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2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)最新文献

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Tunable Intermodulation Generator for Passive Intermodulation Tester Calibration 用于无源互调测试仪校准的可调谐互调发生器
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495394
Xiong Chen, Yong-ning He, W. Cui, D. Pommerenke, J. Fan
{"title":"Tunable Intermodulation Generator for Passive Intermodulation Tester Calibration","authors":"Xiong Chen, Yong-ning He, W. Cui, D. Pommerenke, J. Fan","doi":"10.1109/EMCSI.2018.8495394","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495394","url":null,"abstract":"As a key step to guarantee passive intermodulation (PIM) test accuracy, PIM calibration for PIM tester draws great attention these days. This paper provides three solutions to realize tunable PIM calibration standard sources for PIM tester calibration. Two types of nonlinearity sources are applied while three circuit or cavity structures are developed to control these sources. By using different strategies, the proposed PIM sources can generate controllable PIM references with different ranges that cover most PIM test ranges. In the experiments, the PIM signal stability is evaluated as well as PIM dynamic range. They show the minimal PIM fluctuation as less as 1dB, while the maximal dynamic range can reach 50dB. As these solutions have various sizes and function, they can be utilized according to different test requirements and easily integrated with PIM tester. These solutions can help develop new generation of PIM testers.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134534839","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Absorbing Materials-Reverberation Chamber Assessments 吸收材料-混响室评估
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495313
C. Bunting
{"title":"Absorbing Materials-Reverberation Chamber Assessments","authors":"C. Bunting","doi":"10.1109/EMCSI.2018.8495313","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495313","url":null,"abstract":"","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116072105","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
An Analysis of Reverberation Chamber Testing as a Radiation Problem 作为辐射问题的混响室测试分析
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495288
J. West, Charles F. Buntling
{"title":"An Analysis of Reverberation Chamber Testing as a Radiation Problem","authors":"J. West, Charles F. Buntling","doi":"10.1109/EMCSI.2018.8495288","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495288","url":null,"abstract":"The statistics of the currents excited on a reverber-ent equipment-under-test (EUT) placed in a reverberation chamber field are evaluated by considering the free-space radiation properties of the EUT. It is first shown that the statistics of the induced current at a single frequency at an arbitrary EUT test point can be found directly from the input impedance presented by the EUT at the test point at that frequency, independent of the physical loading that is placed across the test point. The results are then extended to incorporate the effects of frequency stirring on the overall current statistics. The analytical results are validated by numerically modeling a standard nested-cavity reverberation chamber test.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116817630","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Radiated Emissions 辐射排放
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/emcsi.2018.8495390
C. Lam
{"title":"Radiated Emissions","authors":"C. Lam","doi":"10.1109/emcsi.2018.8495390","DOIUrl":"https://doi.org/10.1109/emcsi.2018.8495390","url":null,"abstract":"","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126046638","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Incorporating Backchannel Training into Signal Integrity SerDes Compliance 将反信道训练整合到信号完整性服务中
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495190
David Choe, K. Willis
{"title":"Incorporating Backchannel Training into Signal Integrity SerDes Compliance","authors":"David Choe, K. Willis","doi":"10.1109/EMCSI.2018.8495190","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495190","url":null,"abstract":"Performed automatically by SerDes hardware, backchannel training is an essential part of signal quality in high performance serial link interfaces. Until recently, there has been no standard way to model this behavior in serial link simulations with commercial tools. But recent enhancements to the upcoming IBIS standard now support backchannel training, enabling IBIS-AMI models to emulate this real-world SerDes behavior. Signal integrity simulations will now have the ability to incorporate backchannel algorithms into their IBIS-AMI models, automating the optimization of transmitter and receiver equalization settings in the same manner as their actual SerDes hardware devices. This will save system designers significant time by avoiding a multitude of computationally intensive sweeping in order to determine optimum equalization settings for their link, while at the same time yielding more realistic and higher quality results that are more consistent with the hardware they seek to model.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123679689","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Convergence-Accelerated Foster-Type Network Model for Skin and Proximity Effect in Arbitrarily Shaped Parallel Conductors 任意形状并联导体中趋肤效应和接近效应的收敛加速培育型网络模型
