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IEEE Open Journal of the Solid-State Circuits Society最新文献

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Sensor Interfaces Meeting 2022 2022年传感器接口会议
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2022-01-01 DOI: 10.1109/OJSSCS.2022.3164490
{"title":"Sensor Interfaces Meeting 2022","authors":"","doi":"10.1109/OJSSCS.2022.3164490","DOIUrl":"https://doi.org/10.1109/OJSSCS.2022.3164490","url":null,"abstract":"","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"2 ","pages":"302-302"},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/9733783/10094270.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"50327145","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Open Journal of the Solid-State Circuits Society Publication Information IEEE固态电路学会公开期刊出版信息
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2022-01-01 DOI: 10.1109/OJSSCS.2022.3155919
{"title":"IEEE Open Journal of the Solid-State Circuits Society Publication Information","authors":"","doi":"10.1109/OJSSCS.2022.3155919","DOIUrl":"https://doi.org/10.1109/OJSSCS.2022.3155919","url":null,"abstract":"","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"2 ","pages":"C2-C2"},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/9733783/10094267.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"67868221","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
BioCas 2021 BioCas 2021
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2022-01-01 DOI: 10.1109/OJSSCS.2021.3136369
{"title":"BioCas 2021","authors":"","doi":"10.1109/OJSSCS.2021.3136369","DOIUrl":"https://doi.org/10.1109/OJSSCS.2021.3136369","url":null,"abstract":"","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"2 ","pages":"301-301"},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/9733783/10094287.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"50415866","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
2022 Index IEEE Open Journal of the Solid-State Circuits Society Vol. 2 2022年索引IEEE固态电路学会开放期刊第2卷
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2022-01-01 DOI: 10.1109/OJSSCS.2023.3265562
{"title":"2022 Index IEEE Open Journal of the Solid-State Circuits Society Vol. 2","authors":"","doi":"10.1109/OJSSCS.2023.3265562","DOIUrl":"https://doi.org/10.1109/OJSSCS.2023.3265562","url":null,"abstract":"","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"2 ","pages":"305-312"},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/9733783/10097449.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"50327144","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Call for Papers: RFIC 2023 论文征集：RFIC 2023
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2022-01-01 DOI: 10.1109/OJSSCS.2022.3218838
{"title":"Call for Papers: RFIC 2023","authors":"","doi":"10.1109/OJSSCS.2022.3218838","DOIUrl":"https://doi.org/10.1109/OJSSCS.2022.3218838","url":null,"abstract":"","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"2 ","pages":"303-304"},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/9733783/10094275.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"50415867","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Open Journal of the Solid-State Circuits Society Instructions for Authors IEEE固态电路学会开放期刊作者须知
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2022-01-01 DOI: 10.1109/OJSSCS.2023.3234383
{"title":"IEEE Open Journal of the Solid-State Circuits Society Instructions for Authors","authors":"","doi":"10.1109/OJSSCS.2023.3234383","DOIUrl":"https://doi.org/10.1109/OJSSCS.2023.3234383","url":null,"abstract":"These instructions give guidelines for preparing papers for this publication. Presents information for authors publishing in this journal.","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"2 ","pages":"C3-C4"},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/9733783/10006346.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"50415868","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Guest Editorial Special Section on Electronic–Photonic Integrated Circuits (EPIC) 电子-光子集成电路（EPIC）客座编辑特刊
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2021-12-14 DOI: 10.1109/OJSSCS.2021.3130313
Firooz Aflatouni
{"title":"Guest Editorial Special Section on Electronic–Photonic Integrated Circuits (EPIC)","authors":"Firooz Aflatouni","doi":"10.1109/OJSSCS.2021.3130313","DOIUrl":"https://doi.org/10.1109/OJSSCS.2021.3130313","url":null,"abstract":"Electronic-photonic co-design, where the large bandwidth available around the optical carrier, high quality factor optical resonators, low-loss optical interconnects and signal distribution, and highly sensitive photonic sensors are concurrently utilized with sophisticated analog, radio frequency, digital, and mixed signal electronic circuits has improved the performance of many systems for applications ranging from sensing and imaging to communication and computation.","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"1 ","pages":"196-197"},"PeriodicalIF":0.0,"publicationDate":"2021-12-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/8816720/09650620.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"67861565","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Hybrid Time-of-Flight Image Sensors for Middle-Range Outdoor Applications 用于中程户外应用的混合飞行时间图像传感器
