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IEEE Solid-State Circuits Magazine最新文献

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Central Illinois Section SSCS Chapter Reopens With Distinguished Lecture and Outreach Events [Chapters] 伊利诺伊州中部分会SSCS分会重新开放，举办杰出讲座和外展活动[章节]
IEEE Solid-State Circuits Magazine Pub Date : 2025-08-20 DOI: 10.1109/MSSC.2025.3583527
Marjorie Catt
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引用次数: 0
CEDA Currents [IEEE News] CEDA电流[IEEE新闻]
IEEE Solid-State Circuits Magazine Pub Date : 2025-08-20 DOI: 10.1109/MSSC.2025.3583533
Danielle Marinese
{"title":"CEDA Currents [IEEE News]","authors":"Danielle Marinese","doi":"10.1109/MSSC.2025.3583533","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3583533","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 3","pages":"108-110"},"PeriodicalIF":0.0,"publicationDate":"2025-08-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11131393","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144880435","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Solid-Stories: Dr. Yao-Hong Liu [People] 真实故事：刘耀红博士[人物]
IEEE Solid-State Circuits Magazine Pub Date : 2025-08-20 DOI: 10.1109/MSSC.2025.3583531
Jiang Hui
{"title":"Solid-Stories: Dr. Yao-Hong Liu [People]","authors":"Jiang Hui","doi":"10.1109/MSSC.2025.3583531","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3583531","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 3","pages":"103-104"},"PeriodicalIF":0.0,"publicationDate":"2025-08-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11131387","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144880522","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
High-School Electronics Outreach Going Strong in San Diego [Society News] 圣地亚哥高中电子产品推广力度加大[社会新闻]
IEEE Solid-State Circuits Magazine Pub Date : 2025-08-20 DOI: 10.1109/MSSC.2025.3584278
Theo Loke;Dvora Celniker;John Cohn;John Long;Alvin Loke
{"title":"High-School Electronics Outreach Going Strong in San Diego [Society News]","authors":"Theo Loke;Dvora Celniker;John Cohn;John Long;Alvin Loke","doi":"10.1109/MSSC.2025.3584278","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3584278","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 3","pages":"85-85"},"PeriodicalIF":0.0,"publicationDate":"2025-08-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11131413","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144880636","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The IEEE Tianjin AP/MTT/SSC Joint Chapter: Promoting Innovation and Excellence in Microelectronics Through Academic Exchange and Collaboration [Chapters] IEEE天津AP/MTT/SSC联合分会：通过学术交流与合作促进微电子技术的创新与卓越[章节]
IEEE Solid-State Circuits Magazine Pub Date : 2025-08-20 DOI: 10.1109/MSSC.2025.3583520
Yu Luo;Keping Wang;Yongqiang Wang;Ningning Yan;Feng Feng;Fanyi Meng;Chao Zhang
{"title":"The IEEE Tianjin AP/MTT/SSC Joint Chapter: Promoting Innovation and Excellence in Microelectronics Through Academic Exchange and Collaboration [Chapters]","authors":"Yu Luo;Keping Wang;Yongqiang Wang;Ningning Yan;Feng Feng;Fanyi Meng;Chao Zhang","doi":"10.1109/MSSC.2025.3583520","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3583520","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 3","pages":"97-97"},"PeriodicalIF":0.0,"publicationDate":"2025-08-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11131416","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144880574","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Miller’s Wrong Half-Plane Zero [Shop Talk: What you didn’t Learn in School] 米勒错误的半平面零[商店谈话：你在学校没有学到的东西]
IEEE Solid-State Circuits Magazine Pub Date : 2025-06-19 DOI: 10.1109/MSSC.2025.3562109
Chris Mangelsdorf
{"title":"Miller’s Wrong Half-Plane Zero [Shop Talk: What you didn’t Learn in School]","authors":"Chris Mangelsdorf","doi":"10.1109/MSSC.2025.3562109","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3562109","url":null,"abstract":"The right half-plane (RHP) zero associated with Miller frequency compensation in feedback loops is well known. But much of what we've learned about it is incomplete, misleading and -occasionally- wrong. This column explores the fundamental nature of the RHP zero and the circuit techniques that have evolved to deal with it. Emphasis is on intuitive understanding of the phenomena, because it reveals the flaws that arise in a purely mathematical analysis.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 2","pages":"19-29"},"PeriodicalIF":0.0,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144323026","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Fellow Program [IEEE News] IEEE Fellow Program [IEEE新闻]
