2013 3rd IEEE CPMT Symposium Japan最新文献_第2页

Electromagnetic field analysis of a broadband antenna built for third-generation mobile and UWB communications considering the effects of dielectric housing 考虑介质壳影响的第三代移动和超宽带通信宽带天线电磁场分析

2013 3rd IEEE CPMT Symposium Japan Pub Date : 2013-11-01 DOI: 10.1109/ICSJ.2013.6756105

Y. Akiyama, K. Koshiji, F. Koshiji

引用次数: 0

Power integrity behavior for various packaging environments 各种封装环境的电源完整性行为

2013 3rd IEEE CPMT Symposium Japan Pub Date : 2013-11-01 DOI: 10.1109/ICSJ.2013.6756112

Masahiro Terasaki, Sho Kiyosige, W. Ichimura, R. Kobayashi, G. Kubo, H. Otsuka, T. Sudo

{"title":"Power integrity behavior for various packaging environments","authors":"Masahiro Terasaki, Sho Kiyosige, W. Ichimura, R. Kobayashi, G. Kubo, H. Otsuka, T. Sudo","doi":"10.1109/ICSJ.2013.6756112","DOIUrl":"https://doi.org/10.1109/ICSJ.2013.6756112","url":null,"abstract":"Power integrity design has become a critical issue in digital electronic systems, as advanced CMOS LSIs operate at higher clock frequency and at lower supply voltage. Power supply fluctuation excited by core circuits or I/O buffer circuits induces logic instability and electromagnetic radiation. Therefore, total impedance of power distribution network (PDN) must be taking into consideration in the chip-package-board co-design. Especially, anti-resonance peaks in the PDN created by the parallel combination of on-chip capacitance and package inductance induce the unwanted power supply fluctuation, and results in the degradation of signal integrity and electromagnetic interference (EMI). In this paper, effects of critical damping condition for the total PDN impedance on power supply noise has been studied by adding different RC circuit to the intrinsic on-die RC circuit of chip. Three test chips were assumed to be designed on-chip PDN properties. The measurement and analysis of power supply noises for the three test chips showed typical characteristics of oscillatory region and damped regions the critical damping condition against the anti-resonance peak has been proved to be effective to suppress the power supply noise on the chip. Furthermore QFP and BGA are used for a package and the effect of anti-resonance and power supply noise control by the total impedance of a chip package board are verified from the difference in inductance.","PeriodicalId":101667,"journal":{"name":"2013 3rd IEEE CPMT Symposium Japan","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133526293","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Fine pitch PoP introduction 小间距PoP介绍

2013 3rd IEEE CPMT Symposium Japan Pub Date : 2013-11-01 DOI: 10.1109/ICSJ.2013.6756077

Jinseong Kim, Gyuwan Han, Byoungwoo Cho, Yesul Ahn, Dongjoo Park, Juhoon Yoon, Choon Heung, A. Yoshida

引用次数: 2

High-speed KTN optical beam deflector for swept-source optical coherence tomography 用于扫描源光学相干层析成像的高速KTN光束偏转器

2013 3rd IEEE CPMT Symposium Japan Pub Date : 2013-11-01 DOI: 10.1109/ICSJ.2013.6756100

Y. Sasaki, Y. Okabe, M. Ueno, T. Sakamoto, S. Toyoda, J. Kobayashi, S. Yagi, K. Naganuma

引用次数: 2

Thermal via technology for silica-based planar lightwave circuit 硅基平面光波电路的热通孔技术

2013 3rd IEEE CPMT Symposium Japan Pub Date : 2013-11-01 DOI: 10.1109/ICSJ.2013.6756092

S. Aozasa, Y. Kurata, Y. Hashizume, M. Itoh, H. Fukuyama

引用次数: 1

Hybrid integration technology of laser source with laser diode arrays on silicon optical waveguide platform by flip-chip bonding for silicon photonics 硅光子学中基于倒装键合的硅光波导平台上激光源与激光二极管阵列的混合集成技术

2013 3rd IEEE CPMT Symposium Japan Pub Date : 2013-11-01 DOI: 10.1109/ICSJ.2013.6756091

Takanori Shimizu, N. Hatori, M. Ishizaka, Y. Urino, Tsuyoshi Yamamoto, Takahiro Nakamura, M. Okano, M. Mori, Y. Arakawa

引用次数: 4

Airfoil: A new fine line fabrication technology on glass-cloth prepreg without insulating films for PKG substrate 翼型:PKG基板无绝缘膜玻璃布预浸料细线加工新技术

2013 3rd IEEE CPMT Symposium Japan Pub Date : 2013-11-01 DOI: 10.1109/ICSJ.2013.6756078

Kumpei Yamada, D. Fujimoto, Tetsuro Iwakura, H. Murai, Youichi Kaneko, Hiroshi Simizu

