{"title":"基于SRAM和edram的内存计算设计、加速器和评估框架:宏观级和系统级优化与评估","authors":"Yifan He;Xiaofeng Hu;Hongyang Jia;Jae-sun Seo","doi":"10.1109/MSSC.2025.3549358","DOIUrl":null,"url":null,"abstract":"Compute-in-memory (CIM) has shown great potential in efficiently processing high-dimensional data over traditional von Neumann architectures, becoming a candidate computing fabric for next-generation AI. This has motivated the rapid development of CIM prototypes and deployments in different approaches, among which SRAM- and eDRAM-based CIM have drawn significant attention due to their flexibility and feasibility. At the time of a decade after the first CIM implementation, it is necessary to review the technical approaches and revisit the new findings behind complicated prototypes. Macro-level innovations such as precise current-based computation and deeply coupled algorithm-circuit co-optimization open up the headroom for efficiency vs. signal-to-noise ratio (SNR) tradeoffs in analog and digital CIM, respectively. Furthermore, diverse architectural configurations integrating CIM macros into systemon- chips have demonstrated scale-out of computing capacity. However, architectural integration of CIM still faces challenges from digital peripherals, memory reloading, and communication. These necessitate hardware-software co-designed mappings and, more importantly, comprehensive and fair evaluation frameworks.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"17 2","pages":"39-48"},"PeriodicalIF":0.0000,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"SRAM- and eDRAM-Based Compute-in-Memory Designs, Accelerators, and Evaluation Frameworks: Macro-Level and System-Level Optimization and Evaluation\",\"authors\":\"Yifan He;Xiaofeng Hu;Hongyang Jia;Jae-sun Seo\",\"doi\":\"10.1109/MSSC.2025.3549358\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Compute-in-memory (CIM) has shown great potential in efficiently processing high-dimensional data over traditional von Neumann architectures, becoming a candidate computing fabric for next-generation AI. This has motivated the rapid development of CIM prototypes and deployments in different approaches, among which SRAM- and eDRAM-based CIM have drawn significant attention due to their flexibility and feasibility. At the time of a decade after the first CIM implementation, it is necessary to review the technical approaches and revisit the new findings behind complicated prototypes. Macro-level innovations such as precise current-based computation and deeply coupled algorithm-circuit co-optimization open up the headroom for efficiency vs. signal-to-noise ratio (SNR) tradeoffs in analog and digital CIM, respectively. Furthermore, diverse architectural configurations integrating CIM macros into systemon- chips have demonstrated scale-out of computing capacity. However, architectural integration of CIM still faces challenges from digital peripherals, memory reloading, and communication. These necessitate hardware-software co-designed mappings and, more importantly, comprehensive and fair evaluation frameworks.\",\"PeriodicalId\":100636,\"journal\":{\"name\":\"IEEE Solid-State Circuits Magazine\",\"volume\":\"17 2\",\"pages\":\"39-48\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2025-06-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Solid-State Circuits Magazine\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/11044995/\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Solid-State Circuits Magazine","FirstCategoryId":"1085","ListUrlMain":"https://ieeexplore.ieee.org/document/11044995/","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
SRAM- and eDRAM-Based Compute-in-Memory Designs, Accelerators, and Evaluation Frameworks: Macro-Level and System-Level Optimization and Evaluation
Compute-in-memory (CIM) has shown great potential in efficiently processing high-dimensional data over traditional von Neumann architectures, becoming a candidate computing fabric for next-generation AI. This has motivated the rapid development of CIM prototypes and deployments in different approaches, among which SRAM- and eDRAM-based CIM have drawn significant attention due to their flexibility and feasibility. At the time of a decade after the first CIM implementation, it is necessary to review the technical approaches and revisit the new findings behind complicated prototypes. Macro-level innovations such as precise current-based computation and deeply coupled algorithm-circuit co-optimization open up the headroom for efficiency vs. signal-to-noise ratio (SNR) tradeoffs in analog and digital CIM, respectively. Furthermore, diverse architectural configurations integrating CIM macros into systemon- chips have demonstrated scale-out of computing capacity. However, architectural integration of CIM still faces challenges from digital peripherals, memory reloading, and communication. These necessitate hardware-software co-designed mappings and, more importantly, comprehensive and fair evaluation frameworks.