{"title":"惠普公司无铅印刷电路组装技术的发展:我们的策略和经验","authors":"G. Henshall, L.W. Lindsley","doi":"10.1109/ISEE.2001.924543","DOIUrl":null,"url":null,"abstract":"In this paper, we first describe the technical feasibility of candidate lead-free printed circuit assemblies (PCA) solutions. This discussion focuses on the two major classes of lead-free solders: high temperature, with alloy melting temperatures above that of conventional 63Sn-37Pb, and low temperature, with alloy melting temperatures below that of 63Sn-37Pb. Next, we review HP's goals for producing lead-free products and strategies for meeting these goals. We then present the current status of our investigations, and finally our key technical and business learnings and recommendations.","PeriodicalId":448468,"journal":{"name":"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"The development of lead-free printed circuit assembly technology in Hewlett-Packard: our strategy and experience\",\"authors\":\"G. Henshall, L.W. Lindsley\",\"doi\":\"10.1109/ISEE.2001.924543\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we first describe the technical feasibility of candidate lead-free printed circuit assemblies (PCA) solutions. This discussion focuses on the two major classes of lead-free solders: high temperature, with alloy melting temperatures above that of conventional 63Sn-37Pb, and low temperature, with alloy melting temperatures below that of 63Sn-37Pb. Next, we review HP's goals for producing lead-free products and strategies for meeting these goals. We then present the current status of our investigations, and finally our key technical and business learnings and recommendations.\",\"PeriodicalId\":448468,\"journal\":{\"name\":\"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)\",\"volume\":\"35 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-05-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISEE.2001.924543\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEE.2001.924543","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The development of lead-free printed circuit assembly technology in Hewlett-Packard: our strategy and experience
In this paper, we first describe the technical feasibility of candidate lead-free printed circuit assemblies (PCA) solutions. This discussion focuses on the two major classes of lead-free solders: high temperature, with alloy melting temperatures above that of conventional 63Sn-37Pb, and low temperature, with alloy melting temperatures below that of 63Sn-37Pb. Next, we review HP's goals for producing lead-free products and strategies for meeting these goals. We then present the current status of our investigations, and finally our key technical and business learnings and recommendations.
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