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2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)最新文献

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Changes to ISO/IEC 17025:2017 A High-Level Overview ISO/IEC 17025:2017高级概述的变化
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495250
Trace McInturff
{"title":"Changes to ISO/IEC 17025:2017 A High-Level Overview","authors":"Trace McInturff","doi":"10.1109/EMCSI.2018.8495250","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495250","url":null,"abstract":"","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130994084","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEC View of Transient Immunity Testing IEC暂态抗扰度测试的观点
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/emcsi.2018.8495391
T. Braxton
{"title":"IEC View of Transient Immunity Testing","authors":"T. Braxton","doi":"10.1109/emcsi.2018.8495391","DOIUrl":"https://doi.org/10.1109/emcsi.2018.8495391","url":null,"abstract":"","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128108708","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Measurement and Evaluation of the Conducted Emissions of a DC/DC Power Converter in the Frequency Range 2–150 kHz 2 - 150khz范围内DC/DC功率变换器传导辐射的测量与评价
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495199
L. Sandrolini, David W. P. Thomas, M. Sumner, C. Rose
{"title":"Measurement and Evaluation of the Conducted Emissions of a DC/DC Power Converter in the Frequency Range 2–150 kHz","authors":"L. Sandrolini, David W. P. Thomas, M. Sumner, C. Rose","doi":"10.1109/EMCSI.2018.8495199","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495199","url":null,"abstract":"In this paper the conducted emissions generated by a DC/DC power converter system in the 2–150 kHz frequency range are studied in both time and frequency domains. Measurement and evaluation of the conducted emissions are carried out to assess the level of the emissions of the system with reference to the existing standards and to point out which measurement settings may have an impact on the measurement results. A prototype of a DC/DC battery charger for electric vehicles was used in the experiments. The results show that the DC/DC power converter system may not result in being compliant to some of the existing standards in the frequency range 2–150 kHz and that measurement settings may affect significantly the evaluation of the conducted emissions_","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131668084","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Influence of Higher-order Modes in Coaxial Waveguide on Measurements of Material Parameters 同轴波导中高阶模对材料参数测量的影响
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495305
D. Petrov, K. Rozanov, M. Koledintseva
{"title":"Influence of Higher-order Modes in Coaxial Waveguide on Measurements of Material Parameters","authors":"D. Petrov, K. Rozanov, M. Koledintseva","doi":"10.1109/EMCSI.2018.8495305","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495305","url":null,"abstract":"The use of a coaxial air-filled line as a test fixture for measuring complex permittivity and permeability often shows odd resonance-like behavior of material parameters as functions of frequency. This effect is typically either ascribed to the half-wavelength resonance at the sample length, or erroneously misinterpreted as intrinsic resonance behavior of the material. However, as is shown in this paper, such behavior can be attributed to excitation of the higher-order modes on the surface of the sample resulting in resonance absorption of electromagnetic energy in the test fixture. Herein, analytical, numerical, and experimental results show that there can actually be a significant impact of higher-order modes in a coaxial line on the extracted constitutive material parameters of samples.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134315579","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 13
Differential Integrated Crosstalk Noise (ICN) Mitigation in the Pin Field Area of SerDes Channel SerDes通道引脚区差分积分串扰噪声(ICN)抑制
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495419
Bichen Chen, Junda Wang, Y. S. Cao, Muqi Ouyang, Yansheng Wang, Shuai Jin, G. Shen, Xusheng Liu, Xiping Peng, J. Fan
{"title":"Differential Integrated Crosstalk Noise (ICN) Mitigation in the Pin Field Area of SerDes Channel","authors":"Bichen Chen, Junda Wang, Y. S. Cao, Muqi Ouyang, Yansheng Wang, Shuai Jin, G. Shen, Xusheng Liu, Xiping Peng, J. Fan","doi":"10.1109/EMCSI.2018.8495419","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495419","url":null,"abstract":"The integrated crosstalk noise (ICN) has been widely used as an alternative to the insertion crosstalk ratio (ICR) for channel crosstalk evaluation in the IEEE 802.3ba standard. In this work, the differential ICN mitigation scheme by using idea of orthogonality is implemented in two adjacent differential pairs first. In the full pin map area of SerDes channel, new pin map patterns based on such scheme are prosed and compared with the conventional pan map patterns. The new pin maps mitigate the differential ICN drastically, yet maintain the G:s ratio. A preliminary study is conducted on fan-out trace routing to maintain the benefit from new pin map patterns.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134417846","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Power and Signal Integrity Findings in a FPGA Layout for an Aerospace Application 用于航空航天应用的FPGA布局中的电源和信号完整性研究
