{"title":"欢迎各位来宾","authors":"K. Asanović, J. V. D. Waerdt","doi":"10.1109/HOTCHIPS.2013.7478282","DOIUrl":null,"url":null,"abstract":"End of August is upon us and we are about to embark upon three days of HotChips: the conference where industry and academia connect. After last year's off-site at the “Flint Center” at De Anza College, we are back at our regular location: “Memorial Auditorium” at Stanford University. Like most years, this year's conference provides you with one day of tutorials and two days of keynote and regular presentations.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"49 1","pages":"1-2"},"PeriodicalIF":0.0000,"publicationDate":"2013-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Welcome from general chairs\",\"authors\":\"K. Asanović, J. V. D. Waerdt\",\"doi\":\"10.1109/HOTCHIPS.2013.7478282\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"End of August is upon us and we are about to embark upon three days of HotChips: the conference where industry and academia connect. After last year's off-site at the “Flint Center” at De Anza College, we are back at our regular location: “Memorial Auditorium” at Stanford University. Like most years, this year's conference provides you with one day of tutorials and two days of keynote and regular presentations.\",\"PeriodicalId\":6666,\"journal\":{\"name\":\"2015 IEEE Hot Chips 27 Symposium (HCS)\",\"volume\":\"49 1\",\"pages\":\"1-2\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE Hot Chips 27 Symposium (HCS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/HOTCHIPS.2013.7478282\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE Hot Chips 27 Symposium (HCS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HOTCHIPS.2013.7478282","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
End of August is upon us and we are about to embark upon three days of HotChips: the conference where industry and academia connect. After last year's off-site at the “Flint Center” at De Anza College, we are back at our regular location: “Memorial Auditorium” at Stanford University. Like most years, this year's conference provides you with one day of tutorials and two days of keynote and regular presentations.