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495223
C. Bednarz, M. Leone
{"title":"Convergence-Accelerated Foster-Type Network Model for Skin and Proximity Effect in Arbitrarily Shaped Parallel Conductors","authors":"C. Bednarz, M. Leone","doi":"10.1109/EMCSI.2018.8495223","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495223","url":null,"abstract":"A broadband Foster-type circuit model for skin and proximity effects in arbitrarily shaped parallel conductors is presented. Based on a quasistatic partial element equivalent circuit approach a modal multiport circuit is derived with minimal computational effort, offering fast convergence and inherent stability for time-domain simulations with arbitrary active/passive non-linear loads. The model order can be estimated rigorously for a given frequency range. The proposed model is validated in the frequency and time domain.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125569383","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
EMC for E-mobility FR-PM-1-4 E-mobility的EMC FR-PM-1-4
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/emcsi.2018.8495393
W. Radasky, J. Delaballe, J. Barenfanger
{"title":"EMC for E-mobility FR-PM-1-4","authors":"W. Radasky, J. Delaballe, J. Barenfanger","doi":"10.1109/emcsi.2018.8495393","DOIUrl":"https://doi.org/10.1109/emcsi.2018.8495393","url":null,"abstract":"Outline ■IEC bodies involved ■Situation regarding EMC standards ■Main items covered by the standards ■Ongoing work in IEC CISPR/B ■The role of ACEC","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125647456","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Electromagnetic Compatibility Analysis Using Embedded Domain Decomposition Method 基于嵌入式域分解方法的电磁兼容性分析
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495215
Jiaqing Lu, Jin-Fa Lee
{"title":"Electromagnetic Compatibility Analysis Using Embedded Domain Decomposition Method","authors":"Jiaqing Lu, Jin-Fa Lee","doi":"10.1109/EMCSI.2018.8495215","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495215","url":null,"abstract":"A finite element based embedded domain decomposition method (DDM) is introduced herein for electromagnetic compatibility (EMC) analysis. In the method, we decompose a computational domain into a background subdomain and several embedded subdomains. Information exchange between the subdomains are addressed in their shared regions, including four ingredients: field continuity, material difference, perfect electrical conductor (PEC), and port. The proposed method allows for completely nonconformal sub domains, thus offering great flexibility for the modeling and design in EMC and signal integrity applications.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125665754","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Circuit Field Coupling Model of ESD Setup for Automotive Testing 汽车测试ESD装置的电路场耦合模型
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495219
I. Oganczova, R. Kado, Z. Kutchadze, G. Gabriadze, R. Jobava
{"title":"Circuit Field Coupling Model of ESD Setup for Automotive Testing","authors":"I. Oganczova, R. Kado, Z. Kutchadze, G. Gabriadze, R. Jobava","doi":"10.1109/EMCSI.2018.8495219","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495219","url":null,"abstract":"In this paper, we demonstrate the circuit representation of the field coupled ESD setup for automotive testing according to ISO 10605. The circuit model consists of parasitic lumped elements, extracted from the test setup by 3D quasi-static field solvers. For ESD testing, an equivalent model of the setup is incorporated into circuit model of device under test and working conditions are monitored by means of levels of transient currents and voltages in the system.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130326607","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
An Overview of Wide Bandgap Power Semiconductor Device Packaging Techniques for EMI Reduction 用于降低电磁干扰的宽带隙功率半导体器件封装技术综述
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495171
Boyi Zhang, Shuo Wang
{"title":"An Overview of Wide Bandgap Power Semiconductor Device Packaging Techniques for EMI Reduction","authors":"Boyi Zhang, Shuo Wang","doi":"10.1109/EMCSI.2018.8495171","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495171","url":null,"abstract":"Wide band gap (WBG) power semiconductor devices have been increasingly desirable due to their superior characteristics compared to their Si counterparts. However, their faster switching speed and abilities to operate at higher frequency than Si devices have brought new challenges, among which Electromagnetic interference (EMI) issue is one of the major concerns. EMI issues in WBG device applications had been reported in many papers. However, package layout determined characteristics has not yet been connected to electromagnetic compliance (EMC) analysis. In this paper, characteristics of WBG power devices as EMI noise sources are investigated, package design considerations that could reduce EMI are reviewed.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130391252","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 16
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