2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS 2013) : Taipei, Taiwan, 20-24 January 2013. IEEE International Conference on Micro Electro Mechanical Systems (26th : 2013 : Taipei, Taiwan)最新文献

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Simple through silicon interconnect via fabrication using dry filling of sub-micron Au particles for 3D MEMS 简单的通过硅互连通过制造使用亚微米金颗粒干填充3D MEMS
K. Shih, M. Nimura, Y. Kanehira, T. Ogashiwa, J. Mizuno, S. Shoji
{"title":"Simple through silicon interconnect via fabrication using dry filling of sub-micron Au particles for 3D MEMS","authors":"K. Shih, M. Nimura, Y. Kanehira, T. Ogashiwa, J. Mizuno, S. Shoji","doi":"10.1109/MEMSYS.2013.6474237","DOIUrl":"https://doi.org/10.1109/MEMSYS.2013.6474237","url":null,"abstract":"We developed a novel through silicon via (TSV) fabrication process using dry filling of sub-micron Au particle for stack type 3D MEMS. X-ray image shows that the slurry including Au particles was uniformly filled into vias with squeegee under low pressure in short time. TSV with a diameter of 30 μm and depth of 70μm were successfully fabricated. The resistance of single TSV was 0.11 Ω. The dielectric withstanding voltage of SiO2 insulating layer was about 150 V. The result indicates that high through put fabrication of TSV for 3D MEMS can be realized with a simple method.","PeriodicalId":92162,"journal":{"name":"2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS 2013) : Taipei, Taiwan, 20-24 January 2013. IEEE International Conference on Micro Electro Mechanical Systems (26th : 2013 : Taipei, Taiwan)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2013-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76168924","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Electromagnet-actuated droplet platform for sample-to-answer genetic detection 用于样本到答案基因检测的电磁铁驱动液滴平台
C. Chiou, D. J. Shin, S. Hosmane, Y. Zhang, T. H. Wang
{"title":"Electromagnet-actuated droplet platform for sample-to-answer genetic detection","authors":"C. Chiou, D. J. Shin, S. Hosmane, Y. Zhang, T. H. Wang","doi":"10.1109/MEMSYS.2013.6474186","DOIUrl":"https://doi.org/10.1109/MEMSYS.2013.6474186","url":null,"abstract":"This paper presents a magnetically actuated droplet platform for automated sample preparation and gene detection. Our platform integrates nucleic acid extraction using silicacoated magnetic particles with real-time polymerase chain reaction (PCR) on a single cartridge. The device consists of seven compartments in which reagent droplets are serially loaded. The assay utilizes solid phase nucleic acid isolation chemistry in order to purify genomic DNA from crude samples and elute the material in a PCR-ready buffer. Silicacoated magnetic particle provides a mobile solid phase that can be merged with and removed from reagents efficiently using a combination of planar coils and surface topographical features. Each droplet operation was characterized and evaluated. Using our platform, automated sample processing from whole blood to PCR-ready droplet, followed by amplification was performed successfully. This work demonstrates a fully integrated genetic assay platform for simple and efficient droplet manipulation.","PeriodicalId":92162,"journal":{"name":"2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS 2013) : Taipei, Taiwan, 20-24 January 2013. IEEE International Conference on Micro Electro Mechanical Systems (26th : 2013 : Taipei, Taiwan)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2013-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88366167","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Contactless catch-and-release system for giant liposomes based on negative dielectrophoresis 基于负介质电泳的巨脂质体非接触式捕获与释放系统
T. Kodama, T. Osaki, R. Kawano, K. Kamiya, N. Miki, S. Takeuchi
