基于SRAM和edram的内存计算设计、加速器和评估框架:宏观级和系统级优化与评估

Yifan He;Xiaofeng Hu;Hongyang Jia;Jae-sun Seo
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引用次数: 0

摘要

内存计算(CIM)在高效处理高维数据方面比传统的冯·诺依曼架构显示出巨大的潜力,成为下一代人工智能的候选计算结构。这推动了CIM原型的快速发展和不同方法的部署,其中基于SRAM和edram的CIM由于其灵活性和可行性而引起了极大的关注。在第一个CIM实现十年之后,有必要回顾技术方法并重新审视复杂原型背后的新发现。宏观层面的创新,如精确的基于电流的计算和深度耦合算法-电路协同优化,分别为模拟和数字CIM的效率与信噪比(SNR)权衡开辟了空间。此外,将CIM宏集成到系统芯片中的各种体系结构配置已经证明了计算能力的横向扩展。然而,CIM的体系结构集成仍然面临来自数字外设、内存重新加载和通信的挑战。这就需要软硬件协同设计映射,更重要的是,需要全面而公平的评估框架。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
SRAM- and eDRAM-Based Compute-in-Memory Designs, Accelerators, and Evaluation Frameworks: Macro-Level and System-Level Optimization and Evaluation
Compute-in-memory (CIM) has shown great potential in efficiently processing high-dimensional data over traditional von Neumann architectures, becoming a candidate computing fabric for next-generation AI. This has motivated the rapid development of CIM prototypes and deployments in different approaches, among which SRAM- and eDRAM-based CIM have drawn significant attention due to their flexibility and feasibility. At the time of a decade after the first CIM implementation, it is necessary to review the technical approaches and revisit the new findings behind complicated prototypes. Macro-level innovations such as precise current-based computation and deeply coupled algorithm-circuit co-optimization open up the headroom for efficiency vs. signal-to-noise ratio (SNR) tradeoffs in analog and digital CIM, respectively. Furthermore, diverse architectural configurations integrating CIM macros into systemon- chips have demonstrated scale-out of computing capacity. However, architectural integration of CIM still faces challenges from digital peripherals, memory reloading, and communication. These necessitate hardware-software co-designed mappings and, more importantly, comprehensive and fair evaluation frameworks.
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