{"title":"Beyond ADPLLs for RF and mm-Wave Frequency Synthesis: Watching out for new techniques: oversampling-reference and charge-sharing locking","authors":"Teerachot Siriburanon;Robert Bogdan Staszewski","doi":"10.1109/MSSC.2024.3496612","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3496612","url":null,"abstract":"To address the relentless increase in data rates in wireless communication systems employing advanced modulation schemes, such as 5G frequency range (FR) 2 [see <xref>Figure 1(a)</xref>], generating mm-wave signals with minimal integrated phase noise (PN) or RMS jitter is of paramount concern <xref>[1]</xref>. <xref>Figure 1(b)</xref> specifies the required jitter to achieve the targeted EVM performance. For instance, for an EVM of less than 3.5%, as needed by a 256-QAM 28-GHz carrier, the RMS jitter contributed by the LO must be below 200 fs. As the carrier frequency or the symbol constellation density increases, the required RMS jitter becomes even more stringent. For example, 1024 QAM at 39 GHz demands an RMS jitter of <50>[2]</xref>, <xref>[3]</xref>, <xref>[4]</xref>.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 1","pages":"69-85"},"PeriodicalIF":0.0,"publicationDate":"2025-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143184345","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"SSCS Circuit Analysis and Design Contest: The Winners of the 2024 Edition [Society News]","authors":"Aeisha VanBuskirk;Jakob Finkbeiner","doi":"10.1109/MSSC.2024.3490212","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3490212","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 1","pages":"119-122"},"PeriodicalIF":0.0,"publicationDate":"2025-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10857725","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143183823","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Through the Looking Glass—The 2025 Edition: Trends in solid-state circuits from ISSCC","authors":"Shahriar Mirabbasi;Laura C. Fujino","doi":"10.1109/MSSC.2024.3505093","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3505093","url":null,"abstract":"The International Solid-State Circuits Conference (ISSCC) is the flagship conference of the IEEE Solid-State Circuits Society. The theme for ISSCC 2025 is “The Silicon Engine Driving the Artificial Intelligence (AI) Revolution.” This theme further highlights how today’s IC research and development can contribute to the solid-state foundation upon which AI is rapidly evolving and pervasively entering people’s lives. ISSCC 2025 is the 72nd edition of ISSCC and is more than ever focused on innovation, in particular, innovative solutions that facilitate the efficient implementation of AI algorithms. To enhance and support the widespread use of AI, ISSCC 2025 promotes and shares new circuit ideas that advance the state of the art in IC design and further equip AI systems with improved functionality and efficiency.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 1","pages":"97-118"},"PeriodicalIF":0.0,"publicationDate":"2025-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143184348","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"SSCS INSPIRE Program: Innovations in Space Electronics: From Basic CMOS Blocks to Advanced ASICs [Society News]","authors":"Brahim Mezghani;Sedki Amor","doi":"10.1109/MSSC.2024.3494172","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3494172","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 1","pages":"128-129"},"PeriodicalIF":0.0,"publicationDate":"2025-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10857728","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143184350","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Miller’s Secret [Shop Talk: What you didn’t Learn in School]","authors":"Chris Mangelsdorf","doi":"10.1109/MSSC.2024.3503792","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3503792","url":null,"abstract":"Miller compensation of feedback loops is ubiquitous. And it’s everywhere. Which is to say it’s widespread. Pervasive even. One could go so far as to say it’s omnipresent. But no matter how you say it, it’s hard to avoid the name Miller when talking about frequency compensation of feedback loops. (IEEE <italic>Xplore</i> lists 83 papers with “Miller Compensation” in the title alone.)","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 1","pages":"21-27"},"PeriodicalIF":0.0,"publicationDate":"2025-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143184059","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"IEEE SSCS Oregon Chapter Fall 2024: Showcasing Pioneering Research and Innovation [Chapters]","authors":"Deepak Dasalukunte;Richard Dorrance","doi":"10.1109/MSSC.2024.3498133","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3498133","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 1","pages":"156-156"},"PeriodicalIF":0.0,"publicationDate":"2025-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10857611","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143105599","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Promoting Innovation and Excellence Through Academic Exchange and Collaboration in Microwave Field [Chapters]","authors":"Kaixue Ma;Yu Luo;Fanyi Meng;Feng Feng","doi":"10.1109/MSSC.2024.3497618","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3497618","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 1","pages":"143-144"},"PeriodicalIF":0.0,"publicationDate":"2025-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10857699","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143105828","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"CEDA Currents [IEEE NEWS]","authors":"Danielle Marinese","doi":"10.1109/MSSC.2024.3494193","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3494193","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 1","pages":"139-141"},"PeriodicalIF":0.0,"publicationDate":"2025-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10857731","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143105830","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}