Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology最新文献

{"title":"A sliding-disk method for decoupled planning of five-axis tool paths in flat and filleted end milling with uniform-scallop and uniform-strip-width constraints","authors":"De-Ning Song ,&nbsp;Wen-Tao Xie ,&nbsp;Pei-Yao Li ,&nbsp;Jian-Wei Ma ,&nbsp;Jing-Hua Li","doi":"10.1016/j.precisioneng.2025.02.003","DOIUrl":"10.1016/j.precisioneng.2025.02.003","url":null,"abstract":"<div><div>Five-axis flat-end and filleted-end milling is crucial in high-efficiency machining of complex parts with curved surfaces. However, different from ball-end machining, there exists coupling influences between the scallop height, the strip width, the cutter-contact paths, and the tool-orientation paths in flat-end and filleted-end five-axis machining, which makes the toolpath planning so challenging that most existing methods cannot guarantee uniform scallop height and uniform strip width simultaneously. To deal with this problem, this paper presents a “sliding-disk” method for decoupled planning of five-axis toolpath in flat and filleted end milling, which transforms the problem of the toolpath planning into a problem of “a disk sliding on a rail”. First, the pose of the cutter is transformed into that of a “disk”. Then, the residual shape of the surface is transformed into a “rail”, where the scallop height and the strip width constraints are transformed into the constraint of the disk-rail contact status. Finally, the optimization process of the toolpath is transformed into the sliding process of the “disk” on the “rail”. By constructing the disk-rail contact constraints, the influence of cutter pose on the scallop height and the strip width can be decoupled, so that the tool-position and tool-orientation paths can be planned flexibly. By planning the “disk-sliding process”, the tool-position and tool-orientation can be optimized simultaneously towards a user-set performance index, without varying the uniform scallop height and the uniform strip width because of the decoupled property. Four groups of machining experiments are conducted to verify the effectiveness and advantages of the proposed method. It can be concluded from the experimental results that the presented method yields the most uniform scallop height and strip width, and the shortest toolpath length, when comparing with typical existing methods.</div></div>","PeriodicalId":54589,"journal":{"name":"Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology","volume":"93 ","pages":"Pages 437-458"},"PeriodicalIF":3.5,"publicationDate":"2025-02-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143373010","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Development of a novel self-locking-at-rest piezoelectric inchworm motor with high switching frequency driving ability","authors":"Sandip Jana ,&nbsp;Sofiane Ghenna ,&nbsp;Saikat Kumar Shome ,&nbsp;Yves Bernard ,&nbsp;Arup Kumar Nandi ,&nbsp;Laurent Daniel","doi":"10.1016/j.precisioneng.2025.01.027","DOIUrl":"10.1016/j.precisioneng.2025.01.027","url":null,"abstract":"<div><div>In this paper, a novel piezoelectric actuator-based inchworm motor and its driving mechanism has been proposed for high speed linear application. Three high voltage positive square pulses with appropriate phase sequence amongst them have been applied to the two clamps and one extender of IM to achieve the desired linear translation. Isolated mosfet-based switching and oscillation circuits have been designed to operate the motor at high switching frequencies by dynamically reducing the capacitive reactance of the piezoelectric stack actuators. Consequently, experiments on the characterization of the piezo-actuators have been performed to identify the pre stress on the motor rail. Geometric model of the system has been developed using finite element analysis to determine displacement distribution in Clamping Mechanism and Extending Mechanism before physically fabricating the motor prototype to verify the driving mechanism. Performance evaluation has been carried out under varying duty cycles, switching frequencies and loads. The motor is observed to achieve a maximum no load speed of 60 mm/s under the 80–90 V positive square pulse at a frequency of 3 kHz with a 20 % duty cycle. A relatively high electrical driver efficiency of 42 % is experimentally achieved which makes the proposed mechatronic system highly suitable for low-size, high torque industrial applications.