{"title":"Airfoil: A new fine line fabrication technology on glass-cloth prepreg without insulating films for PKG substrate","authors":"Kumpei Yamada, D. Fujimoto, Tetsuro Iwakura, H. Murai, Youichi Kaneko, Hiroshi Simizu","doi":"10.1109/ICSJ.2013.6756078","DOIUrl":"https://doi.org/10.1109/ICSJ.2013.6756078","url":null,"abstract":"As electronic parts increase its performance and miniaturize the size, package substrates are demanded to be thinner as well as higher in density. Thin packages such as Chip Scale Package (CSP) require high elastic modulus and low coefficient of thermal expansion with high density wiring to reduce warpage. To enable high density wiring, while maintaining crucial properties and minimal warpage, various fine line fabrications applied to glass-cloth prepreg have been investigated. The wiring processes with glass-cloth prepreg have made much progress from the subtractive method to SAP (Semi-Additive Process with primer for glass-cloth prepreg) and MSAP (modified SAP with ultra-thin copper). These have been achieved by decreasing the thickness of the to-be-etched copper layer. In the conventional SAP, the roughened surface of the primer is formed by imprinting the low profile copper (Ra = 0.3-0.5 μm) instead of the chemical etching of insulation film [1]. However, the flatness of the surface of Ra;0.3-0.5 μm makes the wiring under 30 μm pitch difficult. Therefore, we developed the new primer “Airfoil”, that can provide the excellent adhesive property with plated copper via chemical interaction. Airfoil has functional groups interacting with plated copper which provide the excellent peel strength despite of smooth surface (Ra<;0.1 μm). In addition, the high peel strength of Airfoil can be maintained for various types of prepregs by the diffusion controlled adhesive process. By applying Airfoil with glass-cloth prepreg, the wiring of 10 μm pitch was successfully fabricated by the SAP. Since Airfoil is very thin, it does not influence the prime properties of glass-cloth prepreg (e.g. elastic modulus, coefficient of thermal expansion, dielectric properties). Consequently, the package substrates of Airfoil with prepreg show the low coefficient of thermal expansion and high elastic modulus with 10 μm pitch wiring.","PeriodicalId":101667,"journal":{"name":"2013 3rd IEEE CPMT Symposium Japan","volume":"156 52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130459530","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Low profile cooling solutions for advanced packaging based on ultra-thin heat pipe and piezo fan 基于超薄热管和压电风扇的先进封装低轮廓冷却解决方案

2013 3rd IEEE CPMT Symposium Japan Pub Date : 2013-11-01 DOI: 10.1109/ICSJ.2013.6756110

Randeep Singh, M. Mochizuki, Mohammed Ahamed Shahed, Yuji Saito, Ahmed Jalilvand, M. Matsuda, Yoji Kawahara, K. Goto

{"title":"Low profile cooling solutions for advanced packaging based on ultra-thin heat pipe and piezo fan","authors":"Randeep Singh, M. Mochizuki, Mohammed Ahamed Shahed, Yuji Saito, Ahmed Jalilvand, M. Matsuda, Yoji Kawahara, K. Goto","doi":"10.1109/ICSJ.2013.6756110","DOIUrl":"https://doi.org/10.1109/ICSJ.2013.6756110","url":null,"abstract":"In this paper, heat pipes and piezo fan, in combination as well as individually, has been proposed to provide very thin thermal solutions for high density electronic packaging. Ultra-thin heat pipes with thickness in range of 0.6 to 2 mm have been developed to transfer maximum heat load of 0.8 to 68W respectively. These heat pipes have been fabricated from copper-water combination with center fiber copper wick. Different type of piezo fans (low frequency flapping type, high flow rate type and high velocity impingement type) with small thickness ~ 0.8 to 2 mm, low power consumption and high reliability has been proposed and characterized. These fans can provide direct cooling system or can be combined with thin heat pipe to provide remote heat exchanger. Using these thin advanced thermal technologies, cooling modules with thermal capability of 3 to 10 W and maximum thickness of 0.7 to 6 mm respectively has been designed and characterized. In summary, thermal technologies and cooling modules developed in this research work will provide energy efficient and thin thermal management solutions for space conservative high density electronics.","PeriodicalId":101667,"journal":{"name":"2013 3rd IEEE CPMT Symposium Japan","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128170890","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 17

Power/ground wiring for high speed driver: Evaluating method by comparison with actual and simulation schemes 高速驱动器的电源/地接线:与实际方案和仿真方案比较的评价方法

2013 3rd IEEE CPMT Symposium Japan Pub Date : 2013-11-01 DOI: 10.1109/ICSJ.2013.6756113

K. Hashimoto, Y. Akiyama, C. Ueda, Tsuneo Ito, K. Otsuka

引用次数: 4

Cu balls and Cu-core balls for 3D packaging 用于3D封装的铜球和铜芯球

2013 3rd IEEE CPMT Symposium Japan Pub Date : 2013-11-01 DOI: 10.1109/ICSJ.2013.6756080

Hiroyoshi Kawasaki, T. Hattori, Takahiro Roppongi, Daisuke Soma, Yuji Kawamata

引用次数: 3