Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)最新文献_第2页

Stakeholder Dialogues on recycling engineering thermoplastics: a collaborative effort to build a recycling infrastructure for plastics from electronics 利益相关者关于回收工程热塑性塑料的对话:共同努力建立电子塑料的回收基础设施

Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190) Pub Date : 2001-05-07 DOI: 10.1109/ISEE.2001.924504

P. Dillon

{"title":"Stakeholder Dialogues on recycling engineering thermoplastics: a collaborative effort to build a recycling infrastructure for plastics from electronics","authors":"P. Dillon","doi":"10.1109/ISEE.2001.924504","DOIUrl":"https://doi.org/10.1109/ISEE.2001.924504","url":null,"abstract":"The Gordon Institute at Tufts University initiated a series of Stakeholder Dialogues on Recycling Engineering Thermoplastics from Used Electronic Equipment in May 1999. The Stakeholder Dialogues bring together the plastics supply chain to develop collaborative industry strategies to advance recycling of plastic resins from used electronic equipment. The Stakeholder Dialogue process has identified major challenges to the successful and sustained recycling of engineering thermoplastics, including cost-effective collection and processing of resins and the development of adequate markets, particularly for mixed resins. Several Task Forces have been established to develop strategies for overcoming these challenges, utilizing the collective expertise of this unique multistakeholder process. This paper discusses the activities of the Task Forces, including the development of a \"scrap\" classification system for reclaimed engineering resins and a model for comparing alternative scenarios for processing resins from electronic products.","PeriodicalId":448468,"journal":{"name":"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127829794","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

Product ecology at Intel 英特尔的产品生态

Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190) Pub Date : 2001-05-07 DOI: 10.1109/ISEE.2001.924526

T. Brady, N.L. Sumrall, V. Gupta, A. M. Frishman

引用次数: 3

Product recovery using a disassembly line: challenges and solution 使用拆解线回收产品:挑战和解决方案

Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190) Pub Date : 2001-05-07 DOI: 10.1109/ISEE.2001.924499

S.M. Gupta, Abdulmecit Gungor

引用次数: 24

The development of lead-free printed circuit assembly technology in Hewlett-Packard: our strategy and experience 惠普公司无铅印刷电路组装技术的发展:我们的策略和经验

Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190) Pub Date : 2001-05-07 DOI: 10.1109/ISEE.2001.924543

G. Henshall, L.W. Lindsley

引用次数: 2

Environmental impact of a telecommunication service 电信服务对环境的影响

Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190) Pub Date : 2001-05-07 DOI: 10.1109/ISEE.2001.924539

F. Taiariol, P. Fea, C. Papuzza, A. Ramella

{"title":"Environmental impact of a telecommunication service","authors":"F. Taiariol, P. Fea, C. Papuzza, A. Ramella","doi":"10.1109/ISEE.2001.924539","DOIUrl":"https://doi.org/10.1109/ISEE.2001.924539","url":null,"abstract":"The aim of this study is to apply the life cycle assessment (LCA) methodology to a telecommunication (TLC) service. The automatic answering and messages storage service for the fixed network has been chosen as a case study because of its large utilization. Two different systems, providing the same service to the users, have been studied. The environmental impact of the \"centralized answering machine\" system and the \"home answering machine\" have been evaluated and compared. The environmental impacts of the answering and message storing service are mainly generated in the production of the apparatus supplying the service and their use phases. In the use of LCA methodology application to this service, several problems, like the functional unit and the boundary cuts, have to be solved. A TLC system is a multi-services provider, the allocation of the energy, materials and waste to one specific service have to be properly managed. The detailed study of components and material balance was done to perform the LCA. The inventory data was obtained from: a commercial database (where available), specialized literature and data sheet and direct experimental data. The study allows quantification of the decrease in the environmental impact for the centralized solution in order of magnitude. It is also shown that after very few years the usage phase of the service become more important in the environmental impact than the production phase.","PeriodicalId":448468,"journal":{"name":"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)","volume":"835 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133800839","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Reliability of lead free solder joint by using chip size package 采用芯片尺寸封装的无铅焊点可靠性

Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190) Pub Date : 2001-05-07 DOI: 10.1109/ISEE.2001.924541