</div></div>","PeriodicalId":54589,"journal":{"name":"Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology","volume":"93 ","pages":"Pages 481-496"},"PeriodicalIF":3.5,"publicationDate":"2025-02-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143387967","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Design and experimental validation of non-trimming polishing plate for high wear-resistant workpieces based on optimized motion trajectory distribution","authors":"Min Wu ,&nbsp;Yueqin Wu ,&nbsp;Zhiyuan Lai ,&nbsp;Zhiteng Xu ,&nbsp;Hui Huang","doi":"10.1016/j.precisioneng.2025.02.004","DOIUrl":"10.1016/j.precisioneng.2025.02.004","url":null,"abstract":"<div><div>During the polishing of high wear-resistant workpieces, achieving uniform wear on the polishing plate is crucial for enhancing the accuracy of the workpiece and prolonging the service life of the polishing plate. The trajectory of workpiece movement on the polishing plate significantly influences its wear uniformity, especially for workpieces with high hardness and wear-resistance. In this paper, a novel design method for polishing plate tailored for high wear-resistant workpieces was proposed. The structure of the polishing plate was designed to enhance the uniformity of wear, thereby improving the surface accuracy of the workpiece. This method involves establishing kinematic models and calculating polishing trajectories. The relationship between trajectory and wear was analyzed. Consequently, an equal wear polishing plate (EWPP) was designed and manufactured based on the trajectory analysis. Using SiC as the workpiece, a comparative experiment was conducted with a normal polishing plate (NPP) and the newly designed EWPP to verify the effectiveness of the design method. The reasons for the wear of polishing plate and the formation of shape errors in workpieces were discussed. The results demonstrate that wear of polishing plate critically affects the workpiece accuracy, while the shape error of workpiece is effectively suppressed by using EWPP. This innovation improves the machining efficiency of wafer and extends the lifespan of polishing plate, offering a novel approach to improve the processing efficiency and shape accuracy of high wear-resistant workpieces.</div></div>","PeriodicalId":54589,"journal":{"name":"Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology","volume":"93 ","pages":"Pages 551-558"},"PeriodicalIF":3.5,"publicationDate":"2025-02-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143421348","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Boundary-tailored flow and electric fields in electrochemical milling: Experimental and numerical simulation","authors":"Wang Qingqing,&nbsp;Chen Jiajie,&nbsp;Qu Ningsong","doi":"10.1016/j.precisioneng.2025.02.002","DOIUrl":"10.1016/j.precisioneng.2025.02.002","url":null,"abstract":"<div><div>Sinking electrochemical milling refers to a process where the electrode is positioned below the workpiece's surface. The primary advantage of this technique lies in its capacity to eliminate surface irregularities of the blank workpiece, enhance processing depth with a single electrode, and effectively control the reflection and flow of the electrolyte by allowing the tool electrode to sink, thereby improving machining accuracy. To address the issue of electrolyte products accumulating in the processing gap during sinking electrochemical milling, this paper introduces a novel processing method called semi-sinking electrochemical milling. This method combines the advantages of both flying and sinking electrochemical milling. In semi-sinking electrochemical milling, rectangular electrode leading edge performs flying electrochemical milling, while the trailing edge engages in sinking electrochemical milling by cutting into the workpiece. To enhance the effective processing area of the electrode's trailing edge in semi-sinking electrochemical milling, a electrode with an inclined leading edge was designed and validated. Through physical field distribution analysis, the impact of leading edge inclination angle is studied. Results indicate that increasing the leading edge inclination angle mitigates the liquid deficiency phenomenon. A higher inclination angle results in a more uniform flow field, which boosts the leading edge current density. Experimental findings demonstrate that the material removal rate is 169.90 % higher than that of standard sinking electrochemical milling electrode when the electrode is inclined angle to 60°.Additionally, there is a 121.45 % increase in the material removal rate and a 102.97 % increase in processing depth, along with a steeper section profile, compared to the standard cutting electrode with a 60° inclination angle. From a surface morphology perspective, using a electrode with an inclined leading edge reduces stray corrosion on the processed surface and achieves superior surface finish quality.