2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems最新文献_第3页

Reliability of semiconductor devices - The need for simulation 半导体器件的可靠性-模拟的需要

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2011-04-18 DOI: 10.1109/ESIME.2011.5765861

W. Kanert

引用次数: 1

Thermo-mechanical assessment of solar cell displacement with respect to the viscoelastic behaviour of the encapsulant 太阳能电池位移与包封剂粘弹性行为的热力学评估

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2011-04-18 DOI: 10.1109/ESIME.2011.5765831

M. Pander, S. Dietrich, S. Schulze, U. Eitner, M. Ebert

引用次数: 20

A model for static and dynamic thermal analysis of thin film MEMS structures including the thermal conductivity of the surrounding gas 薄膜MEMS结构的静态和动态热分析模型，包括周围气体的热导率

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2011-04-18 DOI: 10.1109/ESIME.2011.5765809

G. de Graaf, Huaiwen Wu, R. Wolffenbuttel

引用次数: 0

Design of athermalized proximity coupled (APC) synthetic green laser opto-electronic package for microprojector displays: Numerical modeling and experiments 微投影仪显示用热化接近耦合(APC)合成绿色激光光电封装设计:数值模拟与实验

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2011-04-18 DOI: 10.1109/ESIME.2011.5765761

S. Chaparala, V. Bhagavatula, J. Himmelreich

{"title":"Design of athermalized proximity coupled (APC) synthetic green laser opto-electronic package for microprojector displays: Numerical modeling and experiments","authors":"S. Chaparala, V. Bhagavatula, J. Himmelreich","doi":"10.1109/ESIME.2011.5765761","DOIUrl":"https://doi.org/10.1109/ESIME.2011.5765761","url":null,"abstract":"Micro-projector based displays are proposed for information display for a number of consumer devices. These displays would provide larger images than existing fixed Liquid crystal displays. The two major components of micro-projector technology are the Light source and the Imaging technology. Three primary colors, red, blue and green are required to create full color images. The light sources in the projection technology would be semiconductor devices that emit these colors. These devices could be either light emitting diodes (LEDs) or lasers. To enable the laser based projection technology, red and blue lasers are commerically available. Native semiconductor green lasers are still in development. As an alternative, synthetic green light can be produced by passing 1060nm infra-red light emitted from a GaAs based semiconductor laser diode (LD) through second harmonic generation (SHG) crystal, thereby emitting the green light at 530 nm. The current research work proposes bringing the SHG structure in close proximity to the LD, thereby eliminating the use of any optics in between. The proximity coupling approach promises to reduce the number of package components and process cost significantly. This paper presents the mechanical package design, coefficient of thermal expansion based displacement estimates, thermal analysis wherein the thermal impedance is predicted and measured, thermo-mechanical analysis wherein the thermo-mechanical stresses and strains are predicted. Shock modeling has been done to understand the displacements of the waveguides during the shock event. Optical modeling is performed to estimate the coupling efficiency change as a function of lateral and longitudinal offset between the LD and SHG waveguides. Finally, an assembled package that generated green light using this design is presented.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130332747","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Developing the mesoscale stress-strain curve to failure 建立破坏的中尺度应力-应变曲线

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2011-04-18 DOI: 10.1109/ESIME.2011.5765759

N. Iwamoto

引用次数: 8

Degradation of epoxy lens materials in LED systems 环氧透镜材料在LED系统中的降解

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2011-04-18 DOI: 10.1109/ESIME.2011.5765850

S. Koh, W. V. Driel, Guoqi Zhang

{"title":"Degradation of epoxy lens materials in LED systems","authors":"S. Koh, W. V. Driel, Guoqi Zhang","doi":"10.1109/ESIME.2011.5765850","DOIUrl":"https://doi.org/10.1109/ESIME.2011.5765850","url":null,"abstract":"Due to their long lifetime and high efficacy, solid state lighting (SSL) has the potential to revolutionize the illumination industry. The long lifetime claimed by the manufacturers is often based solely on the estimated depreciation of lumen for a single LED operating at 25°C. However, self heating and high environmental temperature which will lead to increased junction temperature and degradation due to electrical overstress can shorten the life of light emitting diode. Furthermore, each SSL system includes different components such as the optical part, electrical driver and interconnections. The failure/degradation of any components wills severely affects the performance and reliability of whole system and hence the weakest component will become the bottleneck for the reliability and lifetime of the module. Literature reviews of the factors influencing the life of LED lamps identified the degradation of the epoxy lens and plastic package due to the junction temperature and voltages as one of the common failure mode. In this research, a methodology to predict the degradation of the epoxy lens has been proposed. In order to correlate the mean time to failure as a function of the junction temperature and the inputted voltage, the simplified Eyring models had been proposed in this research. Since the life of a SSL system is subjected to varying loading condition, another objectives of this research is to present a methodology to predict the life of a SSL under changing condition.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128504934","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 21

Heat sink design for optimal thermal management 散热器设计为最佳的热管理

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2011-04-18 DOI: 10.1109/ESIME.2011.5765813

D. Hofinger, M. Jungwirth, H. Pflugelmeier, A. Eder

引用次数: 1

A multi-scale approach to the thermo-mechanical behaviour of silica-filled epoxies for electronic packaging 电子封装用硅填充环氧树脂热机械性能的多尺度方法

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2011-04-18 DOI: 10.1109/ESIME.2011.5765792

E. Weltevreden, M. Erinc, S. Tesarski, A. Wymyslowski, A. Mavinkurve, A. Giele

引用次数: 4

Study on passive micro direct methanol fuel cell 被动式微型直接甲醇燃料电池的研究

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2011-04-18 DOI: 10.1109/ESIME.2011.5765778

Cao Yi-jiang, Yufeng Zhang, Xu Biao, Y. Jinghua, Xiaowei Liu

{"title":"Study on passive micro direct methanol fuel cell","authors":"Cao Yi-jiang, Yufeng Zhang, Xu Biao, Y. Jinghua, Xiaowei Liu","doi":"10.1109/ESIME.2011.5765778","DOIUrl":"https://doi.org/10.1109/ESIME.2011.5765778","url":null,"abstract":"In order to overcome the disadvantages of low mass transport efficiency of oxygen to the cathode and poor performance of passive micro direct methanol fuel cells (DMFC), the structures of the cathode current collector for the passive micro DMFC have been studied. The passive micro DMFC employing the cathode current collector with the planar perforated-plate structure has been fabricated. The effect of the anode methanol concentration and the opening area ratio of the cathode on the performance has been investigated. Owing to the influence of contact resistance and oxygen mass transport, the passive micro DMFC exhibits the optimal performance when opening ratio is 50%. Furthermore, the new parallel channels structure of the cathode current collector has been proposed, and the corresponding passive micro DMFC has also been fabricated by utilizing micro precision processing technology. The test results indicate that the mass transfer of oxygen and performance stability have been improved based on the cathode current collector with the parallel channels structure compared to the conventional planar structure. Moreover, a maximum output power density of 9.7 mW/cm2 is achieved. The above studies might be helpful for the developing and application of portable micro power systems.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127185696","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

FE modeling of Cu wire bond process and reliability 铜丝键合过程的有限元建模及可靠性研究

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2011-04-18 DOI: 10.1109/ESIME.2011.5765789

C. Yuan, E. Weltevreden, Pieter van dan Akker, R. Kregting, J. de Vreugd, G. Zhang

引用次数: 6