2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)最新文献_第5页

Silver-Sintering for Die-Attachment in HT-Sensor Applications – Materials and Reliability 高温传感器模具附件用银烧结。材料和可靠性

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Pub Date : 2020-09-15 DOI: 10.1109/ESTC48849.2020.9229762

M. Feißt, J. Wilde

引用次数: 0

Bidirectional neuroprosthesis system integration 双向神经假体系统集成

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Pub Date : 2020-09-15 DOI: 10.1109/ESTC48849.2020.9229697

L. Blystad, P. Ohlckers, L. Marchetti, E. Franti, M. Dascalu, O. Ionescu, D. Dobrescu, L. Dobrescu, Catalin Niculae, D. Dragomir, Birgitte Kasin Hønsvall, C. Opris, K. Imenes, M. Ion, A. Oproiu, A. Pascalau, C. Moldovan, B. Firtat, V. Ristoiu, R. Gheorghe, A. Barbilian

{"title":"Bidirectional neuroprosthesis system integration","authors":"L. Blystad, P. Ohlckers, L. Marchetti, E. Franti, M. Dascalu, O. Ionescu, D. Dobrescu, L. Dobrescu, Catalin Niculae, D. Dragomir, Birgitte Kasin Hønsvall, C. Opris, K. Imenes, M. Ion, A. Oproiu, A. Pascalau, C. Moldovan, B. Firtat, V. Ristoiu, R. Gheorghe, A. Barbilian","doi":"10.1109/ESTC48849.2020.9229697","DOIUrl":"https://doi.org/10.1109/ESTC48849.2020.9229697","url":null,"abstract":"Novel research results of an ongoing development of a personalized forearm neuroprosthesis are being presented. A complete design process shows how the mechanical structure is developed from 3D scanning to 3D printing. With an individual DC motor for each finger and one for the palm, the neuroprosthesis achieves 15 degrees of freedom. Artificial skin cover fingers and palm, acting as resistive pressure sensors, giving a linear full range readout voltage proportional to the applied pressure. Fabrication steps and first-generation implantable electrodes are presented together with analog front-end electronics and an implantable wireless communication system. Arduino is used to process received neural motor signals, control the mechanical hand and process the received feedback signals from the artificial skin. The feedback signals will be wirelessly transmitted to implantable electrode actuators, for stimulation of sensorial nerves. Thus, the work of a bidirectional neuroprosthesis system integration is presented.","PeriodicalId":6785,"journal":{"name":"2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)","volume":"8 1","pages":"1-7"},"PeriodicalIF":0.0,"publicationDate":"2020-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79988574","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Nanocomposite phosphor materials fabricated by solid-state reaction for optoelectronics application 基于固态反应制备的光电子应用纳米复合荧光粉材料

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Pub Date : 2020-09-15 DOI: 10.1109/ESTC48849.2020.9229683

Fan Chen, M. Akram, Xuyuan Chen

引用次数: 4

Evaluation of Microstructure and Electrical Property of Cu/graphene Composite Coatings for Electronics Interconnections 电子互连用铜/石墨烯复合涂层的微观结构和电性能评价

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Pub Date : 2020-09-15 DOI: 10.1109/ESTC48849.2020.9229882

Han Zhou, Hanqing Jiang, S. Robertson, Zhaoxia Zhou, Changqing Liu

引用次数: 0

Reliability of Silver Direct Bonding in Thermal Cycling Tests 热循环试验中银直接键合的可靠性

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Pub Date : 2020-09-15 DOI: 10.1109/ESTC48849.2020.9229753

Zechun Yu, Weijian Zeng, D. Zhao, Zheng Zhang, C. F. Bayer, A. Schletz, M. März

{"title":"Reliability of Silver Direct Bonding in Thermal Cycling Tests","authors":"Zechun Yu, Weijian Zeng, D. Zhao, Zheng Zhang, C. F. Bayer, A. Schletz, M. März","doi":"10.1109/ESTC48849.2020.9229753","DOIUrl":"https://doi.org/10.1109/ESTC48849.2020.9229753","url":null,"abstract":"Silver-Silver direct bonding has been developed as an alternative interconnection technique for 3D power integration which can form high-strength and low-resistance Ag joints under solid-state conditions. However, the reliability and failure mechanisms of these direct bonded joints have not been characterized yet. In this study, four direct bonded structures were accelerated aged with two different temperature cycling tests (TCT) in the temperature range between -55 °C and 220 °C. The thermally induced stresses in the metallization during TCT can be relieved by elastic and plastic deformation of the Ag films and the debonding at the interface. At higher temperatures above 150 °C, plastic deformation mechanisms dominate the stress relaxation. Stress-driven void migration along grain boundaries may lead to cracking and interfacial failure. Metallization with a diffusion barrier and large grain size can restrict the void formation and diffusion, therefore, provide a higher temperature capability. The results indicate that both the adhesion of the Ag metallization and the Ag-Ag direct bonding remain stable after 1000 thermal cycles.","PeriodicalId":6785,"journal":{"name":"2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)","volume":"1 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2020-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82286096","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

ELD NiB for microbumps passivation and wirebonding 用于微凸点钝化和线接的ELD笔尖

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Pub Date : 2020-09-15 DOI: 10.1109/ESTC48849.2020.9229785

