2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)最新文献_第7页

Embedded High-Density Trench Capacitors for Smart Catheters 用于智能导尿管的嵌入式高密度沟槽电容器

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Pub Date : 2020-09-15 DOI: 10.1109/ESTC48849.2020.9229800

Jian Li, J. Naaborg, M. Louwerse, V. Henneken, C. Eugeni, R. Dekker

{"title":"Embedded High-Density Trench Capacitors for Smart Catheters","authors":"Jian Li, J. Naaborg, M. Louwerse, V. Henneken, C. Eugeni, R. Dekker","doi":"10.1109/ESTC48849.2020.9229800","DOIUrl":"https://doi.org/10.1109/ESTC48849.2020.9229800","url":null,"abstract":"Our work presents embedded high-density oxide-nitride-oxide (ONO) trench capacitors for power supply decoupling in the next generation of smart catheters. These millimeter-scale smart catheters are using a novel integration platform, Flex-to-Rigid (F2R). In the F2R platform, various functional modules are fabricated or assembled on thin silicon islands. They are connected by flexible interconnects and can be folded into arbitrary shapes to facilitate small form-factor integration. Trench decoupling capacitors have the advantage of being integrated into the thin silicon islands of F2R to reduce the parasitic inductances and space consumption. Additionally, their small surface openings can be closed by layer deposition to enable follow-up processes on the closed-up surface. For demonstration, high aspect ratio (1.1:25 and 1.2:30) ONO trench capacitors with total areas of 300x300 µm2 and 1000x1000 µm2 are fabricated on planar wafers, and a 700 nm and a 1 µm thick plasma-enhanced chemical vapor deposition (PECVD) SiO2 layers are deposited to test the trench closing process. The F2R compatible ONO trench capacitors have capacitance densities of 6.17 nF/mm2 and 10.12 nF/mm2, combined with breakdown voltages ranging from 28 to 30 V.","PeriodicalId":6785,"journal":{"name":"2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)","volume":"159 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2020-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77144000","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Thick Film Photoresist Process for Copper Pillar Bumps on Surface Acoustic Wave - Wafer Level Packages 表面声波上铜柱凸点的厚膜光刻胶工艺-晶圆级封装

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Pub Date : 2020-09-15 DOI: 10.1109/ESTC48849.2020.9229720

J. Schober, J. Berger, C. Eulenkamp, K. Nicolaus, G. Feiertag

{"title":"Thick Film Photoresist Process for Copper Pillar Bumps on Surface Acoustic Wave - Wafer Level Packages","authors":"J. Schober, J. Berger, C. Eulenkamp, K. Nicolaus, G. Feiertag","doi":"10.1109/ESTC48849.2020.9229720","DOIUrl":"https://doi.org/10.1109/ESTC48849.2020.9229720","url":null,"abstract":"SAW-filters (Surface Acoustic Wave) are used for mobile data transfer. Further miniaturization was achieved by replacing the standard interconnect technology via solder balls through CPBs (Copper Pillar Bumps) using a thick film photolithography. CPBs on SAW-filters with a height of approximately 80 μm after reflow, a diameter of 67 μm, almost vertical sidewalls, and excellent adhesion to the seedlayer were fabricated.This study describes in detail the spin coat recipe and the impact of lithography parameters. CPBs were structured with a positive tone photoresist, with a thickness of at least 80 μm (including pre-wet) and almost vertical sidewall resist opening shapes on TFAP™ (Thin Film Acoustic Packaging) packages. The sidewall shape of the resist openings strongly depends on the softbake duration. Exposure dose and post exposure bake duration do influence the resist opening diameters but not the resist sidewall shape if softbake duration is set correctly. The development process had no significant influence.Different tools and processes for plasma cleaning after resist development were investigated to optimize the adhesion of electroplated CPBs. A plasma tool with backside cooling and electrostatic chucking of the lithium niobate wafers allowed an appropriate plasma cleaning descum. The adhesion was determined via shear testing of copper pillars and a subsequent failure mode analysis with optical microscopy.The positive tone resist does not show any damage or peeling from the substrate after the optimized plasma cleaning process or after electroplating of copper, nickel and tin silver alloy. The CPBs withstand all further process steps including DBG (Dicing Before Grinding).","PeriodicalId":6785,"journal":{"name":"2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)","volume":"71 1","pages":"1-7"},"PeriodicalIF":0.0,"publicationDate":"2020-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74947593","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Contact Thermography – A Promising Method for Non-destructive Testing of Die Solder and Sinter Interconnects 接触式热成像仪——一种很有前途的用于模焊和烧结互连无损检测的方法