{"title":"Contactless catch-and-release system for giant liposomes based on negative dielectrophoresis","authors":"T. Kodama, T. Osaki, R. Kawano, K. Kamiya, N. Miki, S. Takeuchi","doi":"10.1109/MEMSYS.2013.6474459","DOIUrl":"https://doi.org/10.1109/MEMSYS.2013.6474459","url":null,"abstract":"This paper describes a contactless manipulation system for giant liposomes in an aqueous flow by negative dielectrophoresis (nDEP). The system consists of 2 pairs of comb electrodes that face each other across a perpendicular channel. This design allows an nDEP force to be focused at the center of the gap of the electrodes and the liposomes to align in lines without contacting either the electrodes or the channel walls. We experimentally demonstrated catch, hold, and release of floating giant liposomes. This contactless manipulation has a great advantage over conventional contact-type manipulation which would result in deformation or even rupture of the liposomes.","PeriodicalId":92162,"journal":{"name":"2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS 2013) : Taipei, Taiwan, 20-24 January 2013. IEEE International Conference on Micro Electro Mechanical Systems (26th : 2013 : Taipei, Taiwan)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2013-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86449889","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
In-plane fabricated insulated gold-tip probe for electrochemical and molecular experiments 平面内制备的电化学和分子实验用绝缘金探针
Yexian Wu, T. Akiyama, S. Gautsch, P. D. van der Wal, N. D. de Rooij
{"title":"In-plane fabricated insulated gold-tip probe for electrochemical and molecular experiments","authors":"Yexian Wu, T. Akiyama, S. Gautsch, P. D. van der Wal, N. D. de Rooij","doi":"10.1109/MEMSYS.2013.6474286","DOIUrl":"https://doi.org/10.1109/MEMSYS.2013.6474286","url":null,"abstract":"In this contribution we present a scanning probe with a gold-tip completely encapsulated with insulator all the way to the apex. The probe fabrication is unique owing to an in-plane arrangement in which the width of the cantilever is defined by deep reactive ion etching (DRIE). E-beam lithography was employed for defining the gold nanowire tip. The cantilever and the chip body were defined by DRIE in later steps. The radius of curvature of the tip apex is around 20 nm. The high-quality insulation on the tip was demonstrated by performing electrodeposition of gold. The spring constant of the cantilever was obtained by measuring the resonance frequency of the cantilever. With this in-plane fabrication process, probes with different spring constants ranging from 0.1 N/m to 9 N/m were fabricated on the same wafer.","PeriodicalId":92162,"journal":{"name":"2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS 2013) : Taipei, Taiwan, 20-24 January 2013. IEEE International Conference on Micro Electro Mechanical Systems (26th : 2013 : Taipei, Taiwan)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2013-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83189521","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Large power amplification of a piezoelectric energy harvester excited by random vibrations 由随机振动激发的压电能量采集器的大功率放大
Z. Wang, R. Elfrink, R. Vullers, V. van Acht, M. Tutelaers, S. Matova, J. Oudenhoven, R. van Schaijk
{"title":"Large power amplification of a piezoelectric energy harvester excited by random vibrations","authors":"Z. Wang, R. Elfrink, R. Vullers, V. van Acht, M. Tutelaers, S. Matova, J. Oudenhoven, R. van Schaijk","doi":"10.1109/MEMSYS.2013.6474188","DOIUrl":"https://doi.org/10.1109/MEMSYS.2013.6474188","url":null,"abstract":"This paper reports the method and results of amplifying the power output of a piezoelectric energy harvester excited by random vibrations. The amplification is achieved by applying a dual-mass-spring system. A maximum power amplification of 80 times has been experimentally demonstrated. The generated power output from a piezoelectric energy harvester, when excited by as-measured random vibrations, amounts to 28.9 μW. This is sufficient to operate a battery-free Tire Pressure Monitoring System (TPMS) for wireless sensing of pressure and temperature in car tires. Thus, the piezoelectric energy harvester with power amplification is proved to be a viable solution to replace batteries in the TPMS application.","PeriodicalId":92162,"journal":{"name":"2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS 2013) : Taipei, Taiwan, 20-24 January 2013. IEEE International Conference on Micro Electro Mechanical Systems (26th : 2013 : Taipei, Taiwan)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2013-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83342727","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 14
A novel inverse-magnetostrictive type pressure sensor with planar sensing inductor 一种新型平面感应式反磁致伸缩压力传感器
H.C. Chang, S. Liao, H. Hsieh, S. Lin, C. Lai, R. Chen, W. Fang
