发布求助
文献互助 智能选刊 最新文献

IEEE Solid-State Circuits Magazine最新文献

筛选
英文 中文
Miller’s Wrong Half-Plane Zero [Shop Talk: What you didn’t Learn in School] 米勒错误的半平面零[商店谈话：你在学校没有学到的东西]
IEEE Solid-State Circuits Magazine Pub Date : 2025-06-19 DOI: 10.1109/MSSC.2025.3562109
Chris Mangelsdorf
{"title":"Miller’s Wrong Half-Plane Zero [Shop Talk: What you didn’t Learn in School]","authors":"Chris Mangelsdorf","doi":"10.1109/MSSC.2025.3562109","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3562109","url":null,"abstract":"The right half-plane (RHP) zero associated with Miller frequency compensation in feedback loops is well known. But much of what we've learned about it is incomplete, misleading and -occasionally- wrong. This column explores the fundamental nature of the RHP zero and the circuit techniques that have evolved to deal with it. Emphasis is on intuitive understanding of the phenomena, because it reveals the flaws that arise in a purely mathematical analysis.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 2","pages":"19-29"},"PeriodicalIF":0.0,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144323026","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Fellow Program [IEEE News] IEEE Fellow Program [IEEE新闻]
IEEE Solid-State Circuits Magazine Pub Date : 2025-06-19 DOI: 10.1109/MSSC.2025.3564026
Wanda Gass;Howard Luong
{"title":"IEEE Fellow Program [IEEE News]","authors":"Wanda Gass;Howard Luong","doi":"10.1109/MSSC.2025.3564026","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3564026","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 2","pages":"127-127"},"PeriodicalIF":0.0,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11044957","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144323097","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Women in Circuits Bingo Networking Event at ISSCC 2025 [Women in Circuits Corner] 在ISSCC 2025举办的女性参与电路宾果网络活动[女性参与电路角]
IEEE Solid-State Circuits Magazine Pub Date : 2025-06-19 DOI: 10.1109/MSSC.2025.3563914
Kwantae Kim;Ben Keller
{"title":"Women in Circuits Bingo Networking Event at ISSCC 2025 [Women in Circuits Corner]","authors":"Kwantae Kim;Ben Keller","doi":"10.1109/MSSC.2025.3563914","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3563914","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 2","pages":"84-84"},"PeriodicalIF":0.0,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11044963","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144323141","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE SSCS ENIS SBC Preuniversity Program: Igniting Passion for Electronics [Chapters] IEEE SSCS ENIS SBC大学预科课程：点燃电子激情[章节]
IEEE Solid-State Circuits Magazine Pub Date : 2025-06-19 DOI: 10.1109/MSSC.2025.3564428
Hadil Khelifi
{"title":"IEEE SSCS ENIS SBC Preuniversity Program: Igniting Passion for Electronics [Chapters]","authors":"Hadil Khelifi","doi":"10.1109/MSSC.2025.3564428","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3564428","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 2","pages":"92-92"},"PeriodicalIF":0.0,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11044949","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144323165","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
SRAM- and eDRAM-Based Compute-in-Memory Designs, Accelerators, and Evaluation Frameworks: Macro-Level and System-Level Optimization and Evaluation 基于SRAM和edram的内存计算设计、加速器和评估框架：宏观级和系统级优化与评估
IEEE Solid-State Circuits Magazine Pub Date : 2025-06-19 DOI: 10.1109/MSSC.2025.3549358
Yifan He;Xiaofeng Hu;Hongyang Jia;Jae-sun Seo
{"title":"SRAM- and eDRAM-Based Compute-in-Memory Designs, Accelerators, and Evaluation Frameworks: Macro-Level and System-Level Optimization and Evaluation","authors":"Yifan He;Xiaofeng Hu;Hongyang Jia;Jae-sun Seo","doi":"10.1109/MSSC.2025.3549358","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3549358","url":null,"abstract":"Compute-in-memory (CIM) has shown great potential in efficiently processing high-dimensional data over traditional von Neumann architectures, becoming a candidate computing fabric for next-generation AI. This has motivated the rapid development of CIM prototypes and deployments in different approaches, among which SRAM- and eDRAM-based CIM have drawn significant attention due to their flexibility and feasibility. At the time of a decade after the first CIM implementation, it is necessary to review the technical approaches and revisit the new findings behind complicated prototypes. Macro-level innovations such as precise current-based computation and deeply coupled algorithm-circuit co-optimization open up the headroom for efficiency vs. signal-to-noise ratio (SNR) tradeoffs in analog and digital CIM, respectively. Furthermore, diverse architectural configurations integrating CIM macros into systemon- chips have demonstrated scale-out of computing capacity. However, architectural integration of CIM still faces challenges from digital peripherals, memory reloading, and communication. These necessitate hardware-software co-designed mappings and, more importantly, comprehensive and fair evaluation frameworks.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 2","pages":"39-48"},"PeriodicalIF":0.0,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144323200","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Design and Optimization of Efficient Digital Machine Learning Accelerators: An overview of architecture choices, efficient quantization, sparsity exploration, and system integration techniques 高效数字机器学习加速器的设计与优化：架构选择、高效量化、稀疏性探索和系统集成技术概述
