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IEEE Solid-State Circuits Magazine最新文献

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Solid Stories Special Edition: Episodes in the Life of a Circuit Engineer [People] 固体故事特别版：电路工程师的生活片段[人物]
IEEE Solid-State Circuits Magazine Pub Date : 2026-06-01 Epub Date: 2026-08-19 DOI: 10.1109/MSSC.2026.3708067
Gabor C. Temes
{"title":"Solid Stories Special Edition: Episodes in the Life of a Circuit Engineer [People]","authors":"Gabor C. Temes","doi":"10.1109/MSSC.2026.3708067","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3708067","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 3","pages":"93-94"},"PeriodicalIF":0.0,"publicationDate":"2026-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11659735","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148781543","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The IEEE AP-S/MTT-S/SSCS Tianjin Joint Chapter Actively Promotes Academic Exchanges and Supports the Development of Student Members [Chapters] IEEE AP-S/MTT-S/SSCS天津联合分会积极推动学术交流，支持学生会员发展
IEEE Solid-State Circuits Magazine Pub Date : 2026-06-01 Epub Date: 2026-08-19 DOI: 10.1109/MSSC.2026.3708278
Yu Luo;Chao Zhang
{"title":"The IEEE AP-S/MTT-S/SSCS Tianjin Joint Chapter Actively Promotes Academic Exchanges and Supports the Development of Student Members [Chapters]","authors":"Yu Luo;Chao Zhang","doi":"10.1109/MSSC.2026.3708278","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3708278","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 3","pages":"101-102"},"PeriodicalIF":0.0,"publicationDate":"2026-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11659624","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148781618","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Women in Circuits Networking Bingo at CICC 2026 [Women in Circuits Corner] cicc2026的女性电路网络Bingo[女性电路角]
IEEE Solid-State Circuits Magazine Pub Date : 2026-06-01 Epub Date: 2026-08-19 DOI: 10.1109/MSSC.2026.3692003
Maitreyi Ashok;Rozhan Rabbani
{"title":"Women in Circuits Networking Bingo at CICC 2026 [Women in Circuits Corner]","authors":"Maitreyi Ashok;Rozhan Rabbani","doi":"10.1109/MSSC.2026.3692003","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3692003","url":null,"abstract":"","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 3","pages":"92-92"},"PeriodicalIF":0.0,"publicationDate":"2026-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11659710","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148781542","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Prof. Ming-Yan Fan Receives Multiple Honors for Research Excellence and Industry–Academia Collaboration [Chapters] 范明彦教授获多项卓越研究及产学合作荣誉[章]
IEEE Solid-State Circuits Magazine Pub Date : 2026-06-01 Epub Date: 2026-08-19 DOI: 10.1109/MSSC.2026.3708306
Ming-Yan Fan
{"title":"Prof. Ming-Yan Fan Receives Multiple Honors for Research Excellence and Industry–Academia Collaboration [Chapters]","authors":"Ming-Yan Fan","doi":"10.1109/MSSC.2026.3708306","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3708306","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 3","pages":"99-99"},"PeriodicalIF":0.0,"publicationDate":"2026-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11659620","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148781809","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Hawaii SSCS/EDS Chapter Drives Innovation: From Distinguished Lectures to a New Student Branch [Chapters] 夏威夷SSCS/EDS分会推动创新：从杰出的讲座到新的学生分会[章节]
IEEE Solid-State Circuits Magazine Pub Date : 2026-06-01 Epub Date: 2026-08-19 DOI: 10.1109/MSSC.2026.3708330
Vikas Kumar
{"title":"Hawaii SSCS/EDS Chapter Drives Innovation: From Distinguished Lectures to a New Student Branch [Chapters]","authors":"Vikas Kumar","doi":"10.1109/MSSC.2026.3708330","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3708330","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 3","pages":"96-97"},"PeriodicalIF":0.0,"publicationDate":"2026-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11659707","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148781915","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Member Discounts IEEE会员优惠
