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IEEE Solid-State Circuits Magazine最新文献

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Design and Optimization of Efficient Digital Machine Learning Accelerators: An overview of architecture choices, efficient quantization, sparsity exploration, and system integration techniques 高效数字机器学习加速器的设计与优化：架构选择、高效量化、稀疏性探索和系统集成技术概述
IEEE Solid-State Circuits Magazine Pub Date : 2025-06-19 DOI: 10.1109/MSSC.2025.3549361
Wei Tang;Sung-Gun Cho;Jie-Fang Zhang;Zhengya Zhang
{"title":"Design and Optimization of Efficient Digital Machine Learning Accelerators: An overview of architecture choices, efficient quantization, sparsity exploration, and system integration techniques","authors":"Wei Tang;Sung-Gun Cho;Jie-Fang Zhang;Zhengya Zhang","doi":"10.1109/MSSC.2025.3549361","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3549361","url":null,"abstract":"Digital machine learning (ML) accelerators are popular and widely used. We provide an overview of the SIMD and systolic array architectures that form the foundation of many accelerator designs. The demand for higher compute density, energy efficiency, and scalability has been increasing. To address these needs, new ML accelerator designs have adopted a range of techniques, including advanced architectural design, more efficient quantization, exploiting data-level sparsity, and leveraging new integration technologies. For each of these techniques, we review the common approaches, identify the design tradeoffs, and discuss their implications.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 2","pages":"30-38"},"PeriodicalIF":0.0,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144323243","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
SSCS Winter 2025 AdCom Meeting [Society News] SSCS 2025年冬季AdCom会议[社会新闻]
IEEE Solid-State Circuits Magazine Pub Date : 2025-06-19 DOI: 10.1109/MSSC.2025.3563742
Danielle Marinese
{"title":"SSCS Winter 2025 AdCom Meeting [Society News]","authors":"Danielle Marinese","doi":"10.1109/MSSC.2025.3563742","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3563742","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 2","pages":"79-79"},"PeriodicalIF":0.0,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11044961","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144323244","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Sparsity-Aware Hardware: From Overheads to Performance Benefits 支持稀疏的硬件：从开销到性能优势
IEEE Solid-State Circuits Magazine Pub Date : 2025-06-19 DOI: 10.1109/MSSC.2025.3549709
Man Shi;Adrian Kneip;Nicolas Chauvaux;Jiacong Sun;Charlotte Frenkel;Marian Verhelst
{"title":"Sparsity-Aware Hardware: From Overheads to Performance Benefits","authors":"Man Shi;Adrian Kneip;Nicolas Chauvaux;Jiacong Sun;Charlotte Frenkel;Marian Verhelst","doi":"10.1109/MSSC.2025.3549709","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3549709","url":null,"abstract":"As artificial intelligence (AI) continues to transform multiple sectors, its exponential growth in computational demands presents significant challenges for hardware infrastructure. This article examines sparsity, the prevalence of zeros in AI workloads, as a promising approach to address these challenges. While sparsity offers potential efficiency gains, its practical implementation requires careful consideration of hardware constraints and computational overheads. Therefore, this article cooperates with a virtual performance roofline model to analyze various sparsity techniques and their associated tradeoffs, aiming to bridge the gap between theoretical potential and practical implementation in AI accelerator design.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 2","pages":"61-71"},"PeriodicalIF":0.0,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144323247","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
An Update on Society Activities: Spring 2025 [President’s Corner] 社会活动动态：2025年春季[总统角]
IEEE Solid-State Circuits Magazine Pub Date : 2025-06-19 DOI: 10.1109/MSSC.2025.3563739
William Bowhill;Bill Bowhill
{"title":"An Update on Society Activities: Spring 2025 [President’s Corner]","authors":"William Bowhill;Bill Bowhill","doi":"10.1109/MSSC.2025.3563739","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3563739","url":null,"abstract":"","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 2","pages":"5-7"},"PeriodicalIF":0.0,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11044932","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144323249","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Michiel S. J. Steyaert Receives the 2025 IEEE Donald O. Pederson Award in Solid-State Circuits [Awards] michael S. J. Steyaert获得2025年IEEE固态电路Donald O. Pederson奖
