集成光学IOs与asic的硅光子学技术平台

P. D. Dobbelaere
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引用次数: 3

摘要

•我们重点介绍了硅光子技术平台及其可扩展性,以提高数据速率,更高的互连密度和低系统级功耗。•硅光子学自2009年以来一直在生产,并已出货> 500K+芯片组用于高性能计算和数据中心。•我们在光子学和电子学的混合集成和单片集成之间做出了权衡。混合硅光子学使光子学与先进的电子节点具有成本效益的集成。•通过在电子IC中集成第三方IP,混合集成使ASIC与Photonics集成的第一级成为可能。•ASIC集成的下一个层次是由“硅光子中间体”实现的,其中光子功能与电子和TSV技术的混合集成相结合。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Silicon Photonics Technology Platform for integration of optical IOs with ASICs
• We highlighted Silicon Photonics Technology Platform and its scalability to increased data rates, higher interconnect densities and low system level power dissipation. • Silicon photonics has been in production since 2009 and has shipped > 500K+ chipsets for use in High Performance Computing and Datacenters. • We made the trade-off between hybrid and monolithic integration of photonics and electronics. Hybrid Silicon Photonics allows cost effective integration of photonics with advanced electronic nodes. • By integrating 3rd Party IP in the electronic IC, hybrid integration enables a first level of ASIC integration with Photonics. • A next level of ASIC integration is enabled by a “Silicon Photonics Interposer” where photonic capabilities are combined with hybrid integration with electronics and TSV technology.
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