2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference最新文献_第9页

Response prediction and verification for PCB with package due to thermal and random vibration coupling effects 热和随机振动耦合效应下带封装PCB的响应预测与验证

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI: 10.1109/IMPACT.2009.5382202

Bor-Tsuen Wang, Fu-Xiang Hsu, Xiu-Wei Liang, Chen-Hsiung Hung, Y. Lai, Chang-Lin Yeh, Ying-Chih Lee

{"title":"Response prediction and verification for PCB with package due to thermal and random vibration coupling effects","authors":"Bor-Tsuen Wang, Fu-Xiang Hsu, Xiu-Wei Liang, Chen-Hsiung Hung, Y. Lai, Chang-Lin Yeh, Ying-Chih Lee","doi":"10.1109/IMPACT.2009.5382202","DOIUrl":"https://doi.org/10.1109/IMPACT.2009.5382202","url":null,"abstract":"The printed circuit board (PCB) subject to vibration and thermal couple loading is of great interest. This work presents both theoretical analysis and experimental verification for the PCB in heating condition subject to random vibration. The designed heating pad is used as the heating source attached to the package on PCB by providing constant temperature inputs. The calibrated finite element model of PCB in fixture condition is employed to perform thermal analysis for the PCB subjected to the fixed high temperature at the package surface. The thermal response of the PCB can be determined, and thus the spectrum response analysis of the PCB including the thermal effect for random excitation according to JEDEC specification is carried out. The temperature distribution over the PCB in heating condition is monitored by the digital infrared thermography and compared with that of finite element analysis (FEA). The acceleration spectral responses on the PCB during random vibration test with thermal effect are also recorded. Results show that the predicted temperature distribution for the heated PCB and acceleration response due to thermal and random vibration compound loadings agree reasonably between the FEA and experiments. The stress fields on the PCB subject to the thermal input and random vibration excitation can then be obtained and evaluated for its possible fatigue failures due to the compound loading effects. This work presents the analytical solutions via the commercial FE code for the PCB subject to compound loadings for thermal input and random vibration excitation. The predicted results are well validated by comparing with experiments. The developed methodology will be beneficial for further study of PCB and its package reliability in considering both thermal and vibration inputs simultaneously.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"1 1","pages":"401-404"},"PeriodicalIF":0.0,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89454934","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Thermal management of liquid-cooled cold plates for multiple heat sources in a humanoid robot 人形机器人多热源液冷冷板的热管理

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI: 10.1109/IMPACT.2009.5382215

S. Kim, Kyudae Hwang, Jong-Chul Moon, S. Karng

引用次数: 7

Guarding trace and ground via-hole analysis for DDR interface designed in high-speed packages 高速封装中DDR接口的保护走线和接地过孔分析

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI: 10.1109/IMPACT.2009.5382159

R. Sung, K. Chiang, J. Lai, Yu-Po Wang

引用次数: 0

Interfacial toughness evaluation of SAC305 solder bump with pendulum impact test 用摆锤冲击试验评价SAC305凸点的界面韧性

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI: 10.1109/IMPACT.2009.5382239

F. Tai, J. Duh

引用次数: 0

Design optimization and analysis of a novel nanocomposite-film typed flip chip technology 一种新型纳米复合薄膜型倒装芯片技术的设计优化与分析

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI: 10.1109/IMPACT.2009.5382287

Hsien-Chie Cheng, Kun-Yu Hsieh

引用次数: 0

iNEMI solder paste deposition project - First stage review optimizing solder paste printing for large and small components iNEMI锡膏沉积项目-第一阶段审查优化大型和小型组件的锡膏印刷

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI: 10.1109/IMPACT.2009.5382261

Shoukai Zhang, R. Mohanty, Xiaodong Jiang, R. Mao, J. Lee, Chuan Xia, K. Sweatman, D. Teoh

引用次数: 1

High-frequency characterization of direct plated copper metallized substrate and its application on microwave circuit 直接镀铜金属化衬底的高频特性及其在微波电路中的应用

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI: 10.1109/IMPACT.2009.5382279

