{"title":"Electrodeposition of the ternary iron-cobalt-nickel alloy from the fluoborate bath part II. Structure and properties of the deposits","authors":"Y.M.Faruq Marikar, K.I. Vasu","doi":"10.1016/0300-9416(74)90005-4","DOIUrl":"https://doi.org/10.1016/0300-9416(74)90005-4","url":null,"abstract":"<div><p>The alloy deposits of different compositions were examined for their crystal structure by X-ray diffraction, their hardness and microstructure. The range of the α b. c. c. phase is extended at the expense of the γ f.c.c. phase in comparison with the thermal alloys. Two-phase electrodeposits are the exception rather than the rule. Suitable compositions can be hardened by heat treatment; hardening seems to be by precipitation of the γ phase in an α matrix.</p><p>The large difference in the electrochemical behaviour of iron and nickel enabled the construction of a phase diagram for the electrodeposited alloys, based on a map of their electrode potentials.</p></div>","PeriodicalId":100399,"journal":{"name":"Electrodeposition and Surface Treatment","volume":"2 4","pages":"Pages 295-302"},"PeriodicalIF":0.0,"publicationDate":"1974-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/0300-9416(74)90005-4","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91604854","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Mecanisme d'introduction du phosphore dans les couches minces magnetiques de cobalt","authors":"J. Kravtchenko, J. Guitton","doi":"10.1016/0300-9416(74)90003-0","DOIUrl":"https://doi.org/10.1016/0300-9416(74)90003-0","url":null,"abstract":"","PeriodicalId":100399,"journal":{"name":"Electrodeposition and Surface Treatment","volume":"18 1","pages":"275-279"},"PeriodicalIF":0.0,"publicationDate":"1974-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82544904","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A comparison of the effects of sodium arsenite and sodium arsenoacetate upon the behaviour of a cyanide brass plating solution","authors":"G.W. Marshall, J. Green, P. Leggett","doi":"10.1016/0300-9416(74)90037-6","DOIUrl":"10.1016/0300-9416(74)90037-6","url":null,"abstract":"<div><p>The effects of 1 X 10<sup>-2</sup> m<em>M</em> additions of sodium arsenite and sodium arsenoacetate upon a brass plating solution have been studied. The arsenoacetate was found to be a better brightening agent than the arsenite.</p><p>Potential-current density curve studies showed that the arsenide decreased cathodic polarisation but that the arsenoacetate increased polarisation. Both additions led to modifications of the structure of the deposited brass and to increases in its hardness. The colour of deposits obtained using sodium arsenoacetate additions varied considerably with deposit thickness.</p></div>","PeriodicalId":100399,"journal":{"name":"Electrodeposition and Surface Treatment","volume":"2 3","pages":"Pages 233-243"},"PeriodicalIF":0.0,"publicationDate":"1974-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/0300-9416(74)90037-6","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89847904","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"The effect of alternating current on the morphology of electrodeposited copper","authors":"B.S. Sheshadri, T.H.V. Setty","doi":"10.1016/0300-9416(74)90036-4","DOIUrl":"10.1016/0300-9416(74)90036-4","url":null,"abstract":"<div><p>A sinusoidal alternating current affects the morphology and smooths electrodeposited copper on copper single crystals. On a (111) plane hexagonal and triangular pyramids obtained from a highly purified acid copper sulphate bath in pure d.c. gradually truncate and transform to fine polycrystalline grains by the application of a.c. On the (100) and (110) planes layers and ridges observed in pure d.c. respectively change to homogeneous polycrystals by the application of a.c. Growth forms of copper during d.c. are related to the cathodic polarization and the mechanism is discussed. By the application of a.c. a change from the anisotropic to the isotropic character is observed.</p></div>","PeriodicalId":100399,"journal":{"name":"Electrodeposition and Surface Treatment","volume":"2 3","pages":"Pages 223-231"},"PeriodicalIF":0.0,"publicationDate":"1974-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/0300-9416(74)90036-4","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88654188","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Hear effects, another method of studying electrodeposition processes","authors":"T.C. Franklin, R. McCrea","doi":"10.1016/0300-9416(74)90034-0","DOIUrl":"10.1016/0300-9416(74)90034-0","url":null,"abstract":"<div><p>A study was made of the temperature effects obtained at electrodes during anodic dissolution and deposition of silver from silver nitrate solutions containing ammonia and potassium cyanide. From these measurements it was determined that the plating of silver from silver nitrate solutions is exothermic and the dissolution is endothermic. The addition of ammonia, because of its stronger energy of bonding with silver, causes the deposition to become endothermic and the dissolution to be exothermic. Because of polarization effects both the deposition and dissolution from cyanide baths are exothermic.</p><p>The data showed that the formula of the silver aquo complex that is discharged is the same as that of the one that leaves the electrode surface during anodic dissolution. In addition, the formation of a surface film was indicated when silver was dissolved under certain conditions in cyanide solutions. Heat effects were observed in the absence of current after the formation of this film showing chemical reactions probably to remove the film and form a layer of chemisorbed cyanide on the fresh silver.