{"title":"用于评估智能手机高速接口抗扰度的实用射频耦合 FPC 设计","authors":"Xingguo Jiang;Songsong Zhang;Shui Liu","doi":"10.1109/LEMCPA.2024.3392530","DOIUrl":null,"url":null,"abstract":"This letter addresses the importance of evaluating the radio-frequency immunity (RFI) absolute level at high-speed interfaces in a smart phone product. In this letter, a practical radio-frequency coupling flexible-printed circuit (FPC) design was introduced. It can be adapted to a device under test (DUT) easily, comparing the high-speed RFI level margin across different DUTs. The proposed evaluation method has been tested, and results are provided for consideration.","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"6 2","pages":"67-71"},"PeriodicalIF":0.9000,"publicationDate":"2024-04-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Practical RF Coupling FPC Design for Evaluating High-Speed Interface Immunity in Smart Phones\",\"authors\":\"Xingguo Jiang;Songsong Zhang;Shui Liu\",\"doi\":\"10.1109/LEMCPA.2024.3392530\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This letter addresses the importance of evaluating the radio-frequency immunity (RFI) absolute level at high-speed interfaces in a smart phone product. In this letter, a practical radio-frequency coupling flexible-printed circuit (FPC) design was introduced. It can be adapted to a device under test (DUT) easily, comparing the high-speed RFI level margin across different DUTs. The proposed evaluation method has been tested, and results are provided for consideration.\",\"PeriodicalId\":100625,\"journal\":{\"name\":\"IEEE Letters on Electromagnetic Compatibility Practice and Applications\",\"volume\":\"6 2\",\"pages\":\"67-71\"},\"PeriodicalIF\":0.9000,\"publicationDate\":\"2024-04-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Letters on Electromagnetic Compatibility Practice and Applications\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10506961/\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","FirstCategoryId":"1085","ListUrlMain":"https://ieeexplore.ieee.org/document/10506961/","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
A Practical RF Coupling FPC Design for Evaluating High-Speed Interface Immunity in Smart Phones
This letter addresses the importance of evaluating the radio-frequency immunity (RFI) absolute level at high-speed interfaces in a smart phone product. In this letter, a practical radio-frequency coupling flexible-printed circuit (FPC) design was introduced. It can be adapted to a device under test (DUT) easily, comparing the high-speed RFI level margin across different DUTs. The proposed evaluation method has been tested, and results are provided for consideration.
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