发布求助
文献互助 智能选刊 最新文献

IEEE Letters on Electromagnetic Compatibility Practice and Applications最新文献

筛选
英文 中文
Synopsis of the March 2026 Issue of the IEEE Letters on EMC Practice and Applications 《IEEE电磁兼容实践与应用快报》2026年3月刊摘要
IF 1
IEEE Letters on Electromagnetic Compatibility Practice and Applications Pub Date : 2026-03-01 Epub Date: 2026-03-31 DOI: 10.1109/LEMCPA.2026.3666578
Davy Pissoort
{"title":"Synopsis of the March 2026 Issue of the IEEE Letters on EMC Practice and Applications","authors":"Davy Pissoort","doi":"10.1109/LEMCPA.2026.3666578","DOIUrl":"https://doi.org/10.1109/LEMCPA.2026.3666578","url":null,"abstract":"Summary form only: Abstracts of articles presented in this issue of the publication.","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"8 1","pages":"3-6"},"PeriodicalIF":1.0,"publicationDate":"2026-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11458615","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147578999","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Analytical Model for Mutual Inductance Prediction Between Horizontal Inductors With Arbitrary Orientations 任意方向水平电感互感预测的解析模型
IF 1
IEEE Letters on Electromagnetic Compatibility Practice and Applications Pub Date : 2026-03-01 Epub Date: 2025-10-10 DOI: 10.1109/LEMCPA.2025.3620162
Mohamed G. Congo;Richard Perdriau;Marine Stojanovic;Mohsen Koohestani;Frédéric Lafon;Mohamed Ramdani
{"title":"Analytical Model for Mutual Inductance Prediction Between Horizontal Inductors With Arbitrary Orientations","authors":"Mohamed G. Congo;Richard Perdriau;Marine Stojanovic;Mohsen Koohestani;Frédéric Lafon;Mohamed Ramdani","doi":"10.1109/LEMCPA.2025.3620162","DOIUrl":"https://doi.org/10.1109/LEMCPA.2025.3620162","url":null,"abstract":"This letter presents the validation of an analytical approach for predicting the mutual inductance between two horizontal inductors with arbitrary orientations. A case scenario is developed to demonstrate that the method previously introduced by the authors for particular orientations (parallel and perpendicular) can be effectively extended to arbitrary orientations with good accuracy. The variation of mutual inductance as a function of the angle between the inductor axes is also examined. Furthermore, the study highlights the advantage of employing a comprehensive model that accounts for both primary and secondary coupling surfaces, leading to improved accuracy in determining the global equivalent mutual inductance compared to models that consider only the primary surface. Regardless of orientation, the proposed model provides a computationally efficient and accurate alternative to full-wave simulations for analyzing near-field magnetic coupling between horizontal inductors.","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"8 1","pages":"11-16"},"PeriodicalIF":1.0,"publicationDate":"2026-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147579034","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Visual-Learning-Based Convolutional Neural Network Application for Electromagnetic Susceptibility Event Classification 基于视觉学习的卷积神经网络在电磁敏感性事件分类中的应用
IF 1
IEEE Letters on Electromagnetic Compatibility Practice and Applications Pub Date : 2026-03-01 Epub Date: 2025-12-22 DOI: 10.1109/LEMCPA.2025.3646922
Sezgin Sezginer;Cenk Başar;Tarık Veli Mumcu
{"title":"Visual-Learning-Based Convolutional Neural Network Application for Electromagnetic Susceptibility Event Classification","authors":"Sezgin Sezginer;Cenk Başar;Tarık Veli Mumcu","doi":"10.1109/LEMCPA.2025.3646922","DOIUrl":"https://doi.org/10.1109/LEMCPA.2025.3646922","url":null,"abstract":"The increase in the number of digital interfaces and monitoring devices has led to the need for more accurate and quicker decision-making solutions in electromagnetic-interference (EMI)/electromagnetic-compatibility (EMC) testing. Conventional monitoring and inspection methods, which have been carried out by human intervention, are not able to give the desired success criteria for accuracy in a reasonable confidence level due to the complexity of the electronic system’s susceptibility. With this study, an experimental convolutional neural network (CNN) architecture, which is to learn from the equipment under test (device(s) under test) operational behavior by training and detection of several events, including failure modes in a high-speed scan rate, is introduced. An automatic event detection and diagnosis model is successfully designed and then evaluated. The outcomes of this work demonstrate accurate and high-speed EMI monitoring, and event classification is achievable by the proposed method.","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"8 1","pages":"28-33"},"PeriodicalIF":1.0,"publicationDate":"2026-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147578995","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Experimental Realization of Conformal Bandpass FSS for Radome Applications 天线罩共形带通FSS的实验实现
