电子封装用硅填充环氧树脂热机械性能的多尺度方法

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2011-04-18 DOI:10.1109/ESIME.2011.5765792

E. Weltevreden, M. Erinc, S. Tesarski, A. Wymyslowski, A. Mavinkurve, A. Giele

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引用次数: 4

摘要

在不同的应用领域，配对接口的分层会导致严重的可靠性问题。分层的原因是多方面的。在基于引线框架的芯片封装的情况下，一个关键的接口是引线框架和成型化合物之间的接口。分层可以放大界面上的应力水平，并可能导致互连的疲劳。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A multi-scale approach to the thermo-mechanical behaviour of silica-filled epoxies for electronic packaging

Delamination of mating interfaces can cause serious reliability problems in different application areas. The causes of delamination are multiple. In the case of leadframe-based chip packages, a critical interface is that between the leadframe and the moulding compound. Delamination can magnify stress levels at the interface and can lead to fatigue of interconnects.

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来源期刊

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

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