IEEE Solid-State Circuits Magazine最新文献

筛选
英文 中文
VLSID 2026: Global Synergy in Silicon—VLSI and Embedded AI for Sustainable Computing and Next-Gen Electrified Mobility [Conference Reports] VLSID 2026:硅- vlsi和嵌入式人工智能在可持续计算和下一代电气化交通中的全球协同作用[会议报告]
IEEE Solid-State Circuits Magazine Pub Date : 2026-02-01 Epub Date: 2026-06-22 DOI: 10.1109/MSSC.2026.3690111
Shailesh Parab;Meghana Sridhar;Nagi Naganathan
{"title":"VLSID 2026: Global Synergy in Silicon—VLSI and Embedded AI for Sustainable Computing and Next-Gen Electrified Mobility [Conference Reports]","authors":"Shailesh Parab;Meghana Sridhar;Nagi Naganathan","doi":"10.1109/MSSC.2026.3690111","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3690111","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 2","pages":"163-165"},"PeriodicalIF":0.0,"publicationDate":"2026-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11574845","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148443270","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
ISSCC 2026 Evening Event: When GenAI Takes Center Stage [Conference Reports] ISSCC 2026晚间活动:GenAI成为焦点[会议报告]
IEEE Solid-State Circuits Magazine Pub Date : 2026-02-01 Epub Date: 2026-06-22 DOI: 10.1109/MSSC.2026.3690145
Alfred Yeung
{"title":"ISSCC 2026 Evening Event: When GenAI Takes Center Stage [Conference Reports]","authors":"Alfred Yeung","doi":"10.1109/MSSC.2026.3690145","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3690145","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 2","pages":"165-166"},"PeriodicalIF":0.0,"publicationDate":"2026-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11574810","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148443271","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Solid Stories: Midcareer Reflections With Pui-In Mak [People] 扎实的故事:与麦培仁的职业生涯反思[人物]
IEEE Solid-State Circuits Magazine Pub Date : 2026-02-01 Epub Date: 2026-06-22 DOI: 10.1109/MSSC.2026.3690110
Hui Jiang
{"title":"Solid Stories: Midcareer Reflections With Pui-In Mak [People]","authors":"Hui Jiang","doi":"10.1109/MSSC.2026.3690110","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3690110","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 2","pages":"134-135"},"PeriodicalIF":0.0,"publicationDate":"2026-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11574830","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148513393","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Three Decades of Influence: Inaugural 2025 IEEE Journal of Solid-State Circuits Test of Time Award Honors Foundational CMOS Design Work [Awards] 三十年的影响:首届2025年IEEE固态电路时间测试奖表彰基础CMOS设计工作
IEEE Solid-State Circuits Magazine Pub Date : 2026-02-01 Epub Date: 2026-06-22 DOI: 10.1109/MSSC.2026.3689459
David Tadros
{"title":"Three Decades of Influence: Inaugural 2025 IEEE Journal of Solid-State Circuits Test of Time Award Honors Foundational CMOS Design Work [Awards]","authors":"David Tadros","doi":"10.1109/MSSC.2026.3689459","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3689459","url":null,"abstract":"Presents the recipients of IEEE Solid-State Circuits Society awards for 2025.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 2","pages":"137-137"},"PeriodicalIF":0.0,"publicationDate":"2026-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11574800","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148513394","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Connect IEEE连接
IEEE Solid-State Circuits Magazine Pub Date : 2026-02-01 Epub Date: 2026-06-22 DOI: 10.1109/MSSC.2026.3700736
{"title":"IEEE Connect","authors":"","doi":"10.1109/MSSC.2026.3700736","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3700736","url":null,"abstract":"","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 2","pages":"29-29"},"PeriodicalIF":0.0,"publicationDate":"2026-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11574833","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148513397","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
SSCS Boise Chapter Activity With Assistant Prof. Omiya Hassan [Chapters] SSCS博伊西分会活动与助理教授Omiya Hassan[章节]
IEEE Solid-State Circuits Magazine Pub Date : 2026-02-01 Epub Date: 2026-06-22 DOI: 10.1109/MSSC.2026.3690396
Tim Hollis
{"title":"SSCS Boise Chapter Activity With Assistant Prof. Omiya Hassan [Chapters]","authors":"Tim Hollis","doi":"10.1109/MSSC.2026.3690396","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3690396","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 2","pages":"128-128"},"PeriodicalIF":0.0,"publicationDate":"2026-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11574853","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148514078","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Powering Up Chiplets [Circuits from a Systems Perspective] 为小芯片供电[从系统角度看电路]
