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2013 3rd IEEE CPMT Symposium Japan最新文献

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Development of a chip prober for pre-bond testing of a 3D-IC 用于3d集成电路键合前测试的芯片探针的开发
2013 3rd IEEE CPMT Symposium Japan Pub Date : 2013-11-01 DOI: 10.1109/ICSJ.2013.6756082
N. Watanabe, M. Suzuki, M. Aoyagi, Michiyuki Eto, K. Kawano
{"title":"Development of a chip prober for pre-bond testing of a 3D-IC","authors":"N. Watanabe, M. Suzuki, M. Aoyagi, Michiyuki Eto, K. Kawano","doi":"10.1109/ICSJ.2013.6756082","DOIUrl":"https://doi.org/10.1109/ICSJ.2013.6756082","url":null,"abstract":"We developed a novel chip prober with a transparent membrane probe card for chip-level pre-bond testing of a three-dimensional integrated circuit. In the case of this chip prober, it was possible to achieve a uniform probing by using a parallelism-adjustment system with 3-point support. In addition, it was possible to achieve a small-gap alignment between the probe card and the tested chip by the precise control of the XYZθ stage and the transparency of the probe card. Thus, a high probing accuracy of ±2-3 μm was realized. A transparent membrane probe card was fabricated using a polyethylene naphthalate (PEN) film by through-holes formation with a UV-YAG laser beam, backside electrode formation, Ti-Au wiring formation, and Ni-Au contact bump formation. Owing to the deformation of the PEN film during probing, low-load probing (0.61 gf/pin) was realized. By using this chip prober, we could successfully conduct pre-bond testing of an SRAM/flash memory chip even when the chip was thinned down to 50 μm.","PeriodicalId":101667,"journal":{"name":"2013 3rd IEEE CPMT Symposium Japan","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131843824","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Direct bonding of PEN at room temperature by means of surface activated bonding method using nano-adhesion layer 采用纳米粘接层表面活化法，在室温下直接粘接PEN
2013 3rd IEEE CPMT Symposium Japan Pub Date : 2013-11-01 DOI: 10.1109/ICSJ.2013.6756120
T. Matsumae, M. Fujino, T. Suga
{"title":"Direct bonding of PEN at room temperature by means of surface activated bonding method using nano-adhesion layer","authors":"T. Matsumae, M. Fujino, T. Suga","doi":"10.1109/ICSJ.2013.6756120","DOIUrl":"https://doi.org/10.1109/ICSJ.2013.6756120","url":null,"abstract":"We realized the room temperature direct bonding method for polyethylene 2, 6 naphthalene dicarboxylate (polyethylene naphthalate, PEN) film by means of surface activated bonding method using nano-adhesion layer.","PeriodicalId":101667,"journal":{"name":"2013 3rd IEEE CPMT Symposium Japan","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132404656","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
A numerical model for bottom-up copper electrodeposition of TSV with additives 有添加剂的TSV自下而上铜电沉积的数值模型
2013 3rd IEEE CPMT Symposium Japan Pub Date : 2013-11-01 DOI: 10.1109/ICSJ.2013.6756083
Wei-Xiong Luo, Xue Feng, Liming Gao, Ming Li
{"title":"A numerical model for bottom-up copper electrodeposition of TSV with additives","authors":"Wei-Xiong Luo, Xue Feng, Liming Gao, Ming Li","doi":"10.1109/ICSJ.2013.6756083","DOIUrl":"https://doi.org/10.1109/ICSJ.2013.6756083","url":null,"abstract":"The kinetics which explained the copper Superfilling by electrodeposition was investigated since the copper electrodeposition became the standard technique for TSV. In order to interpret the bottom-up Superfilling process conveniently and exactly, a numerical model focused on the mass which can make the copper deposition in the via is built. This model only considered the effect of accelerator and cupric which directly affect the electrodeposition velocity in the via. The effect of two species in the numerical model is represented to two reaction constants kr and kA. Both of two constants are the compound parameters including desorption, adsorption and reaction of deposition mass. Experimental electrodeposition of variable dimension via is used to verify the accuracy of a numerical model. The results show that the model can demonstrate the electrodeposition process of via which is 50μm in diameter.","PeriodicalId":101667,"journal":{"name":"2013 3rd IEEE CPMT Symposium Japan","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122356194","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Optical multi-channel connector for rigid waveguide and fiber connection 用于刚性波导和光纤连接的光多通道连接器
2013 3rd IEEE CPMT Symposium Japan Pub Date : 2013-11-01 DOI: 10.1109/ICSJ.2013.6756096
Kazumi Nakazuru, Masatoshi Tsunoda, Naoki Takahashi, Satoshi Asai, T. Matsubara