</p></div>","PeriodicalId":100399,"journal":{"name":"Electrodeposition and Surface Treatment","volume":"2 3","pages":"Pages 191-203"},"PeriodicalIF":0.0,"publicationDate":"1974-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/0300-9416(74)90034-0","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86265191","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Etude radiocristallographique de l'orientation preferentielle des depots electrolytiques de nickel","authors":"J. Amblard , M. Froment, G. Maurin","doi":"10.1016/0300-9416(74)90035-2","DOIUrl":"10.1016/0300-9416(74)90035-2","url":null,"abstract":"<div><p>A quantitative X-ray analysis is made of the fiber texture exhibited in nickel electrodeposits. Pole figures are built thanks to a simple reflection diffractometer method without a texture goniometer, and corrected throughout the comparison with a random-oriented nickel sample, the randomness of which is carefully discussed.</p><p>The experimental correction factor is found to depend on the grain size of the random-oriented sample and not to be in agreement with the theoretical prevision.</p><p>Assuming that pole distributions are gaussian near the fiber axis, three parameters are defined which thoroughly determine the preferred orientation.</p><p>An illustration of this method is given with nickel electrodeposits obtained from a Watts bath in well-defined conditions of preparation. Several deposits exhibiting a [311] pseudotexture are shown to possess in fact a [211] preferred orientation with broadly-dispersed pole distributions.</p></div>","PeriodicalId":100399,"journal":{"name":"Electrodeposition and Surface Treatment","volume":"2 3","pages":"Pages 205-222"},"PeriodicalIF":0.0,"publicationDate":"1974-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/0300-9416(74)90035-2","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85620425","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Influence of sulfur content on the impact strength of electroformed nickel","authors":"J.W. Dini, H.R. Johnson, H.J. Saxton","doi":"10.1016/0300-9416(74)90032-7","DOIUrl":"10.1016/0300-9416(74)90032-7","url":null,"abstract":"<div><p>The influence of sulfur content on the notch sensitivity of electroformed nickel was determined by Charpy impact tests. Specimens containing greater than 200 ppm sulfur exhibited severe embrittlement and therefore are highly notch sensitive.</p><p>A modified Izod test specimen containing the same joint configuration as the plated part described in the report was designed and evaluated. Results showed that this test could serve as an indicator of the notch sensitivity of the joint and that it could be used for product certification. As additional benefits, the Izod specimen gives assurance that the plated bonds comprising the joint are sound and that no planes of weakness exist.</p><p>Because hardness is a direct function of sulfur content, a rough approximation of the sulfur content in deposits can be made by checking hardness.</p></div>","PeriodicalId":100399,"journal":{"name":"Electrodeposition and Surface Treatment","volume":"2 3","pages":"Pages 165-176"},"PeriodicalIF":0.0,"publicationDate":"1974-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/0300-9416(74)90032-7","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83219065","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"The effect of addition agents on the early stages of growth of electrodeposited nickel","authors":"P. Sibley , P.A. Brook","doi":"10.1016/0300-9416(74)90033-9","DOIUrl":"10.1016/0300-9416(74)90033-9","url":null,"abstract":"<div><p>The effects of a number of addition agents on the epitaxial growth of electrodeposited nickel on copper substrates were examined using scanning and transmission electron microscopy. Those regions of epitaxy, transition and condition controlled growth were observed to be dependent on type and concentration of additive and on the substrate orientation. Both the epitaxial and transition regions extended over the range of <1μm to > 5 μm. The onset of the transition stage was generally associated with growth faults. The results are consistent with adsorption of the additives in different orientations followed by lattice disturbances due to the incorporation of part or whole of the additive on its reduction product.</p></div>","PeriodicalId":100399,"journal":{"name":"Electrodeposition and Surface Treatment","volume":"2 3","pages":"Pages 177-190"},"PeriodicalIF":0.0,"publicationDate":"1974-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/0300-9416(74)90033-9","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"78820868","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Some observations on the electropolishing of copper","authors":"M. Turner, P.A. Brook","doi":"10.1016/0300-9416(74)90038-8","DOIUrl":"10.1016/0300-9416(74)90038-8","url":null,"abstract":"","PeriodicalId":100399,"journal":{"name":"Electrodeposition and Surface Treatment","volume":"2 3","pages":"Pages 245-248"},"PeriodicalIF":0.0,"publicationDate":"1974-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/0300-9416(74)90038-8","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84419748","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}