PDN which avoids the complex mesh structures traditionally generated but still provides a good fit model with measurement. The suggested model consists of branched multiple cells in a chained node formation. By manipulating multiple variables accounting for a complex PDN structure, the curve fitting process was performed and the best-fitted curve was found to be valid with less than 3% error tolerance through the solution-search processes by comparing capacitor values in a known mesh structure. Consequently, complex matrix PDN can be simplified and converted to an analytical model through the proposed chained structure. This approach is expected to effectively validate the value of implemented decoupling capacitance in the PDN of a designed IC with conventional low-impedance measurement techniques.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132179875","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}