{"title":"Optical multi-channel connector for rigid waveguide and fiber connection","authors":"Kazumi Nakazuru, Masatoshi Tsunoda, Naoki Takahashi, Satoshi Asai, T. Matsubara","doi":"10.1109/ICSJ.2013.6756096","DOIUrl":"https://doi.org/10.1109/ICSJ.2013.6756096","url":null,"abstract":"We propose a newly developed optical multi-channel card edge connector to connect a rigid optical waveguide array fabricated onto a substrate and an optical fiber array for an on-board optical interconnection. The receptacle is placed at the edge of the waveguide and is mechanically aligned to alignment studs directly formed precisely onto the optical waveguide. The plug terminates the optical fiber ribbon using a plastic ferrule, and the ferrule is pushed to the end face of the waveguide using springs for physical contact. The plug is inserted into the housing and is latched by a single action. The connection losses of 12 channel optical card edge connector are 0.8 dB on the waveguide in the GI-50/125 fiber direction, and 1.1 dB on the fiber in the waveguide direction.","PeriodicalId":101667,"journal":{"name":"2013 3rd IEEE CPMT Symposium Japan","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125551974","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Organic-inorganic hybrid material for on-board optical interconnets and its application in optical coupling 机载光互连用有机-无机杂化材料及其在光耦合中的应用
2013 3rd IEEE CPMT Symposium Japan Pub Date : 2013-11-01 DOI: 10.1109/ICSJ.2013.6756099
H. Nawata
{"title":"Organic-inorganic hybrid material for on-board optical interconnets and its application in optical coupling","authors":"H. Nawata","doi":"10.1109/ICSJ.2013.6756099","DOIUrl":"https://doi.org/10.1109/ICSJ.2013.6756099","url":null,"abstract":"We have developed an organic-inorganic hybrids material having a high thermal stability and low optical loss for telecommunication wavelength. The material is designed to solvent less resin, which is free radical curable with heating 150 °C or UV exposure at room temperature. We have demonstrated to fabricate optical pillar as a method of optical coupling for optical interconnects. Also we have demonstrated to fabricate self-written waveguide and micro lens array.","PeriodicalId":101667,"journal":{"name":"2013 3rd IEEE CPMT Symposium Japan","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129840966","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 14
Influence of diffusion on solid-state bonding for micro-bumps at low temperatures 低温下扩散对微凸点固相结合的影响
2013 3rd IEEE CPMT Symposium Japan Pub Date : 2013-11-01 DOI: 10.1109/ICSJ.2013.6756117
Yinghui Wang, T. Suga
{"title":"Influence of diffusion on solid-state bonding for micro-bumps at low temperatures","authors":"Yinghui Wang, T. Suga","doi":"10.1109/ICSJ.2013.6756117","DOIUrl":"https://doi.org/10.1109/ICSJ.2013.6756117","url":null,"abstract":"The influence of diffusion on bonding micro-bumps at low temperatures in solid state was studied. The contamination was detected to act as a barrier layer on diffusion during bonding. The diffusion between Au and Sn occurred even at low temperatures by performing surface activation process before bonding and was effective on improving the bonding quality. The increase of bonding strengths of Au-to-Au micro-bumps were slow followed with bonding time, which appeared a logarithmic rate law. 100% bond yield was achieved and the die shear strength was higher than 10 MPa at low temperatures by performing surface activation process before bonding.","PeriodicalId":101667,"journal":{"name":"2013 3rd IEEE CPMT Symposium Japan","volume":"72 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121279605","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
High-speed transmission copper cable for 25Gbit/s/lane 25Gbit/s/lane高速传输铜线
2013 3rd IEEE CPMT Symposium Japan Pub Date : 2013-11-01 DOI: 10.1109/ICSJ.2013.6756085
Takahiro Sugiyama, H. Nonen, Izumi Fukasaku, Hiroshi Ishikawa, T. Kumakura
{"title":"High-speed transmission copper cable for 25Gbit/s/lane","authors":"Takahiro Sugiyama, H. Nonen, Izumi Fukasaku, Hiroshi Ishikawa, T. Kumakura","doi":"10.1109/ICSJ.2013.6756085","DOIUrl":"https://doi.org/10.1109/ICSJ.2013.6756085","url":null,"abstract":"The conventional copper cable has the intra-pair skew about 10ps/m, and it makes using the copper cable for the 25Gbit/s/lane difficult. For the purpose of reducing intra-pair skew, we analyzed the generation factor of the intra-pair skew about some cables. For this analysis, we converted the S-parameters of cables into the impulse responses and the step responses of each mode. As a result, in the conventional copper cable, it became clear that the intra-pair skew was caused by the propagation time difference between differential mode and common mode, and that the reduction of the intra-par skew