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2015 IEEE Hot Chips 27 Symposium (HCS)最新文献

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Professional H.265/HEVC encoder LSI toward high-quality 4K/8K broadcast infrastructure 面向高质量4K/8K广播基础设施的专业H.265/HEVC编码器LSI
2015 IEEE Hot Chips 27 Symposium (HCS) Pub Date : 2015-08-01 DOI: 10.1109/HOTCHIPS.2015.7477464
Hiroe Iwasaki, Takayuki Onishi, K. Nakamura, K. Nitta, T. Sano, Y. Nishida, K. Yokohari, Jia Su, N. Ono, R. Kusaba, Atsushi Sagata, M. Ikeda, A. Shimizu
{"title":"Professional H.265/HEVC encoder LSI toward high-quality 4K/8K broadcast infrastructure","authors":"Hiroe Iwasaki, Takayuki Onishi, K. Nakamura, K. Nitta, T. Sano, Y. Nishida, K. Yokohari, Jia Su, N. Ono, R. Kusaba, Atsushi Sagata, M. Ikeda, A. Shimizu","doi":"10.1109/HOTCHIPS.2015.7477464","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2015.7477464","url":null,"abstract":"This article consists of a collection of slides from the authors' conference presentation. Some of the topics discussed include: Introduction and Background; NARA Architecture; NARA Key Features and Functions; NARA Chip Implementation; Target Applications; Conclusion.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"1 1","pages":"1-24"},"PeriodicalIF":0.0,"publicationDate":"2015-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89344751","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Deep learning: Architectures, algorithms, applications 深度学习:架构、算法、应用
2015 IEEE Hot Chips 27 Symposium (HCS) Pub Date : 2015-08-01 DOI: 10.1109/HOTCHIPS.2015.7477319
R. Memisevic
{"title":"Deep learning: Architectures, algorithms, applications","authors":"R. Memisevic","doi":"10.1109/HOTCHIPS.2015.7477319","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2015.7477319","url":null,"abstract":"This article consists of a collection of slides from the author's conference presentation. Some of the topics covered include: Machine learning 101: Neural nets, backprop, RNNs; Applications; Structured prediction; Unsupervised learning; \"Neural Programs\"; Architecture exploration; Towards hardware-friendlier DL; and Software.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"18 1","pages":"1-127"},"PeriodicalIF":0.0,"publicationDate":"2015-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77194100","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Microarchitectures undo software security measures 微架构撤销软件安全措施
2015 IEEE Hot Chips 27 Symposium (HCS) Pub Date : 2015-01-01 DOI: 10.1109/hotchips.2015.7477472
{"title":"Microarchitectures undo software security measures","authors":"","doi":"10.1109/hotchips.2015.7477472","DOIUrl":"https://doi.org/10.1109/hotchips.2015.7477472","url":null,"abstract":"This article consists of a collection of slides from the conference presentation and the following topics are dealt with: software security measures; software based cryptography; microarchitecture implementations; Boolean masking; ARM; and Intel AES-NI.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"1 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2015-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74575652","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Welcome program chairs 欢迎节目主持人
2015 IEEE Hot Chips 27 Symposium (HCS) Pub Date : 2014-08-01 DOI: 10.1109/HOTCHIPS.2014.7478804
S. Naffziger, G. Sohi
{"title":"Welcome program chairs","authors":"S. Naffziger, G. Sohi","doi":"10.1109/HOTCHIPS.2014.7478804","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2014.7478804","url":null,"abstract":"Welcome to HOT CHIPS 26, the 26th anniversary conference. A look back over these 26 years shows the amazing progress made in computer engineering. This progress can be measured in terms of performance, cost, density and versatility of function. These technological advances have brought advances in functionality, creating new companies, new markets and indeed new patterns of socialization.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"318 1","pages":"1-2"},"PeriodicalIF":0.0,"publicationDate":"2014-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79400433","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The internet of everything 万物互联
2015 IEEE Hot Chips 27 Symposium (HCS) Pub Date : 2014-08-01 DOI: 10.1109/HOTCHIPS.2014.7478826
Rob Chandhok
{"title":"The internet of everything","authors":"Rob Chandhok","doi":"10.1109/HOTCHIPS.2014.7478826","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2014.7478826","url":null,"abstract":"Presents a collection of slides that address the topic of the Internet of Everything (IoE). Some of the following topics are addressed: the special features and technologies that comprise the IoE; factors driving the market for IoE; IoE connectivity and networks; IoE smart cities and global cities; and trends that will drive the market for the IoE.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"94 1","pages":"1-29"},"PeriodicalIF":0.0,"publicationDate":"2014-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91324231","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Secure systems design 安全系统设计