T. Hirano, K. Fukuda, K. Ito, T. Kiga, Y. Taniguchi

{"title":"Reliability of lead free solder joint by using chip size package","authors":"T. Hirano, K. Fukuda, K. Ito, T. Kiga, Y. Taniguchi","doi":"10.1109/ISEE.2001.924541","DOIUrl":"https://doi.org/10.1109/ISEE.2001.924541","url":null,"abstract":"In the past few years, many studies have been reported on reliability of lead-free solder joint. Almost all of them have described evaluation of solder alloy composition of printed wiring board surface-finish. What seems to be lacking, however, is the influence of component placing condition to reliability and reliability under several stress conditions. The purpose of this work is to investigate the influence of the factor on reliability of the solder joint. We used chip size package as a test piece, which is a more popular semiconductor package, and thermal fatigue test and mechanical fatigue test were carried out. We choose experimental conditions as follow, solder materials (Sn-Ag-Cu, Sn-Ag-Cu-Bi, Sn-Zn-Bi, Sn-Pb), chip size package placing condition (on one side, on both sides), printed wiring board surface finish (organic solderability protector on Cu, Au plating). We got the result that chip size package placing condition, printed wiring board surface finish had more effect on reliability of the lead-free solder joint than solder materials. It is clear that placing condition and printed wiring board surface-finish greatly affects reliability of thermal fatigue and mechanical fatigue, respectively. In conclusion, the influence of the factor on reliability of lead-free solder joint was investigated from several points of view. The work helps us to clarify the influence of the factor on reliability of lead-free solder joint and lead to the guidelines for introduction of lead-free solder.","PeriodicalId":448468,"journal":{"name":"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132295311","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 12

A web-enabled virtual disassembly manager (webVDM) for electronic products 电子产品的网络虚拟拆卸管理器(webVDM)

Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190) Pub Date : 2001-05-07 DOI: 10.1109/ISEE.2001.924534

P. Ranky, R. Caudill, S.K. Das, A. Bhatia, S. ChamyVelumani

{"title":"A web-enabled virtual disassembly manager (webVDM) for electronic products","authors":"P. Ranky, R. Caudill, S.K. Das, A. Bhatia, S. ChamyVelumani","doi":"10.1109/ISEE.2001.924534","DOIUrl":"https://doi.org/10.1109/ISEE.2001.924534","url":null,"abstract":"The purpose of this research is to create object oriented, validated modeling methods and software tools, as well as a system architecture that enables enterprises to analyze and design all critical aspects of their demanufacturing processes over the web, manage their disassembly lines and provide electronic support systems for operators. The generic methodology developed focuses on all critical objects in the above listed disciplines, including their process parameters and their interactions with the relevant networked (web) databases. Furthermore, it integrates various process inputs, acting at different priorities from several different sources, including the web, constraints under which the processes must fire, and resources, that the processes must use in order to be able to produce outputs that represent value. Our method follows an open systems architecture that enables \"third party\" processes to be integrated into, and/or to interact with. By following internationally accepted total quality and environmental standards, important rules learned can be fed back to the product/process design team, as well as to all support systems and personnel, most importantly to the multi-life cycle engineering design, manufacturing/assembly planning and quality teams.","PeriodicalId":448468,"journal":{"name":"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122125153","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Cathode ray tube manufacturing and recycling: analysis of industry survey 阴极射线管制造与回收:行业调查分析

Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190) Pub Date : 2001-05-07 DOI: 10.1109/ISEE.2001.924500

A. Monchamp, H. Evans, J. Nardone, S. Wood, E. Proch, T. Wagner

{"title":"Cathode ray tube manufacturing and recycling: analysis of industry survey","authors":"A. Monchamp, H. Evans, J. Nardone, S. Wood, E. Proch, T. Wagner","doi":"10.1109/ISEE.2001.924500","DOIUrl":"https://doi.org/10.1109/ISEE.2001.924500","url":null,"abstract":"Recycling end-of-life electronics is an important and growing issue facing the electronics industry. Public awareness of the issue is rising, largely because it continues to draw significant media attention and is the subject of increased local, state, federal and international regulation. These developments pose new challenges for the electronics industry and require company, as well as industry-wide, responses. At the same time, these developments provide an opportunity for the industry to inform law makers and the public about the electronics industry's accomplishments and efforts to address issues related to the management of end-of-life electronics. This paper summarizes the findings of a survey conducted by the Electronic Industries Alliance (EIA) that evaluated the current volume of manufacturing and recycling of cathode ray tube (CRT) glass by the United States (US) CRT glass manufacturers. The purpose of this paper is to evaluate the survey findings and determine if the CRT glass manufacturing industry has the capacity to absorb an increased volume of recycled glass that may result from efforts at the federal and state level to increase collection of CRTs.","PeriodicalId":448468,"journal":{"name":"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)","volume":"2017 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126009876","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 30

An IBM methodology for evaluating emerging requirements 用于评估新出现的需求的IBM方法

Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190) Pub Date : 2001-05-07 DOI: 10.1109/ISEE.2001.924503

A. Brinkley, M. Christie, M. Jacques, J. R. Kirby, T. Mann

引用次数: 0

Energy consumption of cellular telephones 移动电话的能耗

Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190) Pub Date : 2001-05-07 DOI: 10.1109/ISEE.2001.924515

I. Nicolaescu, W. Hoffman

引用次数: 6