is difficult structurally. On the other hand, the new structure cable, “OMNIBIT®”, which has one batch extruded insulator covering two wires, does not have the propagation time difference between differential mode and common mode. It was confirmed that the new structure was hardly to increase the intra-pair skew structurally. As a result of the trial manufacturing with the new structure cable, it was confirmed that the intra-pair skew was less than or equal to 6ps/m.","PeriodicalId":101667,"journal":{"name":"2013 3rd IEEE CPMT Symposium Japan","volume":"173 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121329652","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Failure analysis of electric circuit board by high resolution magnetic field microscopy 电路板的高分辨磁场显微镜失效分析
2013 3rd IEEE CPMT Symposium Japan Pub Date : 2013-11-01 DOI: 10.1109/ICSJ.2013.6756129
Y. Mima, K. Kimura, T. Inao, N. Oyabu, Noriaki Kimura
{"title":"Failure analysis of electric circuit board by high resolution magnetic field microscopy","authors":"Y. Mima, K. Kimura, T. Inao, N. Oyabu, Noriaki Kimura","doi":"10.1109/ICSJ.2013.6756129","DOIUrl":"https://doi.org/10.1109/ICSJ.2013.6756129","url":null,"abstract":"In this paper, we demonstrate various electric current imaging using electromagnetic field reconstruction method, and show its capability of reducing stray magnetic field effect.","PeriodicalId":101667,"journal":{"name":"2013 3rd IEEE CPMT Symposium Japan","volume":"338 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131556546","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
A 25 Gb/s × 4-ch, 8 × 8 mm small size optical transceiver module for optical interconnection 25gb /s × 4ch, 8 × 8mm小尺寸光模块，用于光互连
2013 3rd IEEE CPMT Symposium Japan Pub Date : 2013-11-01 DOI: 10.1109/ICSJ.2013.6756089
N. Matsushima, N. Chujo, T. Takai, T. Yazaki, D. Kawamura, Y. Matsuoka, Yong Lee, H. Yamashita, T. Takemoto, H. Arimoto, Y. Ishigami, K. Yamazaki, Y. Sunaga
{"title":"A 25 Gb/s × 4-ch, 8 × 8 mm small size optical transceiver module for optical interconnection","authors":"N. Matsushima, N. Chujo, T. Takai, T. Yazaki, D. Kawamura, Y. Matsuoka, Yong Lee, H. Yamashita, T. Takemoto, H. Arimoto, Y. Ishigami, K. Yamazaki, Y. Sunaga","doi":"10.1109/ICSJ.2013.6756089","DOIUrl":"https://doi.org/10.1109/ICSJ.2013.6756089","url":null,"abstract":"A 25 Gb/s × 4-ch, 8 × 8 mm2 optical transceiver module for optical interconnection has been developed. To obtain a compact optical module suitable for chip-to-chip interconnection, a lens integrated connector, a small low temperature co-fired ceramic (LTCC) package, and a precise lens assembling technology were used. Experimental results showed that the proposed module can achieve 25 Gb/s error free transmission.","PeriodicalId":101667,"journal":{"name":"2013 3rd IEEE CPMT Symposium Japan","volume":"69 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131733439","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Effects of obstruction in front of a piezoelectric micro blower on performance characteristics 压电微型鼓风机前方障碍物对其性能特性的影响
2013 3rd IEEE CPMT Symposium Japan Pub Date : 2013-11-01 DOI: 10.1109/ICSJ.2013.6756109
T. Fukue, K. Hirose, Y. Matsuura, H. Terao
{"title":"Effects of obstruction in front of a piezoelectric micro blower on performance characteristics","authors":"T. Fukue, K. Hirose, Y. Matsuura, H. Terao","doi":"10.1109/ICSJ.2013.6756109","DOIUrl":"https://doi.org/10.1109/ICSJ.2013.6756109","url":null,"abstract":"This study describes a performance characteristic of a piezoelectric micro blower which may be available for a novel cooling technology of portable electronic equipment. We especially focus on the investigation whether the micro blower is available for a cooling method of high-density packaging electronic equipment or not. In this paper, the effect of the obstruction, which simulates the electrical components and is mounted very near the blower, on the P-Q characteristic was investigated. Especially we tried to measure the performance characteristic of the micro blower when the obstruction was mounted in front of the blower. From the experiment, it is found that the performance characteristic of the proposed micro blower is almost not changed regardless of the existence of the obstruction in front of the blower. There is a possibility that this novel blower can achieve a high cooling performance regardless of a packaging density of electronic components in electronic equipment.","PeriodicalId":101667,"journal":{"name":"2013 3rd IEEE CPMT Symposium Japan","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125334341","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
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