IF 1
IEEE Letters on Electromagnetic Compatibility Practice and Applications Pub Date : 2026-03-01 Epub Date: 2026-01-23 DOI: 10.1109/LEMCPA.2026.3656829
Murtaza Waheed;Mehran Manzoor Zargar;Kushmanda Saurav
{"title":"Experimental Realization of Conformal Bandpass FSS for Radome Applications","authors":"Murtaza Waheed;Mehran Manzoor Zargar;Kushmanda Saurav","doi":"10.1109/LEMCPA.2026.3656829","DOIUrl":"https://doi.org/10.1109/LEMCPA.2026.3656829","url":null,"abstract":"This letter presents a dual-polarized conformal bandpass frequency-selective surface (FSS) designed and experimentally tested to provide a stable transmission window in the X-band under both concave and convex bending conditions. The bandpass FSS comprises a square-shaped slot etched on 0.254-mm-thick FR-4 substrate with single-sided copper cladding. The proposed bandpass layer operates at 10.1 GHz, and its transmission characteristics are further explained through an equivalent circuit model. The FSS maintains a stable angular response for incident angles up to 70° and performs effectively under bending up to 180°. In addition, when integrated with a patch antenna, the cylindrically bent conformal FSS introduces a minimal distortion to its far-field characteristics. Due to these attributes, the proposed bandpass FSS can be used for conformal and flexible electromagnetic applications.","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"8 1","pages":"22-27"},"PeriodicalIF":1.0,"publicationDate":"2026-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147578983","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A SSPP-Integrated Defected Ground Structure With Low EMI 一种集成sspp的低电磁干扰缺陷接地结构
IF 1
IEEE Letters on Electromagnetic Compatibility Practice and Applications Pub Date : 2026-03-01 Epub Date: 2025-12-02 DOI: 10.1109/LEMCPA.2025.3639284
Xingrui Luo;Kai Yang;Lin Li;Haiwen Liu
{"title":"A SSPP-Integrated Defected Ground Structure With Low EMI","authors":"Xingrui Luo;Kai Yang;Lin Li;Haiwen Liu","doi":"10.1109/LEMCPA.2025.3639284","DOIUrl":"https://doi.org/10.1109/LEMCPA.2025.3639284","url":null,"abstract":"Conventional defected ground structures (DGSs) suffer from strong crosstalk and radiation, which limit their use in compact and highly integrated microwave circuits. To address this, this letter presents a spoof surface plasmon polariton-integrated DGS (SSPPI-DGS). By embedding periodic SSPP units into the ground plane, the proposed design exhibits enhanced slow-wave characteristics and strong field confinement, as confirmed through dispersion analysis. Simulated and measured results further validate that the SSPPI-DGS achieves significant suppression of both near-end and far-end crosstalk, with reductions of up to 6–7 dB at fundamental frequencies, while simultaneously lowering radiation loss and insertion loss compared with the conventional DGSs. In addition, the proposed unit cell occupies a smaller footprint, enabling improved integration density. These findings highlight the SSPPI-DGS as a practical and scalable solution for future low-EMI, high-integration microwave circuits and system-on-package applications.","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"8 1","pages":"7-10"},"PeriodicalIF":1.0,"publicationDate":"2026-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147579027","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Editorial Message From the Editor-in-Chief 总编辑的社论
IF 1
IEEE Letters on Electromagnetic Compatibility Practice and Applications Pub Date : 2026-03-01 Epub Date: 2026-03-31 DOI: 10.1109/LEMCPA.2026.3666577
Davy Pissoort
{"title":"Editorial Message From the Editor-in-Chief","authors":"Davy Pissoort","doi":"10.1109/LEMCPA.2026.3666577","DOIUrl":"https://doi.org/10.1109/LEMCPA.2026.3666577","url":null,"abstract":"","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"8 1","pages":"2-2"},"PeriodicalIF":1.0,"publicationDate":"2026-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11458833","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147578993","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Optimizing via Placement and Routing Structure to Improve Signal Integrity in DDR4 Fly-By Topology 通过优化布局和路由结构来提高DDR4飞通拓扑的信号完整性