IEEE Solid-State Circuits Magazine Pub Date : 2026-06-01 Epub Date: 2026-08-19 DOI: 10.1109/MSSC.2026.3717510
{"title":"IEEE Member Discounts","authors":"","doi":"10.1109/MSSC.2026.3717510","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3717510","url":null,"abstract":"","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 3","pages":"C4-C4"},"PeriodicalIF":0.0,"publicationDate":"2026-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11659719","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148781508","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
2025–2026 SSCS Student Shirt Design Contest [Society News] 2025-2026 SSCS学生衬衫设计大赛[社会新闻]
IEEE Solid-State Circuits Magazine Pub Date : 2026-02-01 Epub Date: 2026-06-22 DOI: 10.1109/MSSC.2026.3689794
John Greco
{"title":"2025–2026 SSCS Student Shirt Design Contest [Society News]","authors":"John Greco","doi":"10.1109/MSSC.2026.3689794","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3689794","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 2","pages":"112-112"},"PeriodicalIF":0.0,"publicationDate":"2026-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11574819","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148514673","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Artificial Intelligence-Assisted IC Design: Large language models and agentic systems for modern chip design 人工智能辅助集成电路设计：现代芯片设计的大型语言模型和代理系统
IEEE Solid-State Circuits Magazine Pub Date : 2026-02-01 Epub Date: 2026-06-22 DOI: 10.1109/MSSC.2026.3668144
Chenhui Deng;Chia-Tung Ho;Haoxing Ren
{"title":"Artificial Intelligence-Assisted IC Design: Large language models and agentic systems for modern chip design","authors":"Chenhui Deng;Chia-Tung Ho;Haoxing Ren","doi":"10.1109/MSSC.2026.3668144","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3668144","url":null,"abstract":"Artificial intelligence (AI) is increasingly influencing IC design, driven by the growing complexity of modern systems and the need for higher design productivity. Among recent AI advances, large language models (LLMs) have emerged as a particularly powerful class of techniques for AI-assisted IC design, enabling high-level reasoning over natural language specifications, hardware description languages, and electronic design automation (EDA) tool feedback. This article provides an overview of recent progress in AI-assisted IC design, with a primary focus on LLM-based approaches.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 2","pages":"41-51"},"PeriodicalIF":0.0,"publicationDate":"2026-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148514893","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Record Turnout at SSCS Chapters Appreciation Luncheon During ISSCC 2026 [Society News] isscc2026分会答谢午餐会出席人数创历史新高[社会新闻]
IEEE Solid-State Circuits Magazine Pub Date : 2026-02-01 Epub Date: 2026-06-22 DOI: 10.1109/MSSC.2026.3689811
Alvin Loke;Alec Antunes
{"title":"Record Turnout at SSCS Chapters Appreciation Luncheon During ISSCC 2026 [Society News]","authors":"Alvin Loke;Alec Antunes","doi":"10.1109/MSSC.2026.3689811","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3689811","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 2","pages":"105-106"},"PeriodicalIF":0.0,"publicationDate":"2026-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11574828","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148516745","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Solid-State Circuits Take Root in Colombia: The UIS SSCS Student Chapter [Chapters] 固态电路在哥伦比亚扎根：美国SSCS学生分会[章节]
IEEE Solid-State Circuits Magazine Pub Date : 2026-02-01 Epub Date: 2026-06-22 DOI: 10.1109/MSSC.2026.3690395
Javier Ferney Ardila Ochoa
{"title":"Solid-State Circuits Take Root in Colombia: The UIS SSCS Student Chapter [Chapters]","authors":"Javier Ferney Ardila Ochoa","doi":"10.1109/MSSC.2026.3690395","DOIUrl":"https://doi.org/10.1109/MSSC.2026.3690395","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"18 2","pages":"126-127"},"PeriodicalIF":0.0,"publicationDate":"2026-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11574852","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148517737","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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