Stakeholder Dialogues on recycling engineering thermoplastics: a collaborative effort to build a recycling infrastructure for plastics from electronics

Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190) Pub Date : 2001-05-07 DOI:10.1109/ISEE.2001.924504

P. Dillon

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引用次数: 7

Abstract

The Gordon Institute at Tufts University initiated a series of Stakeholder Dialogues on Recycling Engineering Thermoplastics from Used Electronic Equipment in May 1999. The Stakeholder Dialogues bring together the plastics supply chain to develop collaborative industry strategies to advance recycling of plastic resins from used electronic equipment. The Stakeholder Dialogue process has identified major challenges to the successful and sustained recycling of engineering thermoplastics, including cost-effective collection and processing of resins and the development of adequate markets, particularly for mixed resins. Several Task Forces have been established to develop strategies for overcoming these challenges, utilizing the collective expertise of this unique multistakeholder process. This paper discusses the activities of the Task Forces, including the development of a "scrap" classification system for reclaimed engineering resins and a model for comparing alternative scenarios for processing resins from electronic products.

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利益相关者关于回收工程热塑性塑料的对话:共同努力建立电子塑料的回收基础设施

1999年5月，塔夫茨大学戈登研究所发起了一系列关于从废旧电子设备中回收工程热塑性塑料的利益相关者对话。利益相关者对话将塑料供应链聚集在一起，制定协作行业战略，以推进废旧电子设备中塑料树脂的回收利用。利益相关者对话过程已经确定了成功和持续回收工程热塑性塑料的主要挑战，包括具有成本效益的树脂收集和加工以及开发适当的市场，特别是混合树脂。已经成立了几个工作队，利用这一独特的多利益攸关方进程的集体专门知识，制定克服这些挑战的战略。本文讨论了工作组的活动，包括开发回收工程树脂的“废料”分类系统和比较电子产品加工树脂的替代方案的模型。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)

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