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495292
R. Perez
{"title":"Power and Signal Integrity Findings in a FPGA Layout for an Aerospace Application","authors":"R. Perez","doi":"10.1109/EMCSI.2018.8495292","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495292","url":null,"abstract":"Design principles concerning the use of FPGA are of particular importance in aerospace applications since the neglect of such design principles can cause catastrophic effects in aerospace system, as it will be explainedin this paper. FPGA design rules such as power conditioning and signal integrity for properly interfacing high speed FPGA with its interface circuits are discussed in this paper as it relates to aerospace systems. Signal integrity to avoid crosstalk within a FPGA has not been a great concern because most of the attention over the years had been on signal integrity at the PCB level. However, this paper shows a real example of crosstalk within a FPGA in an aerospace application.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133383394","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Workshop WED-PM-5 Behavior of a Collection of Computers With Respect to the Three-Phase Supplying Network 车间WED-PM-5三相供电网络下计算机群的行为
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495442
I. Nicolae
{"title":"Workshop WED-PM-5 Behavior of a Collection of Computers With Respect to the Three-Phase Supplying Network","authors":"I. Nicolae","doi":"10.1109/EMCSI.2018.8495442","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495442","url":null,"abstract":"In three-phase systems, ensembles of loads in different connections across phases (when considering their number and power-related weights), can produce significant non-symmetries, affecting the voltages from the connection point.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133935921","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Responses of Twisted-Wire Pairs with and without Dielectric Coatings in the Presence of High-Power Electromagnetic Pulses (HP-EMP) 带和不带介质涂层的双绞线对在大功率电磁脉冲(HP-EMP)作用下的响应
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495403
He-Qing Zou, Hao Xie, Ya-Zhou Cherr, Kai-Qi Xiao, Jixin Chen, Yan-Yan Zhang, W. Yin
{"title":"Responses of Twisted-Wire Pairs with and without Dielectric Coatings in the Presence of High-Power Electromagnetic Pulses (HP-EMP)","authors":"He-Qing Zou, Hao Xie, Ya-Zhou Cherr, Kai-Qi Xiao, Jixin Chen, Yan-Yan Zhang, W. Yin","doi":"10.1109/EMCSI.2018.8495403","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495403","url":null,"abstract":"Induced responses of twisted-wire pairs with and without dielectric coatings are studied in this paper for different incident directions of the high-power electromagnetic pulses (HP-EMP), which can be fast-, medium-, and slow-EMP described by double-exponential function or even ultra-wideband triple-exponential function. 1-D finite-difference time-domain (FDTD) method is implemented for our simulation. This study should be useful for the development of certain protection technique for suppressing these intentional electromagnetic interference (IEMI) effects effectively.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127746770","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A Study of CPU Pinout for Density and Its Application CPU引脚密度的研究及其应用
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495252
Karen Navarro, R. Enriquez, A. Cueva, Clemens Thielen, B. Garcia, H. Peng
{"title":"A Study of CPU Pinout for Density and Its Application","authors":"Karen Navarro, R. Enriquez, A. Cueva, Clemens Thielen, B. Garcia, H. Peng","doi":"10.1109/EMCSI.2018.8495252","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495252","url":null,"abstract":"This work introduces 3 new patterns for efficient DDR interconnection. The patterns are optimized for implementation where the number of package pins is limited. For all cases, the industry specifications are fullfiled.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127928145","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Unique Applications of Time-Reversed Electromagnetic Waves 时间反转电磁波的独特应用
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495195
S. Anlage
{"title":"Unique Applications of Time-Reversed Electromagnetic Waves","authors":"S. Anlage","doi":"10.1109/EMCSI.2018.8495195","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495195","url":null,"abstract":"This article consists only of a collection of slides from the author's conference presentation.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117077826","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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