IEEE Letters on Electromagnetic Compatibility Practice and Applications最新文献

{"title":"A Source Emulation Method Based on 2-Tone Sinusoidal Jitter Modeling for High-Speed Serial-Link Compliance Testing","authors":"Baekseok Ko;Eakhwan Song","doi":"10.1109/LEMCPA.2024.3417008","DOIUrl":"https://doi.org/10.1109/LEMCPA.2024.3417008","url":null,"abstract":"In this letter, we propose a compliance test emulation method for high-speed serial links based on source and channel modeling. The source and channel are characterized by using the proposed 2-tone sinusoidal jitter (SJ) modeling and impulse responses, respectively. The proposed 2-tone model represents periodic jitter components which include phase noise and power supply-induced jitter (PSIJ). The proposed method enables a sink device-only compliance test by effectively emulating the source devices and channels, which reduces the test time and cost. The effectiveness of the proposed link emulation method is demonstrated by comparing its performance with that of conventional compliance tests.","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"6 3","pages":"102-105"},"PeriodicalIF":0.9,"publicationDate":"2024-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142143818","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Coupling on RF Cable Outer Conductors in Diffuse Field Environments","authors":"Y. Berthoud;J.-M. Duchamp;A. Niembro-Martin;E. Dreina;F. Ndagijimana","doi":"10.1109/LEMCPA.2024.3414855","DOIUrl":"https://doi.org/10.1109/LEMCPA.2024.3414855","url":null,"abstract":"This letter deals with the electromagnetic (EM) coupling on the outer conductor of radiofrequency (RF) cables in reverberant environments. It highlights the need to consider measurement cables, more generally any wire, in a power balance (PWB) model as they can induce non-neglectable coupling in the system. A model to integrate cables running through multiple cavities is also proposed and validated on a 3-cavity configuration. Finally, we compare two PWB models of a switchgear assembly: one excluding wires and the other including them.","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"6 3","pages":"106-110"},"PeriodicalIF":0.9,"publicationDate":"2024-06-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142143761","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A Practical RF Coupling FPC Design for Evaluating High-Speed Interface Immunity in Smart Phones","authors":"Xingguo Jiang;Songsong Zhang;Shui Liu","doi":"10.1109/LEMCPA.2024.3392530","DOIUrl":"https://doi.org/10.1109/LEMCPA.2024.3392530","url":null,"abstract":"This letter addresses the importance of evaluating the radio-frequency immunity (RFI) absolute level at high-speed interfaces in a smart phone product. In this letter, a practical radio-frequency coupling flexible-printed circuit (FPC) design was introduced. It can be adapted to a device under test (DUT) easily, comparing the high-speed RFI level margin across different DUTs. The proposed evaluation method has been tested, and results are provided for consideration.","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"6 2","pages":"67-71"},"PeriodicalIF":0.0,"publicationDate":"2024-04-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141164684","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Novel Designs of SIW-Based Frequency-Selective Surfaces for Electromagnetic Shielding","authors":"Priyanka Das;B. T. P. Madhav","doi":"10.1109/LEMCPA.2024.3392012","DOIUrl":"https://doi.org/10.1109/LEMCPA.2024.3392012","url":null,"abstract":"The performance of the substrate-integrated waveguide (SIW)-based frequency-selective surface (FSS) is better than that of the traditional FSSs. Based on SIW cavity (SIWC) technology, two different types of ultrathin (\u0000<inline-formula> <tex-math>$0.01boldsymbol {lambda }_{mathbf {0}}$ </tex-math></inline-formula>\u0000) band-stop FSSs have been proposed for dual-band and broadband response. The first design combines two types of FSS slots based on the SIWC to display distinct characteristics in terms of their cavity designs and performance. The design consists of a Y-shaped slot in conjunction with an annular slot within a circular cavity. Consequently, the structure exhibits performance features of a sharp roll-off and dual band-stop response across 1.7–2.7 GHz and 4.6–5.6 GHz with a fractional bandwidth 45% and 20%, respectively. The second design comprises a slotted rectangular SIW cavity-based FSS which exhibits a wide band-reject response across 2.9–19.8 GHz with a fractional bandwidth of 149%. To validate the concept, tangible prototypes have been fabricated, and their functionality has been verified by measurements. The estimated and experimental results show a strong correlation.","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"6 