{"title":"A novel inverse-magnetostrictive type pressure sensor with planar sensing inductor","authors":"H.C. Chang, S. Liao, H. Hsieh, S. Lin, C. Lai, R. Chen, W. Fang","doi":"10.1109/MEMSYS.2013.6474335","DOIUrl":"https://doi.org/10.1109/MEMSYS.2013.6474335","url":null,"abstract":"In this study, a novel planar inductor to detect the pressure sensor is proposed. The planar inductor consists of planar coil and CoFeB films. The proposed sensor exploits the inverse-magnetostriction effect to change the permeability of the CoFeB film by pressure load. This permeability variation will further result in the inductance difference of the planar inductor. Consequently the relationship between the pressure and inductance can be obtained by the inductance measurement. To demonstrate the presented concept, prototype inverse-magnetostrictive type pressure sensors with planar sensing inductor (Al planar coil and CoFeB films) have been implemented and tested. Sensitivity measurements show the gauge factor of the novel pressure sensor is approximate 280. To support the proposed concept, the vibrating sample magnetometer (VSM) measurements show the magnetic anisotropy of the CoFeB film (extracted from the hysteresis loops) is changed due to the applied pressure load.","PeriodicalId":92162,"journal":{"name":"2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS 2013) : Taipei, Taiwan, 20-24 January 2013. IEEE International Conference on Micro Electro Mechanical Systems (26th : 2013 : Taipei, Taiwan)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2013-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81165413","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Electronic tuning of Q and apparent TCf in a piezoresistive micromechanical resonator 压阻式微机械谐振器中Q和表观TCf的电子调谐
H. Zhu, Cheng Tu, J. E. Lee
{"title":"Electronic tuning of Q and apparent TCf in a piezoresistive micromechanical resonator","authors":"H. Zhu, Cheng Tu, J. E. Lee","doi":"10.1109/MEMSYS.2013.6474353","DOIUrl":"https://doi.org/10.1109/MEMSYS.2013.6474353","url":null,"abstract":"This paper reports the electronic tuning of the quality factor (Q) and the apparent temperature coefficient of frequency (TCf) in a dog-bone resonator that is actuated by capacitive drive and sensed using piezoresistive readout. Starting off with an intrinsic Q of ~1.3×105, this device exhibits an amplification of effective Q (up to ~2.4×105) by controlling the bias current. Measured results from several samples repeatedly show similar steady increments of Q within a specific bias current range (0-15mA), and agree with theoretical predictions. As the bias current increases from 0mA to 20mA, it is found that the resonant frequency drift versus ambient temperature can be augmented by as much 2.5 times in terms of the apparent TCf. At the same time, the Q-independent transconductance remains linear with bias current and DC bias voltage from experimental results. We show that the tuning of Q and apparent TCf are due to thermomechanical coupling and can be effectively achieved by varying the bias current. This tuning process is not sensitive to electrostatic actuation.","PeriodicalId":92162,"journal":{"name":"2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS 2013) : Taipei, Taiwan, 20-24 January 2013. IEEE International Conference on Micro Electro Mechanical Systems (26th : 2013 : Taipei, Taiwan)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2013-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87315878","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
A compact passive air flow regulator for portable breath diagnostics 用于便携式呼吸诊断的紧凑型被动空气流量调节器
S. B. Johansson, G. Stemme, N. Roxhed
{"title":"A compact passive air flow regulator for portable breath diagnostics","authors":"S. B. Johansson, G. Stemme, N. Roxhed","doi":"10.1109/MEMSYS.2013.6474201","DOIUrl":"https://doi.org/10.1109/MEMSYS.2013.6474201","url":null,"abstract":"This work reports on a compact flow regulator designed to maintain a steady flow during breath diagnostics. The fabricated device consists of six in-plane moving pistons that restrict the flow through six flow orifices, controlling comparatively large air flows up to 50 ml/s at a pressure range of 1-2 kPa on a chip of only 2×2×4 mm3. The device is fabricated from three wafers, including an SOI wafer, using standard silicon micromachining and only three masks. The in-plane design also allows for scaling of the flow and pressure range by changing the