IF 1
IEEE Letters on Electromagnetic Compatibility Practice and Applications Pub Date : 2026-03-01 Epub Date: 2025-11-18 DOI: 10.1109/LEMCPA.2025.3634137
Goro Hamamoto;Yutaka Uematsu;Yoshitaka Toyota
{"title":"Optimizing via Placement and Routing Structure to Improve Signal Integrity in DDR4 Fly-By Topology","authors":"Goro Hamamoto;Yutaka Uematsu;Yoshitaka Toyota","doi":"10.1109/LEMCPA.2025.3634137","DOIUrl":"https://doi.org/10.1109/LEMCPA.2025.3634137","url":null,"abstract":"This letter proposes a routing structure called twisted shorten-stub routing (TSSR) to improve the signal integrity of parallel bus signals transmitted using the conventional Fly-by topology in DDR3 and later generations. TSSR is characterized by inner-layer lines and vias, and this letter discusses its application effects. Under the two constraints of high routing density near the synchronous dynamic random-access memory (SDRAM) and the necessity to wire across multiple layers, this letter addresses the challenge of improving signal integrity. The effectiveness of the proposed TSSR is analyzed by simulating a simple state in which the ball gird array (BGA) pads are connected to the top of the vias. This letter demonstrates the effects of the proposed routing structure on frequency characteristics and eye diagrams and outlines the flow for realizing this in product design. This approach is particularly beneficial for industrial equipment, where long via lengths and layer selection constraints often cause signal integrity degradation. TSSR proposed in this letter contributes to the design of memory down systems, which offer high routing flexibility for component manufacturers.","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"8 1","pages":"17-21"},"PeriodicalIF":1.0,"publicationDate":"2026-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11251372","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147579021","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE ELECTROMAGNETIC COMPATIBILITY SOCIETY 电磁兼容学会
IF 1
IEEE Letters on Electromagnetic Compatibility Practice and Applications Pub Date : 2026-03-01 Epub Date: 2026-03-31 DOI: 10.1109/LEMCPA.2026.3676086
{"title":"IEEE ELECTROMAGNETIC COMPATIBILITY SOCIETY","authors":"","doi":"10.1109/LEMCPA.2026.3676086","DOIUrl":"https://doi.org/10.1109/LEMCPA.2026.3676086","url":null,"abstract":"","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"8 1","pages":"C2-C2"},"PeriodicalIF":1.0,"publicationDate":"2026-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11458602","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147578986","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
2025 Index IEEE Transactions on Electromagnetic Compatiblity Practice and Applications 2025索引IEEE电磁兼容实践与应用汇刊
IF 1
IEEE Letters on Electromagnetic Compatibility Practice and Applications Pub Date : 2026-01-09 DOI: 10.1109/LEMCPA.2026.3651183
{"title":"2025 Index IEEE Transactions on Electromagnetic Compatiblity Practice and Applications","authors":"","doi":"10.1109/LEMCPA.2026.3651183","DOIUrl":"https://doi.org/10.1109/LEMCPA.2026.3651183","url":null,"abstract":"","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"7 4","pages":"1-7"},"PeriodicalIF":1.0,"publicationDate":"2026-01-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11344832","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145929549","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Editorial: Message From the Editor-in-Chief 社论：总编辑的留言
IF 1
IEEE Letters on Electromagnetic Compatibility Practice and Applications Pub Date : 2025-12-25 DOI: 10.1109/LEMCPA.2025.3637447
Fank Sabath
{"title":"Editorial: Message From the Editor-in-Chief","authors":"Fank Sabath","doi":"10.1109/LEMCPA.2025.3637447","DOIUrl":"https://doi.org/10.1109/LEMCPA.2025.3637447","url":null,"abstract":"","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"7 4","pages":"107-107"},"PeriodicalIF":1.0,"publicationDate":"2025-12-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11316318","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145824289","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
下一页 尾页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：604180095
Book学术官方微信
小红书