2","pages":"62-66"},"PeriodicalIF":0.0,"publicationDate":"2024-04-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141164686","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"The Significance of Cable and Nonlinear Loads to Losses, Voltage Drop, and Harmonics in Remote Off-Grid Systems","authors":"Ilman Sulaeman Islahuzzaman;Muhammad Imam Sudrajat;Niek Moonen;Jelena Popovic;Frank Leferink","doi":"10.1109/LEMCPA.2024.3387935","DOIUrl":"https://doi.org/10.1109/LEMCPA.2024.3387935","url":null,"abstract":"Powerquality (PQ) is part of low-frequency electromagnetic interference (EMI), which could be present in any system. It is known that nonlinear loads pose PQ problems in large grids, but this problem is even more prevalent in smaller grids. However, the typical methods in addressing PQ problems might not be feasible in remote areas because of their challenging characteristics; hence, alternative approaches are needed. This letter investigates the significance of the cable characteristics and the nonlinear load current amplitude \u0000&lt;inline-formula&gt; &lt;tex-math&gt;$(I_{mathrm { load}})$ &lt;/tex-math&gt;&lt;/inline-formula&gt;\u0000 on the power losses \u0000&lt;inline-formula&gt; &lt;tex-math&gt;$(P_{mathrm { loss}})$ &lt;/tex-math&gt;&lt;/inline-formula&gt;\u0000, voltage drop \u0000&lt;inline-formula&gt; &lt;tex-math&gt;$(V_{mathrm { drop}})$ &lt;/tex-math&gt;&lt;/inline-formula&gt;\u0000, and total voltage harmonic distortions (THD\u0000&lt;inline-formula&gt; &lt;tex-math&gt;$_{V}$ &lt;/tex-math&gt;&lt;/inline-formula&gt;\u0000) to effectively minimize them. The investigated cable parameters were based on the typical cable \u0000&lt;inline-formula&gt; &lt;tex-math&gt;$2times 16$ &lt;/tex-math&gt;&lt;/inline-formula&gt;\u0000 mm2 NFA2X. A high value of \u0000&lt;inline-formula&gt; &lt;tex-math&gt;$P_{mathrm { loss}}$ &lt;/tex-math&gt;&lt;/inline-formula&gt;\u0000, \u0000&lt;inline-formula&gt; &lt;tex-math&gt;$V_{mathrm { drop}}$ &lt;/tex-math&gt;&lt;/inline-formula&gt;\u0000, and THD\u0000&lt;inline-formula&gt; &lt;tex-math&gt;$_{V}$ &lt;/tex-math&gt;&lt;/inline-formula&gt;\u0000 was found when the loads were highly nonlinear and the cable length was 1 km. A sensitivity showed that \u0000&lt;inline-formula&gt; &lt;tex-math&gt;$R_{mathrm { cable}}$ &lt;/tex-math&gt;&lt;/inline-formula&gt;\u0000 and \u0000&lt;inline-formula&gt; &lt;tex-math&gt;$I_{mathrm { load}}$ &lt;/tex-math&gt;&lt;/inline-formula&gt;\u0000 were more significant than \u0000&lt;inline-formula&gt; &lt;tex-math&gt;$L_{mathrm { cable}}$ &lt;/tex-math&gt;&lt;/inline-formula&gt;\u0000 and \u0000&lt;inline-formula&gt; &lt;tex-math&gt;$C_{mathrm { cable}}$ &lt;/tex-math&gt;&lt;/inline-formula&gt;\u0000 to the increase of \u0000&lt;inline-formula&gt; &lt;tex-math&gt;$P_{mathrm { loss}}$ &lt;/tex-math&gt;&lt;/inline-formula&gt;\u0000, \u0000&lt;inline-formula&gt; &lt;tex-math&gt;$V_{mathrm { drop}}$ &lt;/tex-math&gt;&lt;/inline-formula&gt;\u0000, and THD\u0000&lt;inline-formula&gt; &lt;tex-math&gt;$_{V}$ &lt;/tex-math&gt;&lt;/inline-formula&gt;\u0000. Therefore, using more parallel conductors (\u0000&lt;inline-formula&gt; &lt;tex-math&gt;$4times 16$ &lt;/tex-math&gt;&lt;/inline-formula&gt;\u0000 mm2 NFA2X) as a simple approach was proposed to reduce \u0000&lt;inline-formula&gt; &lt;tex-math&gt;$R_{mathrm { cable}}$ &lt;/tex-math&gt;&lt;/inline-formula&gt;\u0000 and \u0000&lt;inline-formula&gt; &lt;tex-math&gt;$I_{mathrm { load}}$ &lt;/tex-math&gt;&lt;/inline-formula&gt;\u0000 per cable, which resulted in 53%, 53%, and 28% reduction in \u0000&lt;inline-formula&gt; &lt;tex-math&gt;$P_{mathrm { loss}}$ &lt;/tex-math&gt;&lt;/inline-formula&gt;\u0000, \u0000&lt;inline-formula&gt; &lt;tex-math&gt;$V_{mathrm { drop}}$ &lt;/tex-math&gt;&lt;/inline-formula&gt;\u0000, and THD\u0000&lt;inline-formula&gt; &lt;tex-math&gt;$_{V}$ &lt;/tex-math&gt;&lt;/inline-formula&gt;\u0000, respectively. The additional cable investment can be recovered by the savings from the \u0000&lt;inline-formula&gt; &lt;tex-math&gt;$P_{mathrm { loss}}$ &lt;/tex-math&gt;&lt;/inline-formula&gt;\u0000 reduction, which was estimated at four years. Moreover, complying with the recommended THD\u0000&lt;inline-formula&gt; &lt;tex-math&gt;$_{V}$ &lt;/tex-math&gt;&lt;/inline-formula&gt;\u0000","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"6 2","pages":"72-78"},"PeriodicalIF":0.0,"publicationDate":"2024-04-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141164687","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"IEEE ELECTROMAGNETIC COMPATIBILITY SOCIETY","authors":"","doi":"10.1109/LEMCPA.2024.3404308","DOIUrl":"https://doi.org/10.1109/LEMCPA.2024.3404308","url":null,"abstract":"","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"6 2","pages":"C2-C2"},"PeriodicalIF":0.0,"publicationDate":"2024-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10539641","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141164683","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Synopsis