IEEE Solid-State Circuits Magazine Pub Date : 2025-06-19 DOI: 10.1109/MSSC.2025.3564026
Wanda Gass;Howard Luong
{"title":"IEEE Fellow Program [IEEE News]","authors":"Wanda Gass;Howard Luong","doi":"10.1109/MSSC.2025.3564026","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3564026","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 2","pages":"127-127"},"PeriodicalIF":0.0,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11044957","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144323097","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Women in Circuits Bingo Networking Event at ISSCC 2025 [Women in Circuits Corner] 在ISSCC 2025举办的女性参与电路宾果网络活动[女性参与电路角]
IEEE Solid-State Circuits Magazine Pub Date : 2025-06-19 DOI: 10.1109/MSSC.2025.3563914
Kwantae Kim;Ben Keller
{"title":"Women in Circuits Bingo Networking Event at ISSCC 2025 [Women in Circuits Corner]","authors":"Kwantae Kim;Ben Keller","doi":"10.1109/MSSC.2025.3563914","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3563914","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 2","pages":"84-84"},"PeriodicalIF":0.0,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11044963","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144323141","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE SSCS ENIS SBC Preuniversity Program: Igniting Passion for Electronics [Chapters] IEEE SSCS ENIS SBC大学预科课程：点燃电子激情[章节]
IEEE Solid-State Circuits Magazine Pub Date : 2025-06-19 DOI: 10.1109/MSSC.2025.3564428
Hadil Khelifi
{"title":"IEEE SSCS ENIS SBC Preuniversity Program: Igniting Passion for Electronics [Chapters]","authors":"Hadil Khelifi","doi":"10.1109/MSSC.2025.3564428","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3564428","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 2","pages":"92-92"},"PeriodicalIF":0.0,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11044949","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144323165","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
SRAM- and eDRAM-Based Compute-in-Memory Designs, Accelerators, and Evaluation Frameworks: Macro-Level and System-Level Optimization and Evaluation 基于SRAM和edram的内存计算设计、加速器和评估框架：宏观级和系统级优化与评估
IEEE Solid-State Circuits Magazine Pub Date : 2025-06-19 DOI: 10.1109/MSSC.2025.3549358
Yifan He;Xiaofeng Hu;Hongyang Jia;Jae-sun Seo
{"title":"SRAM- and eDRAM-Based Compute-in-Memory Designs, Accelerators, and Evaluation Frameworks: Macro-Level and System-Level Optimization and Evaluation","authors":"Yifan He;Xiaofeng Hu;Hongyang Jia;Jae-sun Seo","doi":"10.1109/MSSC.2025.3549358","DOIUrl":"https://doi.org/10.1109/MSSC.2025.3549358","url":null,"abstract":"Compute-in-memory (CIM) has shown great potential in efficiently processing high-dimensional data over traditional von Neumann architectures, becoming a candidate computing fabric for next-generation AI. This has motivated the rapid development of CIM prototypes and deployments in different approaches, among which SRAM- and eDRAM-based CIM have drawn significant attention due to their flexibility and feasibility. At the time of a decade after the first CIM implementation, it is necessary to review the technical approaches and revisit the new findings behind complicated prototypes. Macro-level innovations such as precise current-based computation and deeply coupled algorithm-circuit co-optimization open up the headroom for efficiency vs. signal-to-noise ratio (SNR) tradeoffs in analog and digital CIM, respectively. Furthermore, diverse architectural configurations integrating CIM macros into systemon- chips have demonstrated scale-out of computing capacity. However, architectural integration of CIM still faces challenges from digital peripherals, memory reloading, and communication. These necessitate hardware-software co-designed mappings and, more importantly, comprehensive and fair evaluation frameworks.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 2","pages":"39-48"},"PeriodicalIF":0.0,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144323200","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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