</div></div>","PeriodicalId":54589,"journal":{"name":"Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology","volume":"93 ","pages":"Pages 540-550"},"PeriodicalIF":3.5,"publicationDate":"2025-02-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143420697","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"“Don’t stop me now!”: Stopping rules for iterative reconstruction with dimensional X-ray Computed Tomography","authors":"J.M. Warnett,&nbsp;S.J.P. Harris,&nbsp;E.A. Zwanenburg,&nbsp;M.A. Williams","doi":"10.1016/j.precisioneng.2025.01.019","DOIUrl":"10.1016/j.precisioneng.2025.01.019","url":null,"abstract":"<div><div>X-ray Computed Tomography is regularly exploited in manufacturing, primarily for high-value low-volume cases due to prolonged data acquisition times. For optimal results the Nyquist criterion suggests obtaining 3142 projections for a 2000 pixel width detector reasoning the extended inspection time. Reducing projections enhances speed but the standard FDK reconstruction method suffers a loss in image quality and dimensional accuracy. Iterative reconstruction methods excel with limited data such as fewer projections, offering a promising route forward. However, their application in dimensional measurement has no best practice — particularly when to stop iterating. In this study, a multi-sphere workpiece imaged at <span><math><mrow><mn>100</mn><mspace></mspace><mi>μ</mi><mi>m</mi></mrow></math></span> was reconstructed using SIRT, an iterative reconstruction algorithm, with just 17% (504 projections) of the projection data. The bi-directional measurements of sphere diameters were compared to the FDK reconstruction of the full dataset. In iterative reconstruction, the images improve with each iteration until a point of semi-convergence where it best represents the object, after which unwanted noise from the projections begins to be added. Without a ground truth image the semi-convergence is inferred by semi-convergence of measurement. Here, the difference in the sphere diameter against the FDK measurement is at most 0.0295 voxels (<span><math><mrow><mn>2</mn><mo>.</mo><mn>95</mn><mspace></mspace><mi>μ</mi><mi>m</mi></mrow></math></span>) which is the same magnitude of error as repeated acquisitions with FDK reconstruction of a full dataset. Image metrics are evaluated as a less expensive way to identify the semi-convergence of measurement. In particular anisotropic quality index (AQI) and sharpness are identified candidate rules, as well as highlighting a number of other reasonable stopping rules which were unsuccessful in this scenario. While they cannot identify the precise diameter minima, they are all within 0.008 voxels (0.8 <span><math><mi>μ</mi></math></span>m) of the semi-convergence point. Iterative reconstruction is a promising route forward to decrease inspection times with comparably accurate and repeatable measurements if the decision of when to stop iterating is well justified.</div></div>","PeriodicalId":54589,"journal":{"name":"Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology","volume":"93 ","pages":"Pages 406-416"},"PeriodicalIF":3.5,"publicationDate":"2025-02-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143287292","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Numerical simulation of the effect of scratching parameters and crystal orientation on the surface scratching mechanism of single-crystal γ-TiAl alloy","authors":"Ruicheng Feng ,&nbsp;Hanzong Xu ,&nbsp;Baocheng Zhou ,&nbsp;Tao Chen ,&nbsp;Haiyan Li ,&nbsp;Hui Cao ,&nbsp;Chunli Lei","doi":"10.1016/j.precisioneng.2025.01.020","DOIUrl":"10.1016/j.precisioneng.2025.01.020","url":null,"abstract":"<div><div>The study investigated the effects of different tip radii and scratch depths of diamond conical indenter on the surface nano-scratching mechanism of single-crystal γ-TiAl alloys using Molecular Dynamics (MD) simulations. Effectively combining the scratching parameters with crystal orientation, the variation rules of temperature, mechanical response, atomic flow, subsurface damage, and surface morphology during the scratching process are revealed. The results demonstrate that increasing indenter tip radius and scratch depth lead to higher values of scratch force, temperature, and degree of subsurface damage. Moreover, the average coefficient of friction (COF) and removal rate of atomic wear increase with an increase in the ratio between scratch depth and indenter tip radius (<em>d/r</em>), also known as relative tool sharpness (RTS), a larger RTS facilitates generating more pile-up on both sides. In comparison, a smaller RTS concentrates chips at the indenter's tip. Furthermore, crystal orientation significantly influences the extent to which scratching parameters affect the matrix, specifically, the <span><math><mrow><mrow><mo>(</mo><mn>001</mn><mo>)</mo></mrow><mrow><mo>[</mo><mrow><mover><mn>1</mn><mo>‾</mo></mover><mover><mn>1</mn><mo>‾</mo></mover><mn>0</mn></mrow><mo>]</mo></mrow></mrow></math></span> crystal orientation exhibits higher scratch sensitivity. Finally, the optical morphology of the scratch was obtained by scratch experiment and qualitatively compared with the simulation results. The research results provide valuable insights for the selection of machining parameters of γ-TiAl alloy at nano-scale.