The effect of addition agents on the early stages of growth of electrodeposited nickel

Abstract

The effects of a number of addition agents on the epitaxial growth of electrodeposited nickel on copper substrates were examined using scanning and transmission electron microscopy. Those regions of epitaxy, transition and condition controlled growth were observed to be dependent on type and concentration of additive and on the substrate orientation. Both the epitaxial and transition regions extended over the range of <1μm to > 5 μm. The onset of the transition stage was generally associated with growth faults. The results are consistent with adsorption of the additives in different orientations followed by lattice disturbances due to the incorporation of part or whole of the additive on its reduction product.