IEEE Letters on Electromagnetic Compatibility Practice and Applications最新文献

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Active Isolation Structure for Directional Stress Current Injection 定向应力电流注入主动隔离结构
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IEEE Letters on Electromagnetic Compatibility Practice and Applications Pub Date : 2025-04-08 DOI: 10.1109/LEMCPA.2025.3558877
Zhekun Peng;Giorgi Maghlakelidze;Srinath Penugonda;Harald Gossner;David Pommerenke;DongHyun Kim
{"title":"Active Isolation Structure for Directional Stress Current Injection","authors":"Zhekun Peng;Giorgi Maghlakelidze;Srinath Penugonda;Harald Gossner;David Pommerenke;DongHyun Kim","doi":"10.1109/LEMCPA.2025.3558877","DOIUrl":"https://doi.org/10.1109/LEMCPA.2025.3558877","url":null,"abstract":"In the testing of high-speed interfaces for electrostatic discharge (ESD)-induced soft failure susceptibility, for example, using a transmission-line pulse (TLP), the current propagates toward both ends of the channel from the injection point, resulting in the inability to determine if the host or the device under test (DUT) failed. Unidirectional current injection toward the DUT is necessary. An active circuit design is proposed for unidirectional current injection in high-speed simplex interfaces. The proposed method is applied to a USB3 Gen 1 interface. To verify the effectiveness of the proposed unidirectional injection structure, directionality, gain flatness, and maximum stress level are measured. Eye diagram simulation results verify the negligible electrical impact of the proposed isolating structure.","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"7 2","pages":"50-54"},"PeriodicalIF":0.9,"publicationDate":"2025-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144170867","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Call for Application Letters on the Special Issue Practical Applications and Advancements in Electromagnetic Shielding and Absorbers 《电磁屏蔽与吸收剂的实际应用与进展》特刊征信
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IEEE Letters on Electromagnetic Compatibility Practice and Applications Pub Date : 2025-03-28 DOI: 10.1109/LEMCPA.2025.3565077
{"title":"Call for Application Letters on the Special Issue Practical Applications and Advancements in Electromagnetic Shielding and Absorbers","authors":"","doi":"10.1109/LEMCPA.2025.3565077","DOIUrl":"https://doi.org/10.1109/LEMCPA.2025.3565077","url":null,"abstract":"","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"7 2","pages":"61-62"},"PeriodicalIF":0.9,"publicationDate":"2025-03-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11017413","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144170865","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Synopsis of the June 2025 Issue of the IEEE Letters on Electromagnetic Compatibility Practice and Applications 《IEEE电磁兼容实践与应用快报》2025年6月号摘要
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IEEE Letters on Electromagnetic Compatibility Practice and Applications Pub Date : 2025-03-28 DOI: 10.1109/LEMCPA.2025.3563776
{"title":"Synopsis of the June 2025 Issue of the IEEE Letters on Electromagnetic Compatibility Practice and Applications","authors":"","doi":"10.1109/LEMCPA.2025.3563776","DOIUrl":"https://doi.org/10.1109/LEMCPA.2025.3563776","url":null,"abstract":"Summary form only: Abstracts of articles presented in this issue of the publication.","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"7 2","pages":"31-34"},"PeriodicalIF":0.9,"publicationDate":"2025-03-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11017411","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144170973","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE ELECTROMAGNETIC COMPATIBILITY SOCIETY 电磁兼容学会
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IEEE Letters on Electromagnetic Compatibility Practice and Applications Pub Date : 2025-03-28 DOI: 10.1109/LEMCPA.2025.3563651
{"title":"IEEE ELECTROMAGNETIC COMPATIBILITY SOCIETY","authors":"","doi":"10.1109/LEMCPA.2025.3563651","DOIUrl":"https://doi.org/10.1109/LEMCPA.2025.3563651","url":null,"abstract":"","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"7 2","pages":"C2-C2"},"PeriodicalIF":0.9,"publicationDate":"2025-03-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11017414","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144170980","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Basic Approaches to Optimization of Round and Flat Cable Structures for Protection Against Ultrawideband Interference 圆形和扁平电缆结构抗超宽带干扰优化的基本方法
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IEEE Letters on Electromagnetic Compatibility Practice and Applications Pub Date : 2025-03-26 DOI: 10.1109/LEMCPA.2025.3554588
Anton O. Belousov;Viktoriya O. Gordeyeva
