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IEEE Solid-State Circuits Magazine最新文献

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You Stink at Design Reviews! [Shop Talk: What You didn’t Learn In School] 你的设计评论很烂！[店谈：你在学校没学到的东西］
IEEE Solid-State Circuits Magazine Pub Date : 2024-11-13 DOI: 10.1109/MSSC.2024.3473746
Chris Mangelsdorf
{"title":"You Stink at Design Reviews! [Shop Talk: What You didn’t Learn In School]","authors":"Chris Mangelsdorf","doi":"10.1109/MSSC.2024.3473746","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3473746","url":null,"abstract":"What are friends for if they don’t tactfully let you know when you’re doing something wrong? Without them, you’d be like the fabled emperor and his nonexistent new clothes. It’s much better if someone—a trusted friend—drops you a gentle hint that things are not right. Okay, so here comes your gentle hint.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"16 4","pages":"21-28"},"PeriodicalIF":0.0,"publicationDate":"2024-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142636532","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Feedback IEEE 反馈
IEEE Solid-State Circuits Magazine Pub Date : 2024-11-13 DOI: 10.1109/MSSC.2024.3486128
{"title":"IEEE Feedback","authors":"","doi":"10.1109/MSSC.2024.3486128","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3486128","url":null,"abstract":"","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"16 4","pages":"7-7"},"PeriodicalIF":0.0,"publicationDate":"2024-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10752690","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142636548","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Contributors 贡献者
IEEE Solid-State Circuits Magazine Pub Date : 2024-11-13 DOI: 10.1109/MSSC.2024.3473469
{"title":"Contributors","authors":"","doi":"10.1109/MSSC.2024.3473469","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3473469","url":null,"abstract":"","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"16 4","pages":"3-3"},"PeriodicalIF":0.0,"publicationDate":"2024-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10752716","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142636381","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Proceedings 电气和电子工程师学会论文集
IEEE Solid-State Circuits Magazine Pub Date : 2024-11-13 DOI: 10.1109/MSSC.2024.3485958
{"title":"IEEE Proceedings","authors":"","doi":"10.1109/MSSC.2024.3485958","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3485958","url":null,"abstract":"","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"16 4","pages":"C3-C3"},"PeriodicalIF":0.0,"publicationDate":"2024-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10752725","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142636416","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Silicon Photonic-CMOS Transceiver for 5G Radio-Over-Fiber Communications: An emerging highly-integrated heterogeneous solution for future high-speed wireless networks 用于 5G 光纤无线电通信的硅光子-CMOS 收发器：面向未来高速无线网络的新兴高度集成异构解决方案
IEEE Solid-State Circuits Magazine Pub Date : 2024-11-13 DOI: 10.1109/MSSC.2024.3448348
Ming-Chang M. Lee;Kai-Ming Feng;Jenny Yi-Chun Liu
{"title":"A Silicon Photonic-CMOS Transceiver for 5G Radio-Over-Fiber Communications: An emerging highly-integrated heterogeneous solution for future high-speed wireless networks","authors":"Ming-Chang M. Lee;Kai-Ming Feng;Jenny Yi-Chun Liu","doi":"10.1109/MSSC.2024.3448348","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3448348","url":null,"abstract":"To provide reliable, low latency, high data rate connections for 5G mobile networks and beyond, millimeter-wave spectrum is adopted due to its wide available bandwidth. For the mobile fronthauling, a seamless combination of optical fiber and wireless link is an attractive solution. In this article, a millimeter-wave-over-fiber system is demonstrated based on an analog radio-over-fiber architecture that accommodates a variety of modulation formats for different wireless applications and, hence, can be practically transparent to the wireless signal formats. This millimeter-wave-over-fiber heterogeneous system is an efficient remote antenna prototype with a small form factor supporting future wireless networks. The core of the system features high-speed optical components, fiber array, wireless electronic front-end ICs, and patch antenna array. A high-speed Ge photodetector and a SiGe electro-absorption modulator are bonded to a CMOS chip consisting of a transimpedance amplifier, a power amplifier, a low-noise amplifier, and a modulator driver. Considering 28-GHz 16-QAM OFDM signals, the opto-electronic transmitter and receiver achieve an error vector magnitude of 10% and 7.5%, respectively, satisfying 5G requirements.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"16 4","pages":"41-53"},"PeriodicalIF":0.0,"publicationDate":"2024-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142636417","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Recent Activities of the IEEE SSCS Hong Kong Student Branch Chapter [Chapters] IEEE SSCS 香港学生分会近期活动 [章节］
