{"title":"CISPR 35 Tests","authors":"G. Pettit","doi":"10.1109/emcsi.2018.8495159","DOIUrl":"https://doi.org/10.1109/emcsi.2018.8495159","url":null,"abstract":"This article consists only of a collection of slides from the author's conference presentation.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116641852","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Introduction to Reverberation Chamber Concepts and its Application for Probe Calibration and Antenna Efficiency Measurements","authors":"D. Lewis","doi":"10.1109/EMCSI.2018.8495400","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495400","url":null,"abstract":"","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115205306","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Electromagnetic Time Reversal and its Application to Electromagnetic Compatibility","authors":"M. Rubinstein, F. Rachidi","doi":"10.1109/emcsi.2018.8495379","DOIUrl":"https://doi.org/10.1109/emcsi.2018.8495379","url":null,"abstract":"This article consists only of a collection of slides from the author's conference presentation.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115473656","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"What is ACEC? FR-PM-1 -1","authors":"W. Radasky","doi":"10.1109/EMCSI.2018.8495437","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495437","url":null,"abstract":"Introduction 防This presentation will describe the role of the Advisory Committee on Electromagnetic Compatibility (ACEC) within the International Electrotechnical Commission (IEC) 防The presentation will begin with the history of ACEC and will mention some of the major accomplishments over the years 防While the terms of reference of ACEC have been modified by the IEC over more than 20 years, the current objectives of the organization are to oversee the development of EMC standards within the IEC and to support product committees in their use of basic and generic EMC standards as described by IEC Guide 107 防At the end of the presentation, some of the “hot topics” will be mentioned","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116301027","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Emission Standardization in the 2-150 kHz Frequency Band FR-PM-1-3","authors":"W. Radasky, H. Rochereau","doi":"10.1109/emcsi.2018.8495356","DOIUrl":"https://doi.org/10.1109/emcsi.2018.8495356","url":null,"abstract":"EMC requirements in the Range 2-150 kHz Background -1 ■CENELEC TC 205A Report (published 2010) ■First interference cases reported ■Smart meter roll-out / Cost benefit analysis ■PLC CENELEC A-band = 3-95 kHz (EN 50065) ■Static meter metrology issue ■Energy efficiency requirements and distributed energy resources lead to massive introduction of ■Power Electronics ■Active Infeed Converters …","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126656671","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"ANSI C63.25.1 Validation Methods for Radiated Emission Test Sites","authors":"Zhong Chen","doi":"10.1109/emcsi.2018.8495194","DOIUrl":"https://doi.org/10.1109/emcsi.2018.8495194","url":null,"abstract":"Two documents to cover site validations •C63.25.1 (> 1000 MHz). The main contribution is Time Domain Site VSWR method as an alternative to CISPR 16 SVSWR method •C63.25.2 (30 – 1000 MHz) to include a stand-alone NSA. Moving any site validation requirements in C63.4/C63.4a and C63.5 to this document","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124380311","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Utilizing Reverberation Chambers as a Versatile Test Environment for Assessing the Performance of Components and Systems","authors":"D. Lewis","doi":"10.1109/emcsi.2018.8495191","DOIUrl":"https://doi.org/10.1109/emcsi.2018.8495191","url":null,"abstract":"Electromagnetic reverberation chambers have been used for many years by the Electromagnetic Compatibility (EMC) community to measure the susceptibility and emissions for various electronic components and systems. This presentation describes how statistical processes were used to reduce the uncertainty of these chambers to a level necessary for precision metrology applications. These processes were applied to the calibration of electromagnetic field probes and the assessment of antenna efficiencies. A brief comparison of traditional calibration methods employing transverse electromagnetic (TEM) cells and anechoic chambers to the new statistical reverberant environment will be shown.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123500392","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Human Exposure Design Considerations For Machine Directed Microwave Dryers For Drying Ink On Paper Webs For The Inkjet Printing Industry","authors":"D. Norte","doi":"10.1109/EMCSI.2018.8495444","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495444","url":null,"abstract":"The use of microwave energy at 2.45GHz for dielectric heating purposes is well known, and is the technology used within microwave ovens that are found in millions of homes. In addition, the use of microwave energy for industrial drying applications, such as drying wood and drying slices of potatoes for producing potato chips, for example, has been demonstrated [1]–[2]. However, it is also of interest to consider the use of microwave energy for drying other kinds of loads, such as inks on moving paper webs which are encountered within the inkjet printing industry. This paper addresses human exposure design considerations for a microwave dryer that is designed for drying ink on a fast moving paper web. The microwave dryer is comprised of several WR340 waveguides that are placed side-by-side, such that the broad sides of each waveguide are shared by adjacent waveguides. Slots must be supported by each waveguide to enable the paper web to pass through the dryer, and to support the drying process, while not causing the propagating E-field inside the dryer to collapse. Due to the potential fluttering of the propagating paper web within the dryer, the heights of the input and output slots that enable the paper to enter and exit the dryer cannot be arbitrarily small, while the need for ambient air to flow into the dryer also places constraints on the geometrical sizes of other apertures. Two-dimensional FDTD simulations of the dryer are used to estimate the performance of the microwave dryer from a human exposure perspective that leads to some novel structures of RF chokes that can be used to meet a 5mW/cm2emissions limit for controlled exposure, 5cm from the equipment, while also contributing to the drying process. These chokes are based upon the use of carbon materials. The proposed RF chokes can produce attenuation levels between 8.1dB and 45.8dB, depending upon their construction.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123605058","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"The Evolution of PEEC Methods for SI, PI, and Antennas","authors":"Lijun Jiang, A. Ruehli","doi":"10.1109/EMCSI.2018.8495369","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495369","url":null,"abstract":"","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125498952","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Acquiring Test Equipment & Developing a Low-Cost EMC Troubleshooting Kit","authors":"P. André, K. Wyatt","doi":"10.1109/EMCSI.2018.8495161","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495161","url":null,"abstract":"","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125687821","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}