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Pub Date : 2020-09-15 DOI: 10.1109/ESTC48849.2020.9229846

M. Oppermann, T. Zerna

引用次数: 1

A miniaturized RGB-laser light engine 小型化rgb激光光引擎

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Pub Date : 2020-09-15 DOI: 10.1109/ESTC48849.2020.9229809

W. Reinert

引用次数: 0

Experimental Study of Panel Level Packaging Warpage 面板级包装翘曲的实验研究

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Pub Date : 2020-09-15 DOI: 10.1109/ESTC48849.2020.9229746

Diane Ecoiffier, P. Vernhes, R. Ooi, T. Braun, M. Dreissigacker, H. Fu

引用次数: 5

Influence of TiO2 layer thickness on the performance of dye-sensitized solar cells: theoretical investigations TiO2层厚度对染料敏化太阳能电池性能的影响:理论研究

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Pub Date : 2020-09-15 DOI: 10.1109/ESTC48849.2020.9229790

Ana Băarar, Marian Vlăadescu, P. Schiopu

引用次数: 0

Dipole Antennas 3D-printed from Conductive Thermoplastic Filament 用导电热塑性长丝3d打印的偶极天线

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Pub Date : 2020-09-15 DOI: 10.1109/ESTC48849.2020.9229736

Zahangir Khan, Han He, Xiaochen Chen, J. Virkki

{"title":"Dipole Antennas 3D-printed from Conductive Thermoplastic Filament","authors":"Zahangir Khan, Han He, Xiaochen Chen, J. Virkki","doi":"10.1109/ESTC48849.2020.9229736","DOIUrl":"https://doi.org/10.1109/ESTC48849.2020.9229736","url":null,"abstract":"Fused Deposition Modeling (FDM) of thermoplastics is a flexible and simple 3D printing method. FDM has a variety of adjustable fabrication parameters to modify both the mechanical and electrical properties of the printed structures. However, the use of 3D-printable conductive thermoplastic filaments for electronics manufacturing has so far been quite limited. This type of printing would allow 3D-printed antennas to be efficiently embedded inside 3D-printed structures during the manufacturing process. In this paper, we present prototypes of 3D-printed dipole antennas using a conductive copper-based filament. Despite some initial challenges in the printing process, three types of ultrahigh frequency (UHF) radiofrequency identification (RFID) tag antennas were successfully printed, one of which was a contour pattern and the other two were printed using 100 % antenna patterns. Based on the achieved results, the thickness or printing pattern of the 3D-printed dipole antenna had no major effect on the tag read range. All types of tags showed read ranges of around 0.7-1.1 meters. Further, they were functional throughout the global UHF RFID frequency band (860-960 MHz). These first results are promising, especially when considering the contour type of antenna, which saves a lot of printing material and time.","PeriodicalId":6785,"journal":{"name":"2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)","volume":"40 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2020-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73025362","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

An Organic Process Design Kit, from characterization to modelling and simulation 一个有机过程设计工具包，从表征到建模和仿真

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Pub Date : 2020-09-15 DOI: 10.1109/ESTC48849.2020.9229883

A. Arnal, L. Terés, E. Ramón

引用次数: 4

Metal Deposition Using Solutions on High-Density and Well-Aligned CNTs 高密度和排列良好的碳纳米管上的金属沉积

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Pub Date : 2020-09-15 DOI: 10.1109/ESTC48849.2020.9229813