IEEE Solid-State Circuits Magazine Pub Date : 2024-11-13 DOI: 10.1109/MSSC.2024.3460093
Chongyun Zhang;Zilu Liu;Shuo Feng;Ruitao Ma;C. Patrick Yue
{"title":"Recent Activities of the IEEE SSCS Hong Kong Student Branch Chapter [Chapters]","authors":"Chongyun Zhang;Zilu Liu;Shuo Feng;Ruitao Ma;C. Patrick Yue","doi":"10.1109/MSSC.2024.3460093","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3460093","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"16 4","pages":"125-126"},"PeriodicalIF":0.0,"publicationDate":"2024-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10752752","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142636529","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Q&A: With SSCS Women in Circuits [Society News] 问与答：与 SSCS "电路中的女性 "一起 [学会新闻］
IEEE Solid-State Circuits Magazine Pub Date : 2024-11-13 DOI: 10.1109/MSSC.2024.3457048
Shubha Bommalingaiahnapallya;Munirah Boufarsan;Zeynep Deniz;Wanda Gass;Awani Khodkumbhe;Alicia Klinefelter;Kurinjimalar L.;Deeksha Lal;Shalini Lal;Huichu Liu;Zeynep Lulec;Sukanya S. Meher;Sonja Nedeljkovic;Nimasha H. Pilippange;Kamala R. Sadagopalan
{"title":"Q&A: With SSCS Women in Circuits [Society News]","authors":"Shubha Bommalingaiahnapallya;Munirah Boufarsan;Zeynep Deniz;Wanda Gass;Awani Khodkumbhe;Alicia Klinefelter;Kurinjimalar L.;Deeksha Lal;Shalini Lal;Huichu Liu;Zeynep Lulec;Sukanya S. Meher;Sonja Nedeljkovic;Nimasha H. Pilippange;Kamala R. Sadagopalan","doi":"10.1109/MSSC.2024.3457048","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3457048","url":null,"abstract":"I try to give myself the permission to mourn. Itis a phase and will get better. Reach out for support when needed","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"16 4","pages":"117-117"},"PeriodicalIF":0.0,"publicationDate":"2024-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142636354","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
CEDA Currents [IEEE News] CEDA 潮流 [IEEE 新闻］
IEEE Solid-State Circuits Magazine Pub Date : 2024-11-13 DOI: 10.1109/MSSC.2024.3457109
Danielle Marinese
{"title":"CEDA Currents [IEEE News]","authors":"Danielle Marinese","doi":"10.1109/MSSC.2024.3457109","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3457109","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"16 4","pages":"130-132"},"PeriodicalIF":0.0,"publicationDate":"2024-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10752798","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142636379","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Circuit-Level Techniques for Side-Channel Attack Resilience: A tutorial 抗侧信道攻击的电路级技术：教程
IEEE Solid-State Circuits Magazine Pub Date : 2024-11-13 DOI: 10.1109/MSSC.2024.3444740
Shreyas Sen;Archisman Ghosh
{"title":"Circuit-Level Techniques for Side-Channel Attack Resilience: A tutorial","authors":"Shreyas Sen;Archisman Ghosh","doi":"10.1109/MSSC.2024.3444740","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3444740","url":null,"abstract":"Cryptographic algorithms, despite their computational security, can inadvertently reveal critical information through side channels such as power consumption and electromagnetic radiation. For over two decades, the Solid State Circuits Society (SSCS) community has been investigating low-overhead, generic physical countermeasures that extend beyond provably secure architectural and masking techniques. This paper summarizes prominent circuit-level techniques designed to mitigate side-channel attacks (SCA). Additionally, this work discusses recently introduced attack detectors those demonstrate the potential for further reducing overhead by employing detection and mitigation strategies, thereby eliminating the need for always-on countermeasures. This paper also proposes future directions for circuit-level countermeasures.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"16 4","pages":"96-108"},"PeriodicalIF":0.0,"publicationDate":"2024-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142636382","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Joint Workshop on Sustainable Innovation by Tsinghua University, University of Macau, and Hong Kong University of Science and Technology [Chapters] 清华大学、澳门大学和香港科技大学可持续创新联合研讨会[章节］
IEEE Solid-State Circuits Magazine Pub Date : 2024-11-13 DOI: 10.1109/MSSC.2024.3460091
Jiaxin Lei;Shuo Feng;Mo Huang;Milin Zhang
{"title":"Joint Workshop on Sustainable Innovation by Tsinghua University, University of Macau, and Hong Kong University of Science and Technology [Chapters]","authors":"Jiaxin Lei;Shuo Feng;Mo Huang;Milin Zhang","doi":"10.1109/MSSC.2024.3460091","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3460091","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"16 4","pages":"123-124"},"PeriodicalIF":0.0,"publicationDate":"2024-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10752809","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142636502","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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