J. Derakhshandeh, I. de Preter, Z. El-Mekki, L. Hou, C. Gerets, D. Dictus, K. Vanstreels, K. Croes, Andy Miller, G. Beyer, E. Beyne

引用次数: 0

System-Level Flip-Chip Ball Grid Array Solder Joint Reliability Assessment Under Different Methodologies and Correlation with Accelerated Thermal Cycling Experimental Data 不同方法下系统级倒装球栅阵列焊点可靠性评估及与加速热循环实验数据的相关性

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Pub Date : 2020-09-15 DOI: 10.1109/ESTC48849.2020.9229748

Iulia–Eliza Ţinca, P. Rai, D. Faller

{"title":"System-Level Flip-Chip Ball Grid Array Solder Joint Reliability Assessment Under Different Methodologies and Correlation with Accelerated Thermal Cycling Experimental Data","authors":"Iulia–Eliza Ţinca, P. Rai, D. Faller","doi":"10.1109/ESTC48849.2020.9229748","DOIUrl":"https://doi.org/10.1109/ESTC48849.2020.9229748","url":null,"abstract":"Even if there are decades of research available in solder joint reliability (SJR), there is still a lack of enough constitutive solder models to adapt new materials on the market [1]. The high computing power available today lets us investigate the complex stress state in the solder joints due to underfilling or conformal coating [2], [3]. In the last couple of years, the research is transitioning from component and board-level analyses to system-level analyses. Densely populated product boards constrained in housings introduce additional stress in the solder joints. New prediction models and methodologies thus emerge [4], [5], [6]. The scope of this paper is to identify a methodology that can be both reliable and efficient for evaluating electronic components in their use environment. We consider lifetime prediction methodologies from the literature [7], [8], as well as Sherlock™ and the Creep Strain Energy Density Ratio (SED-R) approach based on the Coffin-Manson fatigue model. We predict the lifetime of two flip-chip ball grid array (FCBGA) packages under different system-level configurations and loading. We correlate theoretical results with accelerated thermal cycling test results. From the methods considered in this work, we consider SED-R to be the best approach for system-level solder joint reliability assessment because of its transparency and versatility. The availability of Weibull data on packages could be a game-changer in the system-level SJR analysis by increasing the precision of methodologies as SED-R and Sherlock™.","PeriodicalId":6785,"journal":{"name":"2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)","volume":"37 1","pages":"1-8"},"PeriodicalIF":0.0,"publicationDate":"2020-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73166511","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Thermodynamic and kinetic factors governing wetting of oxidized and deoxidized Cu surfaces by liquid Sn 液态锡润湿氧化和脱氧铜表面的热力学和动力学因素

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Pub Date : 2020-09-15 DOI: 10.1109/ESTC48849.2020.9229823

O. Liashenko, F. Hodaj

引用次数: 0

Investigations on passive Temperature-Cycling Robustness of novel Interconnection Element for low-inductive Power Modules 新型低电感功率模块互连元件无源温度循环鲁棒性研究

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Pub Date : 2020-09-15 DOI: 10.1109/ESTC48849.2020.9229700

A. Klemm, M. Schmidt, M. Rittner, M. Guyenot, M. Reinold, Rainer Holz, U. Kessler

引用次数: 0

Analysis of package design of optic modules for automotive cameras to realize reliable image sharpness 分析汽车相机光学模块的封装设计，以实现可靠的图像清晰度

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Pub Date : 2020-09-15 DOI: 10.1109/ESTC48849.2020.9229786

S. Kühn, Amit Pandey, A. Zippelius, Klaus Schneider, H. Erdogan, G. Elger

{"title":"Analysis of package design of optic modules for automotive cameras to realize reliable image sharpness","authors":"S. Kühn, Amit Pandey, A. Zippelius, Klaus Schneider, H. Erdogan, G. Elger","doi":"10.1109/ESTC48849.2020.9229786","DOIUrl":"https://doi.org/10.1109/ESTC48849.2020.9229786","url":null,"abstract":"To enable future autonomous driving, failure free operation is a requirement for safety relevant electronic and mechanical components. The paper investigates the health indicator (HI), change in sharpness (CIS), used for condition monitoring (CM) of optical modules of automotive stereo cameras. Driven by the cyclic thermo-mechanical stress, strain and displacement, the sharpness of the optical imaging system can change. Different root causes for change in sharpness (CIS) are identified and the contribution of the different failure modes for CIS are investigated. Failure modes are separated in two categories: Changes in the distance between focal and image plane by displacement of the image plane (failure mode -package) and changes in the lens stack of the objective (failure mode - objective). By combining DOE and accelerated life testing the contribution of different stress conditions, i.e. vibrations and temperature cycling, was quantified and compared. Strong evidence was found that vibration induced aging has no influence on optical performance of the objective. Moreover, the comparison showed that vibration induced CIS can be neglected compart to CIS induced by thermo-mechanical cycling. To investigate CIS as a health indicator for the entire camera sensor the specification and development of a novel in situ measurement system for CM of camera sensors is described.","PeriodicalId":6785,"journal":{"name":"2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)","volume":"10 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2020-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73532513","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5