{"title":"Basic Approaches to Optimization of Round and Flat Cable Structures for Protection Against Ultrawideband Interference","authors":"Anton O. Belousov;Viktoriya O. Gordeyeva","doi":"10.1109/LEMCPA.2025.3554588","DOIUrl":"https://doi.org/10.1109/LEMCPA.2025.3554588","url":null,"abstract":"This letter discusses approaches to conducting comprehensive optimization of devices that protect against ultrawideband interference, known as modal filters, based on two criteria. These devices can take the form of strip N-conductor structures with a various number of conducting layers, as well as cables. When designing them, during optimization, developers need to simultaneously consider several factors (e.g., the level of interference attenuation in a 50-<inline-formula> <tex-math>$Omega $ </tex-math></inline-formula> matched path with minimal mass and dimensional parameters) that the final product must satisfy. Additional complexity in the optimization of such structures is due to the variability of geometric and schematic models of them. Thus, the work details the main approaches to optimizing cable structures, including simultaneously several criteria. As global optimization algorithms, we consider a simple genetic algorithm, evolutionary strategies, and a random search method. The criteria include the amplitude criterion (minimization of the interference voltage at the structure’s output) and the matching criterion with the electrical path (minimization of reflections of useful high-frequency signals at the modal filter input). As the structures to be optimized, we take cable structures based on 3-conductor round and 2-conductor flat cables. This letter compares three algorithms, highlighting their advantages, disadvantages, peculiarities, and limitations in optimizing cable modal filters. Finally, we present practical recommendations for the use of optimization algorithms that are useful for designers of noise-suppressing cable devices.","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"7 2","pages":"55-60"},"PeriodicalIF":0.9,"publicationDate":"2025-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144170864","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
How to Assess EMI-Risk Acceptability Criteria in Medical Device EMC Risk Management 医疗器械EMC风险管理中如何评估EMC风险可接受性标准
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IEEE Letters on Electromagnetic Compatibility Practice and Applications Pub Date : 2025-03-18 DOI: 10.1109/LEMCPA.2025.3552675
Vikas Ghatge;Dries Vanoost;Rob Kleihorst;Davy Pissoort
{"title":"How to Assess EMI-Risk Acceptability Criteria in Medical Device EMC Risk Management","authors":"Vikas Ghatge;Dries Vanoost;Rob Kleihorst;Davy Pissoort","doi":"10.1109/LEMCPA.2025.3552675","DOIUrl":"https://doi.org/10.1109/LEMCPA.2025.3552675","url":null,"abstract":"Electromagnetic-interference (EMI) risks are among the potential causes of failure in all electronic equipment. Therefore, it is crucial to define EMI-risk acceptability criteria (EMI-RAC) at the beginning of the electromagnetic-compatibility (EMC) risk management process to decide the acceptable risk levels to be achieved. However, defining these criteria is complex due to their dependence on various factors, such as regulations, standards, state-of-the-art (SOTA) practices, reference databases, and expert judgment. Therefore, this letter discusses how to distinguish acceptable, tolerable, and unacceptable risk boundaries and regions that define EMI-RAC. This letter provides practical guidelines for manufacturers through simple anecdotal examples where the business objectives are systematically transformed into technical acceptability criteria and eventually into verifiable EMC testing performance criteria. It also illustrates how manufacturers can represent criteria and balance risk reduction in medical device design to manage EMI risks. This is achieved in relation to risk-benefit analysis and SOTA solutions while avoiding field failures and damage to reputation.","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"7 2","pages":"35-43"},"PeriodicalIF":0.9,"publicationDate":"2025-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144170866","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Experimental Study of the Reflection Symmetric Devices Based on Modal Distortion 基于模态畸变的反射对称器件实验研究
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IEEE Letters on Electromagnetic Compatibility Practice and Applications Pub Date : 2025-02-28 DOI: 10.1109/LEMCPA.2025.3546796
Yevgeniy S. Zhechev;Evgeniya B. Chernikova;Talgat R. Gazizov
{"title":"Experimental Study of the Reflection Symmetric Devices Based on Modal Distortion","authors":"Yevgeniy S. Zhechev;Evgeniya B. Chernikova;Talgat R. Gazizov","doi":"10.1109/LEMCPA.2025.3546796","DOIUrl":"https://doi.org/10.1109/LEMCPA.2025.3546796","url":null,"abstract":"This letter presents the study of a reflection symmetric modal filter (MF) and meander lines (MLs) based on a four-layer printed-circuit board. The design goal is to experimentally investigate reflection symmetric MLs and MF to analyze their characteristics and to comparatively evaluate their effectiveness in protecting electronic equipment from ultrawideband (UWB) interference. The intuition behind this letter lies in leveraging modal distortions to decompose UWB pulses into smaller, less harmful components. A meander routing scheme is employed