2015 IEEE Hot Chips 27 Symposium (HCS) Pub Date : 2014-08-01 DOI: 10.1109/HOTCHIPS.2014.7478797
L. V. Doorn
{"title":"Secure systems design","authors":"L. V. Doorn","doi":"10.1109/HOTCHIPS.2014.7478797","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2014.7478797","url":null,"abstract":"Presents a collection of slides that address the topic of secure systems design. Some of the following topics are addressed: types of software and hardware attacks; need for system and data integrity; CPU virtualization; I/O virtualization; secure coprocessors; encrypted memory; and the key features and security capabilities of secure hypervisors and physical secure processors.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"7 1","pages":"1-31"},"PeriodicalIF":0.0,"publicationDate":"2014-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88306806","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Welcome from general chairs 欢迎各位来宾
2015 IEEE Hot Chips 27 Symposium (HCS) Pub Date : 2013-08-01 DOI: 10.1109/HOTCHIPS.2013.7478282
K. Asanović, J. V. D. Waerdt
{"title":"Welcome from general chairs","authors":"K. Asanović, J. V. D. Waerdt","doi":"10.1109/HOTCHIPS.2013.7478282","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2013.7478282","url":null,"abstract":"End of August is upon us and we are about to embark upon three days of HotChips: the conference where industry and academia connect. After last year's off-site at the “Flint Center” at De Anza College, we are back at our regular location: “Memorial Auditorium” at Stanford University. Like most years, this year's conference provides you with one day of tutorials and two days of keynote and regular presentations.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"49 1","pages":"1-2"},"PeriodicalIF":0.0,"publicationDate":"2013-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"78645358","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Silicon Photonics Technology Platform for integration of optical IOs with ASICs 集成光学IOs与asic的硅光子学技术平台
2015 IEEE Hot Chips 27 Symposium (HCS) Pub Date : 2013-08-01 DOI: 10.1109/HOTCHIPS.2013.7478308
P. D. Dobbelaere
{"title":"Silicon Photonics Technology Platform for integration of optical IOs with ASICs","authors":"P. D. Dobbelaere","doi":"10.1109/HOTCHIPS.2013.7478308","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2013.7478308","url":null,"abstract":"• We highlighted Silicon Photonics Technology Platform and its scalability to increased data rates, higher interconnect densities and low system level power dissipation. • Silicon photonics has been in production since 2009 and has shipped > 500K+ chipsets for use in High Performance Computing and Datacenters. • We made the trade-off between hybrid and monolithic integration of photonics and electronics. Hybrid Silicon Photonics allows cost effective integration of photonics with advanced electronic nodes. • By integrating 3rd Party IP in the electronic IC, hybrid integration enables a first level of ASIC integration with Photonics. • A next level of ASIC integration is enabled by a “Silicon Photonics Interposer” where photonic capabilities are combined with hybrid integration with electronics and TSV technology.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"46 1","pages":"1-18"},"PeriodicalIF":0.0,"publicationDate":"2013-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73040426","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Welcome to Hot Chips 24 欢迎来到Hot Chips 24
2015 IEEE Hot Chips 27 Symposium (HCS) Pub Date : 2012-08-01 DOI: 10.1109/HOTCHIPS.2012.7476477
Rumi Zahir, Christos Kozyrakis
{"title":"Welcome to Hot Chips 24","authors":"Rumi Zahir, Christos Kozyrakis","doi":"10.1109/HOTCHIPS.2012.7476477","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2012.7476477","url":null,"abstract":"Presents the opening message from the Hot Chips 24 Proceedings that was held 27-29 August 2012, in Cupertino, CA. Also includes conference program committee members, program statistics, keynote speakers, conference tutorials, conference proceedings, conference etiquette, and persons named in memoriam.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"24 1","pages":"1-11"},"PeriodicalIF":0.0,"publicationDate":"2012-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91532517","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
SOC programming tutorial SOC编程教程
2015 IEEE Hot Chips 27 Symposium (HCS) Pub Date : 2012-01-01 DOI: 10.1109/HOTCHIPS.2012.7476464
Neil Trevett
{"title":"SOC programming tutorial","authors":"Neil Trevett","doi":"10.1109/HOTCHIPS.2012.7476464","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2012.7476464","url":null,"abstract":"","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"22 1","pages":"1-71"},"PeriodicalIF":0.0,"publicationDate":"2012-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82277503","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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