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2021-12-07 DOI: 10.1109/OJSSCS.2021.3133224
Shoji Kawahito;Keita Yasutomi;Kamel Mars
{"title":"Hybrid Time-of-Flight Image Sensors for Middle-Range Outdoor Applications","authors":"Shoji Kawahito;Keita Yasutomi;Kamel Mars","doi":"10.1109/OJSSCS.2021.3133224","DOIUrl":"https://doi.org/10.1109/OJSSCS.2021.3133224","url":null,"abstract":"This paper introduces a new series of time-of-flight (TOF) range image sensors that can be used for outdoor middle-range (10m to 100m) applications by employing a small duty-cycle modulated light pulse with a relatively high optical peak power. This set of TOF sensors is referred to here as a hybrid TOF (hTOF) image sensor. The hTOF image sensor is based on the indirect TOF measurement principle but simultaneously uses the direct TOF concept for coarse measurements. Compared to conventional indirect TOF image sensors for outdoor middle-range applications, the hTOF image sensor has a distinct advantage due to the reduction of capturing ambient light charge. To show the potential of the hTOF image sensor for outdoor middle-range operation, a model of estimating distance precision of hTOF image sensors is built and applied it by using possible sensor specifications to estimate the distance precision of the hTOF range camera in 10m, 20m and 40m measurements under the ambient-light condition of 100klux and its feasibility is discussed. In outdoor 10m-range measurements, the advantage of hTOF image sensors compared to the conventional indirect TOF image sensors is discussed by considering the amount of captured ambient-light charge in pixels.","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"2 ","pages":"38-49"},"PeriodicalIF":0.0,"publicationDate":"2021-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/9733783/09638992.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"67868117","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Challenges and Trends of Nonvolatile In-Memory-Computation Circuits for AI Edge Devices 用于AI边缘设备的非易失性内存计算电路的挑战和趋势
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2021-10-26 DOI: 10.1109/OJSSCS.2021.3123287
Je-Min Hung;Chuan-Jia Jhang;Ping-Chun Wu;Yen-Cheng Chiu;Meng-Fan Chang
{"title":"Challenges and Trends of Nonvolatile In-Memory-Computation Circuits for AI Edge Devices","authors":"Je-Min Hung;Chuan-Jia Jhang;Ping-Chun Wu;Yen-Cheng Chiu;Meng-Fan Chang","doi":"10.1109/OJSSCS.2021.3123287","DOIUrl":"https://doi.org/10.1109/OJSSCS.2021.3123287","url":null,"abstract":"Nonvolatile memory (NVM)-based computing-in-memory (nvCIM) is a promising candidate for artificial intelligence (AI) edge devices to overcome the latency and energy consumption imposed by the movement of data between memory and processors under the von Neumann architecture. This paper explores the background and basic approaches to nvCIM implementation, including input methodologies, weight formation and placement, and readout and quantization methods. This paper outlines the major challenges in the further development of nvCIM macros and reviews trends in recent silicon-verified devices.","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"1 ","pages":"171-183"},"PeriodicalIF":0.0,"publicationDate":"2021-10-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/8816720/09586071.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"67860285","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 22
Fast Validation of Mixed-Signal SoCs 混合信号SoC的快速验证
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2021-10-25 DOI: 10.1109/OJSSCS.2021.3122397
Daniel Stanley;Can Wang;Sung-Jin Kim;Steven Herbst;Jaeha Kim;Mark Horowitz
{"title":"Fast Validation of Mixed-Signal SoCs","authors":"Daniel Stanley;Can Wang;Sung-Jin Kim;Steven Herbst;Jaeha Kim;Mark Horowitz","doi":"10.1109/OJSSCS.2021.3122397","DOIUrl":"https://doi.org/10.1109/OJSSCS.2021.3122397","url":null,"abstract":"Today’s mixed-signal SoCs are challenging to validate. Running enough test vectors often requires the use of event-driven simulation and hardware emulation, which in turn necessitates the creation of analog behavioral models. This paper reviews different approaches proposed to address that modeling challenge, and shows how they can be divided by the methods used to solve for analog circuit values, represent analog waveforms, and validate analog functional models. We illustrate the power of these techniques as applied to a 16 Gb/s PHY, demonstrating a 10,\u0000<inline-formula> <tex-math>$000times $ </tex-math></inline-formula>\u0000 speedup vs. SPICE simulation using event-driven models in Verilog simulation, and a further 5,\u0000<inline-formula> <tex-math>$000times $ </tex-math></inline-formula>\u0000 speedup using synthesizable analog models in FPGA emulation.","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"1 ","pages":"184-195"},"PeriodicalIF":0.0,"publicationDate":"2021-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/8816720/09585345.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"67860286","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
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