thickness of the handle wafer and device layer. Experimental evaluation of the prototype shows that flow rate is regulated close to the dictated requirements for FENO asthma monitoring.","PeriodicalId":92162,"journal":{"name":"2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS 2013) : Taipei, Taiwan, 20-24 January 2013. IEEE International Conference on Micro Electro Mechanical Systems (26th : 2013 : Taipei, Taiwan)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2013-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90890743","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Effect of thickness anisotropy on degenerate modes in oxide micro-hemispherical shell resonators 厚度各向异性对氧化物微半球壳腔简并模的影响
L. Sorenson, P. Shao, F. Ayazi
{"title":"Effect of thickness anisotropy on degenerate modes in oxide micro-hemispherical shell resonators","authors":"L. Sorenson, P. Shao, F. Ayazi","doi":"10.1109/MEMSYS.2013.6474204","DOIUrl":"https://doi.org/10.1109/MEMSYS.2013.6474204","url":null,"abstract":"The effect of thickness anisotropy on the degenerate elliptical resonance modes of micro-hemispherical shell resonators (μHSRs) created using the thermal oxidation process is investigated. This anisotropy arises from the variation in wet thermal oxide growth according to the exposed crystal planes of the single-crystal-silicon hemispherical mold used to generate the μHSRs. It is shown that, despite the presence of thickness anisotropy, the degenerate resonance modes of oxide μHSRs can exhibit zero intrinsic frequency split depending on the particular resonance mode and symmetry of the thickness anisotropy imparted from the underlying silicon wafer. Measured results verified by simultaneous electrical excitation on the 0° and 45° axes demonstrate less than 94 Hz intrinsic m=3 frequency split for a 1240 μm oxide μHSR (limited by measurement conditions), which is to the authors' knowledge the smallest as-fabricated frequency split reported to date for any μHSR.","PeriodicalId":92162,"journal":{"name":"2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS 2013) : Taipei, Taiwan, 20-24 January 2013. IEEE International Conference on Micro Electro Mechanical Systems (26th : 2013 : Taipei, Taiwan)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2013-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90439476","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 23
Ultracompact optrode with integrated laser diode chips and SU-8 waveguides for optogenetic applications 集成激光二极管芯片和SU-8波导的超紧凑光极,用于光遗传应用
M. Schwaerzle, K. Seidl, U. Schwarz, O. Paul, P. Ruther
{"title":"Ultracompact optrode with integrated laser diode chips and SU-8 waveguides for optogenetic applications","authors":"M. Schwaerzle, K. Seidl, U. Schwarz, O. Paul, P. Ruther","doi":"10.1109/MEMSYS.2013.6474424","DOIUrl":"https://doi.org/10.1109/MEMSYS.2013.6474424","url":null,"abstract":"This paper reports on the design, fabrication and characterization of an innovative silicon-based neural probe with optical functionality. This so-called optrode is intended as an ultracompact tool for optogenetic applications in neuroscientific research. Beside platinum microe-lectrodes for electrical recording applications, bare laser diode (LD) chips combined with waveguides (WGs) implemented in the negative photoresist SU-8 are integrated on the probe. The assembly of the bare LD chips applies flip-chip and wire bonding and benefits of a lateral alignment accuracy better ±5 μm required for the efficient coupling of light into the 15-μm-wide and 13-μm-high WGs. Undesired tissue illumination due to stray light is effectively blocked using a micromachined cover chip adhesively bonded to the probe base. Probe shafts with a length of up to 8 mm and a thickness of 50 μm carrying four electrodes and two WGs each have been realized. The maximum optical output power per WG was measured to be 29.7 mW/mm2 for LDs with a center wavelength of 650 nm.","PeriodicalId":92162,"journal":{"name":"2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS 2013) : Taipei, Taiwan, 20-24 January 2013. IEEE International Conference on Micro Electro Mechanical Systems (26th : 2013 : Taipei, Taiwan)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2013-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75158295","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 50
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