M. Saito, H. Kuwae, J. Mizuno, W. Norimatsu, M. Kusunoki, Hiroshi Nishikawae

{"title":"Metal Deposition Using Solutions on High-Density and Well-Aligned CNTs","authors":"M. Saito, H. Kuwae, J. Mizuno, W. Norimatsu, M. Kusunoki, Hiroshi Nishikawae","doi":"10.1109/ESTC48849.2020.9229813","DOIUrl":"https://doi.org/10.1109/ESTC48849.2020.9229813","url":null,"abstract":"The preparation processes of Co-Cu and Au-Ag electrodeposited films and electroless Au films, using high-density and highly orientated CNTs on a SiC substrate, were investigated. The attachment via electrochemical reduction of PVP to the CNTs/SiC resulted in a hydrophilic CNTs surface the water contact angle reduced from 110° to 70°. After Co-Cu electrodeposition, the D-band shifted to a lower wavenumber, that indicated an increase in the mass number as Co-Cu metals deposited on the CNTS/SiC. However, the morphology of this Co-Cu electrodeposited film was not related to its hydrophilicity. The CNTs worked well as cathode electrodes because of their high conductivity. During the Co-Cu electrodeposition process, high pH and a complex agent were used. This did not affect the nucleation generation rate, however, the diffusion velocity affected the reaction velocity. Meanwhile, the Au-Ag particle sizes formed with a Pt seed layer were smaller than with the CNTs/SiC substrate. The nucleation generation rates were also different since CNTs/SiC conductivity was smaller than that of Pt. The deposition bath constitution was also thought to be connected to the deposition mechanism. Therefore, to obtain small-sized particles, a higher conductivity of CNTs was needed. Lastly, to obtain more precise metal particles, electroless Au deposition was carried out. After oxygen plasma treatment, the oxidized surface and inner CNTs were displaced by deposited Au ions. The deposition of Au, with particle size approximately 5 nm, was confirmed by TEM analysis and EDS mapping. CNTs mixed electrodeposition and electroless deposition of metals were also investigated. It was confirmed that metal nanoparticles enhanced the deposition of well aligned and high-density CNTs/SiC, with a diameter of 5 nm.","PeriodicalId":6785,"journal":{"name":"2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)","volume":"347 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2020-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76750614","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Solar cells integration in over-molded printed electronics 太阳能电池集成在复模印刷电子

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Pub Date : 2020-09-15 DOI: 10.1109/ESTC48849.2020.9229822

Mona Bakr, P. Bauwens, F. Bossuyt, J. Vanfleteren, Imen Chtioui, W. Christiaens

{"title":"Solar cells integration in over-molded printed electronics","authors":"Mona Bakr, P. Bauwens, F. Bossuyt, J. Vanfleteren, Imen Chtioui, W. Christiaens","doi":"10.1109/ESTC48849.2020.9229822","DOIUrl":"https://doi.org/10.1109/ESTC48849.2020.9229822","url":null,"abstract":"The continuous drive to have smart flexible systems in different application areas as automotive, households, and consumer electronics utilize the development of different integration approaches to include many electronic functionalities in 3D structures. This article reports a new conceptual idea that may be used as a platform for the integration of photovoltaic (PV) cells in plastic products. By using over-molding techniques, a thin flexible power source can be produced using amorphous silicon photovoltaic modules integrated into a thermoplastic material. Moreover, a clear benefit is achieved from such a combination of solar cells applied on flexible printed foils and the use of injection molding manufacturing process. The advantages include: being lightweight, flexibility as well as cost-effectiveness. The fabrication process is explained on both single and a matrix of PV modules. Different materials used for adhesion between the cells and the printed foils are discussed in this article. Each integrated sample consisted of a flexible substrate with a PV module assembled and fixed as an insert in the mold of the injection molding machine. A polymer is over-molded on it and a plastic part is formed. Afterwards, the solar cells are tested using IV measurements to confirm the feasibility of the technology to act as a thin light power source for different applications.","PeriodicalId":6785,"journal":{"name":"2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)","volume":"117 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2020-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79843746","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4