</div></div>","PeriodicalId":54589,"journal":{"name":"Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology","volume":"93 ","pages":"Pages 381-396"},"PeriodicalIF":3.5,"publicationDate":"2025-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143287268","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Phosphorescence marking method for liquid level detection and control using computer vision in dark environments","authors":"Seyit Ahmet İnan ,&nbsp;Bekir Aksoy","doi":"10.1016/j.precisioneng.2025.01.025","DOIUrl":"10.1016/j.precisioneng.2025.01.025","url":null,"abstract":"<div><div>The liquid mixture control and level measurement processes were examined in the study using computer images. Liquids of optical characteristics result in low contrast and light reflections in captured camera images. This causes a slowdown in the image's level detection and the processing of mixed images. The method of marking the liquid surface with phosphorescent material in a dark environment was proposed to reduce the light effect on the images. The method's goal is to lessen the noise and light effect in the image that causes measurement errors. A system for experimental measurement and control was set up, comprising liquid tanks, pumps, phosphorus float, camera, and computer. RGB color space, column profile, color moment, filtering, and threshold techniques were used to detected the liquid level from the camera images. When the computer vision results were compared with the real results, the measurement error was calculated as ± 2.595 mm, RMSE = 2.595, and an error rate of 0.66 % for the 400 ml liquid tank. The method simplifies software development procedures for computer, FPGA and microprocessor-based level measurement devices by simplifying intricate image processing algorithms. The computer vision-based phosphorescence marking method can be used in liquid mixture processes for experimental and industrial purposes. It is a liquid level measurement technique that is low cost and easy to apply. Liquids affected by light can employ this method. It has the potential for application in biology, medicine and chemistry laboratories.</div></div>","PeriodicalId":54589,"journal":{"name":"Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology","volume":"93 ","pages":"Pages 397-405"},"PeriodicalIF":3.5,"publicationDate":"2025-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143287269","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Experimental and simulation analysis of surface morphology characteristics through multiple methods of ultrasonic vibration-assisted grinding using a single grain","authors":"Chenwei Dai ,&nbsp;Bin Dai ,&nbsp;Qing Miao ,&nbsp;Zhen Yin ,&nbsp;Jiajia Chen","doi":"10.1016/j.precisioneng.2025.01.023","DOIUrl":"10.1016/j.precisioneng.2025.01.023","url":null,"abstract":"<div><div>The high hardness and brittleness of silicon carbide (SiC) ceramics lead to issues such as low efficiency and severe surface damage during the machining process. Ultrasonic vibration-assisted grinding (UVAG) is an important means to efficiently machining this kind of material, but the surface quality obtained by different vibration modes varies. In order to investigate the scratch morphology characteristics and formation mechanisms by one-dimensional, two-dimensional and three-dimensional UVAG, this article conducted simulation and experimental studies on conventional grinding (CG), axial ultrasonic vibration-assisted grinding (AUVAG), elliptic ultrasonic vibration-assisted grinding (EUVAG) and composite ultrasonic vibration-assisted grinding (CUVAG) of SiC ceramics. The scratch morphology characteristics, the scratch width ratio, the grinding forces and the distribution of residual stress in the four grinding modes were analyzed using a single grain. The results show that the fractures are more pronounced on the scratch sides created by CG and AUVAG, with poor morphology at the scratch bottom. But good morphologies at the scratch bottom in forms of small facets are acquired by EUVAG and CUVAG. The