Welcome program chairs

S. Naffziger, G. Sohi
{"title":"Welcome program chairs","authors":"S. Naffziger, G. Sohi","doi":"10.1109/HOTCHIPS.2014.7478804","DOIUrl":null,"url":null,"abstract":"Welcome to HOT CHIPS 26, the 26th anniversary conference. A look back over these 26 years shows the amazing progress made in computer engineering. This progress can be measured in terms of performance, cost, density and versatility of function. These technological advances have brought advances in functionality, creating new companies, new markets and indeed new patterns of socialization.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"318 1","pages":"1-2"},"PeriodicalIF":0.0000,"publicationDate":"2014-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE Hot Chips 27 Symposium (HCS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HOTCHIPS.2014.7478804","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

Welcome to HOT CHIPS 26, the 26th anniversary conference. A look back over these 26 years shows the amazing progress made in computer engineering. This progress can be measured in terms of performance, cost, density and versatility of function. These technological advances have brought advances in functionality, creating new companies, new markets and indeed new patterns of socialization.
欢迎节目主持人
欢迎来到HOT CHIPS 26, 26周年纪念大会。回顾这26年,计算机工程取得了惊人的进步。这种进步可以用性能、成本、密度和功能的多功能性来衡量。这些技术进步带来了功能上的进步,创造了新的公司,新的市场,实际上是新的社会化模式。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信