{"title":"VLSID 2026: Global Synergy in Silicon—VLSI and Embedded AI for Sustainable Computing and Next-Gen Electrified Mobility [Conference Reports]","authors":"Shailesh Parab;Meghana Sridhar;Nagi Naganathan","doi":"10.1109/MSSC.2026.3690111","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3690111","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 2","pages":"163-165"},"PeriodicalIF":0.0,"publicationDate":"2026-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11574845","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148443270","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"ISSCC 2026 Evening Event: When GenAI Takes Center Stage [Conference Reports]","authors":"Alfred Yeung","doi":"10.1109/MSSC.2026.3690145","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3690145","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 2","pages":"165-166"},"PeriodicalIF":0.0,"publicationDate":"2026-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11574810","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148443271","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Solid Stories: Midcareer Reflections With Pui-In Mak [People]","authors":"Hui Jiang","doi":"10.1109/MSSC.2026.3690110","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3690110","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 2","pages":"134-135"},"PeriodicalIF":0.0,"publicationDate":"2026-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11574830","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148513393","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Three Decades of Influence: Inaugural 2025 IEEE Journal of Solid-State Circuits Test of Time Award Honors Foundational CMOS Design Work [Awards]","authors":"David Tadros","doi":"10.1109/MSSC.2026.3689459","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3689459","url":null,"abstract":"Presents the recipients of IEEE Solid-State Circuits Society awards for 2025.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 2","pages":"137-137"},"PeriodicalIF":0.0,"publicationDate":"2026-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11574800","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148513394","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"SSCS Boise Chapter Activity With Assistant Prof. Omiya Hassan [Chapters]","authors":"Tim Hollis","doi":"10.1109/MSSC.2026.3690396","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3690396","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 2","pages":"128-128"},"PeriodicalIF":0.0,"publicationDate":"2026-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11574853","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148514078","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Powering Up Chiplets [Circuits from a Systems Perspective]","authors":"Farhana Sheikh","doi":"10.1109/MSSC.2026.3686534","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3686534","url":null,"abstract":"There has been surge in the number of multichip and chiplet-based systems papers published at the IEEE International Solid-State Circuits Conference (ISSCC) since 2000, as shown in Figure 1. In the early 2000s, there were almost no “chiplets” or multichip modules (MCMs) published at ISSCC. In 2005/2006, as Dennard scaling slowed down, David Patterson, at the University of California, Berkeley, coined the term “chiplet” [1], [2], [3], and Intel published the two-CPU Intel Pentium D in-package system [4], along with additional MCMs published by others. The Pentium Pro (dual-chip in-package system) came earlier, in 1995/1996 [4]. However, following the Pentium-D, there were very few MCM designs published. In 2014, Xilinx published its stacked silicon interconnect, which was used to connect the company’s FPGA to data converters [6], and following that, Marvell’s chief executive officer, Sehat Sutardja, spoke about die-to-die interconnects in his plenary talk at ISSCC 2015 [7]. DARPA sponsored its CHIPS program in 2017, and Intel published the first FPGA enabled with an advanced interface bus die-to-die interconnect for 2.5D heterogeneous integration, which leveraged Intel’s embedded multidie interconnect bridge (EMIB) technology [8]. Soon after, AMD published its chiplet processor [9], [10], which was productized, sparking a significant rise in disaggregated systems. Around the same time, Intel announced the Foveros 3D TSV microbump-based assembly, and following that, TSMC ramped up small-outline IC/chip-on-wafer-on-substrate production, fueling the rise in disaggregated systems. Interestingly, the predicted revenue from chiplet systems represented by the green curve [11] in Figure 1 follows the ISSCC trend.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 2","pages":"24-29"},"PeriodicalIF":0.0,"publicationDate":"2026-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148514802","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Electrothon 2K26: A Platform for Innovation in Arduino-Based Design [Chapters]","authors":"Suman Sarkar;Rittika Das","doi":"10.1109/MSSC.2026.3690444","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3690444","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 2","pages":"133-133"},"PeriodicalIF":0.0,"publicationDate":"2026-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11574847","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148514831","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Sadayuki Yoshitomi;D. Mitch Bailey;Harald Pretl;Peter R. Kinget;Mehdi Saligane
{"title":"SSCS PICO Chronicles: News From the Open Source Community [Society News]","authors":"Sadayuki Yoshitomi;D. Mitch Bailey;Harald Pretl;Peter R. Kinget;Mehdi Saligane","doi":"10.1109/MSSC.2026.3690108","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3690108","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 2","pages":"100-104"},"PeriodicalIF":0.0,"publicationDate":"2026-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11574843","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148514964","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Lin Cheng Receives the 2026 IEEE Solid-State Circuits Society New Frontier Award [Awards]","authors":"David Tadros","doi":"10.1109/MSSC.2026.3689369","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3689369","url":null,"abstract":"Presents the recipients of IEEE Solid-State Circuits Society awards for 2026.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 2","pages":"139-139"},"PeriodicalIF":0.0,"publicationDate":"2026-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11574856","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148513398","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}