scratch width ratio increases in sequence of CG, AUVAG, EUVAFG and CUVAG, indicating that UAVG can effectively improve the material removal efficiency. Compared to CG, UVAG has a maximum reduction of 67.5 % in grinding force. Meanwhile, as the axial amplitude increases, the grinding forces of AUVAG and CUVAG first decrease and then increase; as the elliptic amplitude increases, the grinding forces of EUVAG and CUVAG slowly increases. In addition, the maximum residual stress of CG, AUVAG, CUVAG and EUVAG is decreased in sequence. EUVAG and CUVAG show lower and more evenly distributed residual stresses at the bottom of the scratch, which indicates that elliptic ultrasonic vibration can significantly improve surface quality and reduce residual stress. EUVAG performs best in improving the surface finish, while CUVAG strikes a good balance between high efficiency and low damage.</div></div>","PeriodicalId":54589,"journal":{"name":"Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology","volume":"93 ","pages":"Pages 355-367"},"PeriodicalIF":3.5,"publicationDate":"2025-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143286922","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Investigation of Fenton-electrochemical oxidation behavior and polishing mechanism of SiC","authors":"Huilong Kang,&nbsp;Min Zhong,&nbsp;Xiaobing Li,&nbsp;Meirong Yi,&nbsp;Jianfeng Chen,&nbsp;Wenhu Xu","doi":"10.1016/j.precisioneng.2025.01.022","DOIUrl":"10.1016/j.precisioneng.2025.01.022","url":null,"abstract":"<div><div>SiC is applied extensively in semiconductor fields because of outstanding characteristics. Nevertheless, its high hardness and chemical inertness hinder the polishing before application. This article introduces the Fenton reaction, ultrasound, and electrochemistry in SiC polishing. The effects of voltage, pH, and downward pressure on ultrasonic-assisted electrochemical mechanical polishing (UAECMP) are investigated through experiments and tests. The optimal polishing parameters have been determined: voltage of 3 V, pH 10, and downward pressure of 8 psi. The MRR of SiC is nearly 4.5 times that of conventional CMP. The polished surface roughness is Ra 0.127 nm. In addition, the polishing mechanism is studied through polarization curves, EIS, XPS, Zeta potential, and abrasive size. A material removal model of SiC UAECMP is put forward. It is helpful to develop new polishing technology of SiC and improve the machining efficiency and quality.</div></div>","PeriodicalId":54589,"journal":{"name":"Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology","volume":"93 ","pages":"Pages 334-343"},"PeriodicalIF":3.5,"publicationDate":"2025-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143369644","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Effects of pad characteristics on surface quality of soft-brittle crystals in water dissolution continuous polishing","authors":"Zhipeng Cheng ,&nbsp;Xuanping Wang ,&nbsp;Hang Gao ,&nbsp;Dongming Guo","doi":"10.1016/j.precisioneng.2025.01.015","DOIUrl":"10.1016/j.precisioneng.2025.01.015","url":null,"abstract":"<div><div>Water dissolution continuous polishing is essential for fabricating large-sized soft-brittle crystals to achieve global planarity and smooth surfaces. The pad, as a core component, directly affects polishing efficiency and quality. In this study, the effects of pad characteristics, including polyurethane, damping, and nonwoven materials on surface quality are extensively examined. Material properties such as surface roughness, asperity distribution, and porosity are studied to achieve high-quality surfaces. Based on the direct contact model between the pad and the workpiece, three pad surface shapes are proposed to optimize pad performance. Through a combination of trajectory uniformity simulation and experimental verification, the influence of the pad surface shape on the workpiece surface quality is systematically analyzed. The results demonstrate that the pad characteristic is a critical determinant of polishing quality. The polyurethane pads with convexity surfaces perform well in water dissolution continuous polishing due to their high hardness and low compressibility. A 200 mm × 200 mm × 10 mm KDP crystal with a surface roughness of 1.694 nm and PV of 0.153 λ is successfully obtained, significantly improving surface control efficiency and accuracy.</div></div>","PeriodicalId":54589,"journal":{"name":"Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology","volume":"93 ","pages":"Pages 368-380"},"PeriodicalIF":3.5,"publicationDate":"2025-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143287271","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}