Chien-Cheng Wei, Chin-Ta Fan, Ta-Hsiang Chiang, Ming-Kuen Chiu, S. Ru

{"title":"High-frequency characterization of direct plated copper metallized substrate and its application on microwave circuit","authors":"Chien-Cheng Wei, Chin-Ta Fan, Ta-Hsiang Chiang, Ming-Kuen Chiu, S. Ru","doi":"10.1109/IMPACT.2009.5382279","DOIUrl":"https://doi.org/10.1109/IMPACT.2009.5382279","url":null,"abstract":"Direct plated copper (DPC) metallized substrate is introduced, characterized, and demonstrated in this paper. The proposed DPC metallized substrate has the main advantages of high-frequency characteristics and excellent thermal management, due to the use of ceramic substrate and metallized copper conductor. Besides, the DPC process also provides high circuit density, fine pitch, and low cost potential compared to other technologies, like direct bonded copper (DBC), Low-Temperature Cofired Ceramics (LTCC), and High-Temperature Cofired Ceramics (HTCC) processes. Therefore, to characterize the electrical properties of DPC substrate for high-frequency applications, a simple extraction method was adopted to carry out the correlated values of dielectric constant and dielectric loss at Ku-band. However, to validate the extracted parameters, a 10-GHz parallel-coupled line band-pass filter (BPF) was demonstrated by using the presented DPC substrate. This BPF has measured insertion loss of only 0.5dB and return loss of above 10dB in the passband. It obviously proved that the DPC metallized substrate is very capable for RF module packages and microwave components, with its excellent low loss performance.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"2 1","pages":"681-684"},"PeriodicalIF":0.0,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88852799","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Impact of surface treatment on high frequency signal loss characteristics 表面处理对高频信号损耗特性的影响

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI: 10.1109/IMPACT.2009.5382222

A. Zee, R. Massey, H. Reischer

引用次数: 5

Stress evaluations in micro bump structures of FCBGA FCBGA微凹凸结构的应力评估

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI: 10.1109/IMPACT.2009.5382160

W. Y. Huang, E. Chen, D. Jiang, Yu Po Wang, J. Chiang, F. Tsai, R. Huang, E. Lee, I. Chang

引用次数: 1

Film type solder mask evaluation for flip chip BGA 倒装芯片BGA的薄膜型阻焊评估

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI: 10.1109/IMPACT.2009.5382163

ChungJen Fu, D. Chang, C. Chen

{"title":"Film type solder mask evaluation for flip chip BGA","authors":"ChungJen Fu, D. Chang, C. Chen","doi":"10.1109/IMPACT.2009.5382163","DOIUrl":"https://doi.org/10.1109/IMPACT.2009.5382163","url":null,"abstract":"In this paper, the effects of solder mask are studied and two types of solder mask are used in this study, include liquid type and dry film type. Ether liquid type or dry film type solder mask has its own advantage and disadvantage. For liquid type, it is a mature process and can be operated without vacuum environment. However, for dry film type, it needs to be operated in vacuum environment for preventing contamination and void, but dry film type could get better solder mask thickness uniformity and smaller roughness. The test vehicle of this study is 42.5mm*42.5mm Flip Chip Ball Grid Array (FCBGA) with 150um bump pitch composed with different solder mask material. Two kinds of substrate are evaluated in this study: liquid type solder mask (S/M1), dry film type solder mask (S/M2). Substrate roughness, adhesion test, PKG level coplanarity, PKG warpage and reliability test are conducted to evaluate the effect of dry film type and liquid type solder mask on substrate and PKG. The results shows that dry film type solder mask has lower roughness than liquid type. For the part of adhesion test between underfill and solder mask, dry film type solder mask shows similar adhesion strength to liquid type. Shadow moiré is employed to measure warpage and the results shows substrate with dry film solder mask has lower warpage. For the reliability life test, two packages are subjected to pre-condition of JEDEC MSL Level 3, TCT1000, HTSL1000 and HAST168, and both two packages passes reliability test.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"37 1","pages":"121-123"},"PeriodicalIF":0.0,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89564170","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1