IEEE Solid-State Circuits Magazine Pub Date : 2025-06-19 DOI: 10.1109/MSSC.2025.3549361
Wei Tang;Sung-Gun Cho;Jie-Fang Zhang;Zhengya Zhang
{"title":"Design and Optimization of Efficient Digital Machine Learning Accelerators: An overview of architecture choices, efficient quantization, sparsity exploration, and system integration techniques","authors":"Wei Tang;Sung-Gun Cho;Jie-Fang Zhang;Zhengya Zhang","doi":"10.1109/MSSC.2025.3549361","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3549361","url":null,"abstract":"Digital machine learning (ML) accelerators are popular and widely used. We provide an overview of the SIMD and systolic array architectures that form the foundation of many accelerator designs. The demand for higher compute density, energy efficiency, and scalability has been increasing. To address these needs, new ML accelerator designs have adopted a range of techniques, including advanced architectural design, more efficient quantization, exploiting data-level sparsity, and leveraging new integration technologies. For each of these techniques, we review the common approaches, identify the design tradeoffs, and discuss their implications.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 2","pages":"30-38"},"PeriodicalIF":0.0,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144323243","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
SSCS Winter 2025 AdCom Meeting [Society News] SSCS 2025年冬季AdCom会议[社会新闻]
IEEE Solid-State Circuits Magazine Pub Date : 2025-06-19 DOI: 10.1109/MSSC.2025.3563742
Danielle Marinese
{"title":"SSCS Winter 2025 AdCom Meeting [Society News]","authors":"Danielle Marinese","doi":"10.1109/MSSC.2025.3563742","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3563742","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 2","pages":"79-79"},"PeriodicalIF":0.0,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11044961","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144323244","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Sparsity-Aware Hardware: From Overheads to Performance Benefits 支持稀疏的硬件：从开销到性能优势
IEEE Solid-State Circuits Magazine Pub Date : 2025-06-19 DOI: 10.1109/MSSC.2025.3549709
Man Shi;Adrian Kneip;Nicolas Chauvaux;Jiacong Sun;Charlotte Frenkel;Marian Verhelst
{"title":"Sparsity-Aware Hardware: From Overheads to Performance Benefits","authors":"Man Shi;Adrian Kneip;Nicolas Chauvaux;Jiacong Sun;Charlotte Frenkel;Marian Verhelst","doi":"10.1109/MSSC.2025.3549709","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3549709","url":null,"abstract":"As artificial intelligence (AI) continues to transform multiple sectors, its exponential growth in computational demands presents significant challenges for hardware infrastructure. This article examines sparsity, the prevalence of zeros in AI workloads, as a promising approach to address these challenges. While sparsity offers potential efficiency gains, its practical implementation requires careful consideration of hardware constraints and computational overheads. Therefore, this article cooperates with a virtual performance roofline model to analyze various sparsity techniques and their associated tradeoffs, aiming to bridge the gap between theoretical potential and practical implementation in AI accelerator design.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 2","pages":"61-71"},"PeriodicalIF":0.0,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144323247","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
An Update on Society Activities: Spring 2025 [President’s Corner] 社会活动动态：2025年春季[总统角]
IEEE Solid-State Circuits Magazine Pub Date : 2025-06-19 DOI: 10.1109/MSSC.2025.3563739
William Bowhill;Bill Bowhill
{"title":"An Update on Society Activities: Spring 2025 [President’s Corner]","authors":"William Bowhill;Bill Bowhill","doi":"10.1109/MSSC.2025.3563739","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3563739","url":null,"abstract":"","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 2","pages":"5-7"},"PeriodicalIF":0.0,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11044932","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144323249","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Michiel S. J. Steyaert Receives the 2025 IEEE Donald O. Pederson Award in Solid-State Circuits [Awards] michael S. J. Steyaert获得2025年IEEE固态电路Donald O. Pederson奖
IEEE Solid-State Circuits Magazine Pub Date : 2025-06-19 DOI: 10.1109/MSSC.2025.3564080
Danielle Marinese
{"title":"Michiel S. J. Steyaert Receives the 2025 IEEE Donald O. Pederson Award in Solid-State Circuits [Awards]","authors":"Danielle Marinese","doi":"10.1109/MSSC.2025.3564080","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3564080","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 2","pages":"104-104"},"PeriodicalIF":0.0,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11044936","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144322961","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
下一页 尾页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：604180095
Book学术官方微信