发布求助
文献互助 智能选刊 最新文献

2013 IEEE International Test Conference (ITC)最新文献

筛选
英文 中文
Adaptive testing - Cost reduction through test pattern sampling 自适应测试——通过测试模式采样降低成本
2013 IEEE International Test Conference (ITC) Pub Date : 2013-09-01 DOI: 10.1109/TEST.2013.6651891
M. Grady, Bradley Pepper, Joshua Patch, Mike Degregorio, P. Nigh
{"title":"Adaptive testing - Cost reduction through test pattern sampling","authors":"M. Grady, Bradley Pepper, Joshua Patch, Mike Degregorio, P. Nigh","doi":"10.1109/TEST.2013.6651891","DOIUrl":"https://doi.org/10.1109/TEST.2013.6651891","url":null,"abstract":"In this paper, we will present two different applications of “test pattern sampling” for logic testing that have significantly improved test cost for Processors and SOCs/ASICs at IBM. The drivers and implementations for these two methods were completely different - one relying on real-time analysis/optimization applied at wafer test; the other based on off-line analysis with daily updates and real-time adjustments at Final Test.","PeriodicalId":6379,"journal":{"name":"2013 IEEE International Test Conference (ITC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2013-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86158436","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 13
Module diversification: Fault tolerance and aging mitigation for runtime reconfigurable architectures 模块多样化:运行时可重构架构的容错和老化缓解
2013 IEEE International Test Conference (ITC) Pub Date : 2013-09-01 DOI: 10.1109/TEST.2013.6651926
Hongyan Zhang, L. Bauer, M. Kochte, E. Schneider, Claus Braun, M. Imhof, H. Wunderlich, J. Henkel
{"title":"Module diversification: Fault tolerance and aging mitigation for runtime reconfigurable architectures","authors":"Hongyan Zhang, L. Bauer, M. Kochte, E. Schneider, Claus Braun, M. Imhof, H. Wunderlich, J. Henkel","doi":"10.1109/TEST.2013.6651926","DOIUrl":"https://doi.org/10.1109/TEST.2013.6651926","url":null,"abstract":"Runtime reconfigurable architectures based on Field-Programmable Gate Arrays (FPGAs) are attractive for realizing complex applications. However, being manufactured in latest semiconductor process technologies, FPGAs are increasingly prone to aging effects, which reduce the reliability of such systems and must be tackled by aging mitigation and application of fault tolerance techniques. This paper presents module diversification, a novel design method that creates different configurations for runtime reconfigurable modules. Our method provides fault tolerance by creating the minimal number of configurations such that for any faulty Configurable Logic Block (CLB) there is at least one configuration that does not use that CLB. Additionally, we determine the fraction of time that each configuration should be used to balance the stress and to mitigate the aging process in FPGA-based runtime reconfigurable systems. The generated configurations significantly improve reliability by fault-tolerance and aging mitigation.","PeriodicalId":6379,"journal":{"name":"2013 IEEE International Test Conference (ITC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2013-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84289564","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 39
Test-yield improvement of high-density probing technology using optimized metal backer with plastic patch 利用优化后的塑料贴片金属垫片提高高密度探测技术的测试良率
2013 IEEE International Test Conference (ITC) Pub Date : 2013-09-01 DOI: 10.1109/TEST.2013.6651888
Sen-Kuei Hsu, Hao Chen, Chung-Han Huang, Der-Jiann Liu, Wei-Hsun Lin, Hung-Chih Lin, C. Peng, Min-Jer Wang
{"title":"Test-yield improvement of high-density probing technology using optimized metal backer with plastic patch","authors":"Sen-Kuei Hsu, Hao Chen, Chung-Han Huang, Der-Jiann Liu, Wei-Hsun Lin, Hung-Chih Lin, C. Peng, Min-Jer Wang","doi":"10.1109/TEST.2013.6651888","DOIUrl":"https://doi.org/10.1109/TEST.2013.6651888","url":null,"abstract":"High-density probing is a main trend of the test technology. The warping issues of probe card are caused by the high-density test. The metal backer and patches are applied to solve this problem and the optimized sizes of backer and patches are decided by the proposed flow. Using the probe card with optimized backer and patches, the stability of test can be ensured and the test yields are increased. 26.56% test-yield improvement can be obtained.","PeriodicalId":6379,"journal":{"name":"2013 IEEE International Test Conference (ITC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2013-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89139320","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Two-level compression through selective reseeding 通过选择性重新播种进行两级压缩
2013 IEEE International Test Conference (ITC) Pub Date : 2013-03-15 DOI: 10.1109/TEST.2013.6651896
P. Wohl, J. Waicukauski, Frederic Neuveux, Gregory A. Maston, Nadir Achouri, J. E. Colburn
{"title":"Two-level compression through selective reseeding","authors":"P. Wohl, J. Waicukauski, Frederic Neuveux, Gregory A. Maston, Nadir Achouri, J. E. Colburn","doi":"10.1109/TEST.2013.6651896","DOIUrl":"https://doi.org/10.1109/TEST.2013.6651896","url":null,"abstract":"As scan compression becomes ubiquitous, ever more complex designs require higher compression. This paper presents a novel, two-level compression system for scan input data generated by deterministic test generation. First, load care bits and X-control input data are encoded into PRPG seeds; next, seeds are selectively shared for further compression. The latter exploits the hierarchical nature of large designs with tens or hundreds of PRPGs. The system comprises a new architecture, which includes a simple instruction-decode unit, and new algorithms embedded into ATPG. Results on large industrial designs demonstrate significant data and cycle compression increases while maintaining test coverage and performance.","PeriodicalId":6379,"journal":{"name":"2013 IEEE International Test Conference (ITC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2013-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85578754","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
A test probe for TSV using resonant inductive coupling 一种采用谐振电感耦合的TSV测试探头
2013 IEEE International Test Conference (ITC) Pub Date : 2013-01-01 DOI: 10.1109/itc.2013.6861555
R. Rashidzadeh, I. Basith
{"title":"A test probe for TSV using resonant inductive coupling","authors":"R. Rashidzadeh, I. Basith","doi":"10.1109/itc.2013.6861555","DOIUrl":"https://doi.org/10.1109/itc.2013.6861555","url":null,"abstract":"A contactless TSV probe based on the principle of resonant inductive coupling is presented in this work. The proposed scheme allows TSV data observation up to 2Gbps when the probe and TSV are 15μm apart.","PeriodicalId":6379,"journal":{"name":"2013 IEEE International Test Conference (ITC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2013-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"72739394","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
首页 上一页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：481959085
Book学术官方微信