IEEE Solid-State Circuits Magazine Pub Date : 2026-02-01 Epub Date: 2026-06-22 DOI: 10.1109/MSSC.2026.3686534
Farhana Sheikh
{"title":"Powering Up Chiplets [Circuits from a Systems Perspective]","authors":"Farhana Sheikh","doi":"10.1109/MSSC.2026.3686534","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3686534","url":null,"abstract":"There has been surge in the number of multichip and chiplet-based systems papers published at the IEEE International Solid-State Circuits Conference (ISSCC) since 2000, as shown in Figure 1. In the early 2000s, there were almost no “chiplets” or multichip modules (MCMs) published at ISSCC. In 2005/2006, as Dennard scaling slowed down, David Patterson, at the University of California, Berkeley, coined the term “chiplet” [1], [2], [3], and Intel published the two-CPU Intel Pentium D in-package system [4], along with additional MCMs published by others. The Pentium Pro (dual-chip in-package system) came earlier, in 1995/1996 [4]. However, following the Pentium-D, there were very few MCM designs published. In 2014, Xilinx published its stacked silicon interconnect, which was used to connect the company’s FPGA to data converters [6], and following that, Marvell’s chief executive officer, Sehat Sutardja, spoke about die-to-die interconnects in his plenary talk at ISSCC 2015 [7]. DARPA sponsored its CHIPS program in 2017, and Intel published the first FPGA enabled with an advanced interface bus die-to-die interconnect for 2.5D heterogeneous integration, which leveraged Intel’s embedded multidie interconnect bridge (EMIB) technology [8]. Soon after, AMD published its chiplet processor [9], [10], which was productized, sparking a significant rise in disaggregated systems. Around the same time, Intel announced the Foveros 3D TSV microbump-based assembly, and following that, TSMC ramped up small-outline IC/chip-on-wafer-on-substrate production, fueling the rise in disaggregated systems. Interestingly, the predicted revenue from chiplet systems represented by the green curve [11] in Figure 1 follows the ISSCC trend.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 2","pages":"24-29"},"PeriodicalIF":0.0,"publicationDate":"2026-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148514802","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Electrothon 2K26: A Platform for Innovation in Arduino-Based Design [Chapters] Electrothon 2K26:基于arduino的设计创新平台[章节]
IEEE Solid-State Circuits Magazine Pub Date : 2026-02-01 Epub Date: 2026-06-22 DOI: 10.1109/MSSC.2026.3690444
Suman Sarkar;Rittika Das
{"title":"Electrothon 2K26: A Platform for Innovation in Arduino-Based Design [Chapters]","authors":"Suman Sarkar;Rittika Das","doi":"10.1109/MSSC.2026.3690444","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3690444","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 2","pages":"133-133"},"PeriodicalIF":0.0,"publicationDate":"2026-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11574847","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148514831","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
SSCS PICO Chronicles: News From the Open Source Community [Society News] SSCS PICO编年史:来自开源社区的新闻[社会新闻]
IEEE Solid-State Circuits Magazine Pub Date : 2026-02-01 Epub Date: 2026-06-22 DOI: 10.1109/MSSC.2026.3690108
Sadayuki Yoshitomi;D. Mitch Bailey;Harald Pretl;Peter R. Kinget;Mehdi Saligane
{"title":"SSCS PICO Chronicles: News From the Open Source Community [Society News]","authors":"Sadayuki Yoshitomi;D. Mitch Bailey;Harald Pretl;Peter R. Kinget;Mehdi Saligane","doi":"10.1109/MSSC.2026.3690108","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3690108","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 2","pages":"100-104"},"PeriodicalIF":0.0,"publicationDate":"2026-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11574843","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148514964","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Lin Cheng Receives the 2026 IEEE Solid-State Circuits Society New Frontier Award [Awards] 林诚获2026 IEEE固态电路学会新前沿奖
IEEE Solid-State Circuits Magazine Pub Date : 2026-02-01 Epub Date: 2026-06-22 DOI: 10.1109/MSSC.2026.3689369
David Tadros
{"title":"Lin Cheng Receives the 2026 IEEE Solid-State Circuits Society New Frontier Award [Awards]","authors":"David Tadros","doi":"10.1109/MSSC.2026.3689369","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3689369","url":null,"abstract":"Presents the recipients of IEEE Solid-State Circuits Society awards for 2026.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 2","pages":"139-139"},"PeriodicalIF":0.0,"publicationDate":"2026-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11574856","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148513398","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信
小红书