of the June 2024 Issue of the IEEE Letters on Electromagnetic Compatibility Practice and Applications","authors":"Frank Sabath","doi":"10.1109/LEMCPA.2024.3395830","DOIUrl":"https://doi.org/10.1109/LEMCPA.2024.3395830","url":null,"abstract":"Summary form only: Abstracts of articles presented in this issue of the publication.","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"6 2","pages":"46-50"},"PeriodicalIF":0.0,"publicationDate":"2024-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10539640","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141164713","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Improvement of ESD Damage Test Board for CMC for Automotive Ethernet","authors":"Hironori Ito;Yusuke Yano;Takeshi Ishida;Jianqing Wang","doi":"10.1109/LEMCPA.2024.3399661","DOIUrl":"https://doi.org/10.1109/LEMCPA.2024.3399661","url":null,"abstract":"IEC 62228-5 requires an electrostatic discharge (ESD) damage test of common-mode chokes (CMCs) used in the electromagnetic compatibility evaluation of automotive Ethernet transceiver integrated circuits (ICs). However, with the recommended ESD damage test board in IEC 62228-5, mounting and remounting of 0-\u0000<inline-formula> <tex-math>$Omega $ </tex-math></inline-formula>\u0000 resistors in the S-parameter measurement route (microstrip lines) are needed, which may cause uncertainty in the S-parameter measurement results. In this letter, we propose and validate an improved ESD damage test board which ensures both S-parameter measurement and ESD application. The proposed test board removed the 0-\u0000<inline-formula> <tex-math>$Omega $ </tex-math></inline-formula>\u0000 resistors and the vias of discharge points (DPs) from the microstrip lines between the SMA connectors for connection to a vector network analyzer and the CMC. As a result, the proposed test board was able to reduce the effects caused by the mismatched parts on the microstrip lines. For validation, ESD current waveforms were measured and compared for the original and proposed test boards, with concern for discharge at the SMA connectors. As a result, the proposed test board shows almost the same discharge current waveform as the original test board. In addition, based on the relationship between the applied ESD voltage and the first peak of the discharge current, determining whether a discharge occurs at the SMA connector on the DP side was examined. The result confirmed that the first-order proportional relationship between the ESD voltage and the first discharge peak current was maintained for the proposed test board, which suggests the validity of the proposed test board for the ESD damage test.","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"6 3","pages":"89-95"},"PeriodicalIF":0.9,"publicationDate":"2024-03-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142143636","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Research on Improved FSV Method Based on Wavelet Function Transform","authors":"Xiaobing Niu;Shenglin Liu;Runze Qiu;Xin Chow","doi":"10.1109/LEMCPA.2024.3398551","DOIUrl":"https://doi.org/10.1109/LEMCPA.2024.3398551","url":null,"abstract":"The feature-selective validation (FSV) method is the core algorithm of model verification and simulation verification established by the IEEE Standard 1597.1 in order to quantitatively evaluate the reliability of electromagnetic simulation results. Aiming at the failure problem of data with a transient component in the FSV method, this letter systematically analyzes the negative effect of the Fourier transform in this process and proposes an improved FSV method based on DB wavelet function transform. Based on the immune algorithm, the feature difference measure coefficient of the improved FSV method is corrected to ensure its consistency with the traditional feature selection verification method in the evaluation of eight basic problems. Finally, according to seven sets of evaluation questions involving transient components from the Polytechnic University of Catalonia, it is verified that the proposed method is closer to the evaluation results of experts with professional electromagnetic simulation backgrounds.","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"6 3","pages":"111-116"},"PeriodicalIF":0.9,"publicationDate":"2024-03-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142143638","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"IEEE ELECTROMAGNETIC COMPATIBILITY SOCIETY","authors":"","doi":"10.1109/LEMCPA.2024.3371310","DOIUrl":"https://doi.org/10.1109/LEMCPA.2024.3371310","url":null,"abstract":"","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"6 1","pages":"C2-C2"},"PeriodicalIF":0.0,"publicationDate":"2024-03-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10463708","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140067533","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}