IEEE Solid-State Circuits Magazine Pub Date : 2025-06-19 DOI: 10.1109/MSSC.2025.3564080
Danielle Marinese
{"title":"Michiel S. J. Steyaert Receives the 2025 IEEE Donald O. Pederson Award in Solid-State Circuits [Awards]","authors":"Danielle Marinese","doi":"10.1109/MSSC.2025.3564080","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3564080","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 2","pages":"104-104"},"PeriodicalIF":0.0,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11044936","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144322961","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
SSCS Student Branch Chapter at the National Engineering School of Sousse: Highlights From Late 2024 to 2025 [Chapters] SSCS学生分会在苏塞国家工程学院：从2024年底到2025年的亮点[章节]
IEEE Solid-State Circuits Magazine Pub Date : 2025-06-19 DOI: 10.1109/MSSC.2025.3564427
Habiba Bouras
{"title":"SSCS Student Branch Chapter at the National Engineering School of Sousse: Highlights From Late 2024 to 2025 [Chapters]","authors":"Habiba Bouras","doi":"10.1109/MSSC.2025.3564427","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3564427","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 2","pages":"90-90"},"PeriodicalIF":0.0,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11044951","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144322999","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
ISSCC 2025 Plenary Session [Conference Reports] ISSCC 2025全体会议[会议报告]
IEEE Solid-State Circuits Magazine Pub Date : 2025-06-19 DOI: 10.1109/MSSC.2025.3564027
Tom Burd
{"title":"ISSCC 2025 Plenary Session [Conference Reports]","authors":"Tom Burd","doi":"10.1109/MSSC.2025.3564027","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3564027","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 2","pages":"111-113"},"PeriodicalIF":0.0,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11044960","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144323073","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Inspiring Innovation: SSCS SEC Student Branch Chapter Leads With Global Impact and Grassroots Outreach [Chapters] 鼓舞人心的创新：SSCS SEC学生分会领导全球影响力和基层服务[章节]
IEEE Solid-State Circuits Magazine Pub Date : 2025-06-19 DOI: 10.1109/MSSC.2025.3564421
L. Kurinjimalar
{"title":"Inspiring Innovation: SSCS SEC Student Branch Chapter Leads With Global Impact and Grassroots Outreach [Chapters]","authors":"L. Kurinjimalar","doi":"10.1109/MSSC.2025.3564421","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3564421","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 2","pages":"88-88"},"PeriodicalIF":0.0,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11044965","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144323164","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE IISc VLSI Chapter: Nurturing Innovation and Engineering Research Through Esteemed Seminars—Activity Highlights [Chapters] IEEE IISc VLSI章节：通过受人尊敬的研讨会培育创新和工程研究-活动亮点[章节]
IEEE Solid-State Circuits Magazine Pub Date : 2025-06-19 DOI: 10.1109/MSSC.2025.3564370
Kalidasan K.;Sayantika Roy;Abhinava De;Soham Lakhote;Easha Easha;Rahul Reji
{"title":"IEEE IISc VLSI Chapter: Nurturing Innovation and Engineering Research Through Esteemed Seminars—Activity Highlights [Chapters]","authors":"Kalidasan K.;Sayantika Roy;Abhinava De;Soham Lakhote;Easha Easha;Rahul Reji","doi":"10.1109/MSSC.2025.3564370","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3564370","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 2","pages":"94-94"},"PeriodicalIF":0.0,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11044959","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144323213","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Designing the Future: The Role of Solid-State Circuits in the Next Decade [Chapters] 设计未来：固态电路在未来十年中的作用[章节]
IEEE Solid-State Circuits Magazine Pub Date : 2025-06-19 DOI: 10.1109/MSSC.2025.3564422
Nimasha Pilippange
{"title":"Designing the Future: The Role of Solid-State Circuits in the Next Decade [Chapters]","authors":"Nimasha Pilippange","doi":"10.1109/MSSC.2025.3564422","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3564422","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 2","pages":"98-98"},"PeriodicalIF":0.0,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11044981","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144322949","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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