The development of lead-free printed circuit assembly technology in Hewlett-Packard: our strategy and experience

Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190) Pub Date : 2001-05-07 DOI:10.1109/ISEE.2001.924543

G. Henshall, L.W. Lindsley

引用次数: 2

Abstract

In this paper, we first describe the technical feasibility of candidate lead-free printed circuit assemblies (PCA) solutions. This discussion focuses on the two major classes of lead-free solders: high temperature, with alloy melting temperatures above that of conventional 63Sn-37Pb, and low temperature, with alloy melting temperatures below that of 63Sn-37Pb. Next, we review HP's goals for producing lead-free products and strategies for meeting these goals. We then present the current status of our investigations, and finally our key technical and business learnings and recommendations.

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惠普公司无铅印刷电路组装技术的发展:我们的策略和经验

在本文中，我们首先描述了候选无铅印刷电路组件(PCA)解决方案的技术可行性。本文主要讨论两大类无铅焊料:高温(合金熔化温度高于常规63Sn-37Pb)和低温(合金熔化温度低于63Sn-37Pb)。接下来，我们回顾惠普生产无铅产品的目标和实现这些目标的策略。然后，我们介绍了我们调查的现状，最后是我们的关键技术和业务学习和建议。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)

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