利用优化后的塑料贴片金属垫片提高高密度探测技术的测试良率

2013 IEEE International Test Conference (ITC) Pub Date : 2013-09-01 DOI:10.1109/TEST.2013.6651888

Sen-Kuei Hsu, Hao Chen, Chung-Han Huang, Der-Jiann Liu, Wei-Hsun Lin, Hung-Chih Lin, C. Peng, Min-Jer Wang

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引用次数: 0

摘要

高密度探测是测试技术发展的主要趋势。探针卡翘曲问题是由高密度测试引起的。采用金属支撑片和贴片来解决这一问题，并根据所提出的流程来确定支撑片和贴片的最佳尺寸。采用优化后的支架和贴片的探针卡，保证了测试的稳定性，提高了测试收率。试验良率提高26.56%。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Test-yield improvement of high-density probing technology using optimized metal backer with plastic patch

High-density probing is a main trend of the test technology. The warping issues of probe card are caused by the high-density test. The metal backer and patches are applied to solve this problem and the optimized sizes of backer and patches are decided by the proposed flow. Using the probe card with optimized backer and patches, the stability of test can be ensured and the test yields are increased. 26.56% test-yield improvement can be obtained.

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来源期刊

2013 IEEE International Test Conference (ITC)

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