to increase the differences in mode per-unit-length delays, thereby improving interference attenuation while maintaining a compact design. The novelty of this letter includes the first experimental analysis of time responses for one-turn and two-turn MLs, providing significant insights into their behavior and performance. Experimental results, corroborated by electrodynamic simulations, demonstrate that MLs achieve superior attenuation of UWB pulses compared to MFs of equivalent size. Specifically, meander routing enhances UWB interference suppression of the initial MF by at least 2 times in <inline-formula> <tex-math>${N} _{1}$ </tex-math></inline-formula>, 1.63 times in <inline-formula> <tex-math>${N} _{2}$ </tex-math></inline-formula>, and 1.36 times in <inline-formula> <tex-math>${N} _{5}$ </tex-math></inline-formula> norms. In addition, a novel postprocessing technique is introduced to identify combinational pulses in the time response of the one-turn ML, advancing the understanding of pulse decomposition mechanisms. This method successfully demonstrated the presence of combinational pulses. This letter represents a notable advancement electromagnetic compatibility (EMC) by offering efficient and compact solutions for safeguarding electronic systems against UWB interference.","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"7 2","pages":"44-49"},"PeriodicalIF":0.9,"publicationDate":"2025-02-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144170974","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE ELECTROMAGNETIC COMPATIBILITY SOCIETY 电磁兼容学会
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IEEE Letters on Electromagnetic Compatibility Practice and Applications Pub Date : 2025-02-25 DOI: 10.1109/LEMCPA.2025.3542242
{"title":"IEEE ELECTROMAGNETIC COMPATIBILITY SOCIETY","authors":"","doi":"10.1109/LEMCPA.2025.3542242","DOIUrl":"https://doi.org/10.1109/LEMCPA.2025.3542242","url":null,"abstract":"","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"7 1","pages":"C2-C2"},"PeriodicalIF":0.9,"publicationDate":"2025-02-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10903140","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143489234","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Synopsis of the March 2025 Issue of the IEEE Letters on Electromagnetic Compatibility Practice and Applications 《IEEE电磁兼容实践与应用快报》2025年3月刊摘要
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IEEE Letters on Electromagnetic Compatibility Practice and Applications Pub Date : 2025-02-25 DOI: 10.1109/LEMCPA.2025.3539074
{"title":"Synopsis of the March 2025 Issue of the IEEE Letters on Electromagnetic Compatibility Practice and Applications","authors":"","doi":"10.1109/LEMCPA.2025.3539074","DOIUrl":"https://doi.org/10.1109/LEMCPA.2025.3539074","url":null,"abstract":"Summary form only: Abstracts of articles presented in this issue of the publication.","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"7 1","pages":"2-4"},"PeriodicalIF":0.9,"publicationDate":"2025-02-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10902335","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143489233","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The Challenge of Surge Protection for LiFePO4 Batteries Using Varistors 使用压敏电阻对LiFePO4电池进行浪涌保护的挑战
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IEEE Letters on Electromagnetic Compatibility Practice and Applications Pub Date : 2025-01-21 DOI: 10.1109/LEMCPA.2025.3532537
Konstantinos M. Gektidis;Thomas Tsovilis
{"title":"The Challenge of Surge Protection for LiFePO4 Batteries Using Varistors","authors":"Konstantinos M. Gektidis;Thomas Tsovilis","doi":"10.1109/LEMCPA.2025.3532537","DOIUrl":"https://doi.org/10.1109/LEMCPA.2025.3532537","url":null,"abstract":"This letter examines the current-sharing behavior of a single-cell lithium iron phosphate (<inline-formula> <tex-math>${mathrm { LiFePO}}_{4}$ </tex-math></inline-formula>) battery connected in parallel with a zinc-aluminum varistor, aimed at protecting against fast-front impulse currents. Through experimental data analysis and ATP-EMTP simulations, the study explores the transient behavior of the protective varistor stack and the cylindrical <inline-formula> <tex-math>${mathrm { LiFePO}}_{4}$ </tex-math></inline-formula> battery under surge events. Key factors considered include the determination of charge transferred to both the varistor and the battery as well as the voltage across their terminals. The findings highlight the challenges associated with surge protection against fast-front transients that threaten the reliability and lifespan of modern energy storage systems, particularly in safeguarding against lightning strikes and electromagnetic pulses.","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"7 1","pages":"25-29"},"PeriodicalIF":0.9,"publicationDate":"2025-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10848368","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143489169","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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