JEDEC (formerly the GaAs REL Workshop) ROCS Workshop, 2004.最新文献

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A new method to measure temperature- and power-dependent thermal resistance of HBTs 一种测量高温超导体温度和功率相关热阻的新方法
JEDEC (formerly the GaAs REL Workshop) ROCS Workshop, 2004. Pub Date : 1900-01-01 DOI: 10.1109/ROCS.2004.184343
R. Menozzi, J. Barrett, P. Ersland
{"title":"A new method to measure temperature- and power-dependent thermal resistance of HBTs","authors":"R. Menozzi, J. Barrett, P. Ersland","doi":"10.1109/ROCS.2004.184343","DOIUrl":"https://doi.org/10.1109/ROCS.2004.184343","url":null,"abstract":"This paper introduced a new DC technique for the measurement of the thermal resistance of HBTs. The method is very simple, because it requires only standard I/sub C/-V/sub CE/ measurements at different baseplate temperatures, and it is able to account for the dependence of the thermal resistance on both the base-plate temperature and the dissipated power. We have obtained and shown consistent results extracted from devices with emitter area ranging from 90 /spl mu/m/sup 2/ (1 finger) to 1080 /spl mu/m/sup 2/ (12 fingers).","PeriodicalId":437858,"journal":{"name":"JEDEC (formerly the GaAs REL Workshop) ROCS Workshop, 2004.","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134369644","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Reliability characterization of MOVPE grown n-GaInP/p-GaAs heterojunctions vis-a-vis high temperature operation through photoreflectance spectroscopy, transmission electron microscopy and deep level transient spectroscopy 通过光反射光谱、透射电子显微镜和深能级瞬态光谱表征MOVPE生长n-GaInP/p-GaAs异质结相对于高温操作的可靠性
JEDEC (formerly the GaAs REL Workshop) ROCS Workshop, 2004. Pub Date : 1900-01-01 DOI: 10.1109/ROCS.2004.184340
S. Madra
{"title":"Reliability characterization of MOVPE grown n-GaInP/p-GaAs heterojunctions vis-a-vis high temperature operation through photoreflectance spectroscopy, transmission electron microscopy and deep level transient spectroscopy","authors":"S. Madra","doi":"10.1109/ROCS.2004.184340","DOIUrl":"https://doi.org/10.1109/ROCS.2004.184340","url":null,"abstract":"The paper presents a detailed characterization of the lattice-matched n-GaInP/p-GaAs heterostructures, including the evolution of the heterojunction and its departure from the initial state under elevated temperatures and current stress. GaInP/GaAs heterojunctions, which constitute the emitter-base junction for contemporary HBTs, were generated using MOVPE. Photoreflectance spectroscopy (PR) has been used to determine the GaInP ordering and bandgap energy, while cross-section TEM has been used to determine the GaInP/GaAs interface region for evidence of defects. p-n tunnel diode samples were generated and characterized to determine the rate of carbon diffusivity under temperature and current induced effects, to provide quantitative measurement of degradation of HBT base layer as seen from carbon precipitate-type artifacts from XTEM analysis. Moreover, n-GaInP/p/sup +/-GaAs diodes were generated for deep-level transient spectroscopy (DLTS) to gain information on traps and trap kinetics from current-stress. The data from the various characterization techniques is utilized to provide the degradation mechanisms for n-GaInP/p-GaAs HBTs. While no evidence of dislocations at the GaInP/GaAs interface was found in our samples, a model for determination of the relaxation time for dislocation scattering is also presented.","PeriodicalId":437858,"journal":{"name":"JEDEC (formerly the GaAs REL Workshop) ROCS Workshop, 2004.","volume":"147 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134120955","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Acceleration parameters and reliability of SiGe HBTs during long-term forward-biased operation SiGe HBTs长期正偏运行时加速度参数及可靠性研究
JEDEC (formerly the GaAs REL Workshop) ROCS Workshop, 2004. Pub Date : 1900-01-01 DOI: 10.1109/ROCS.2004.184344
P. Rosenthal, B. Paine, N. T. Kubota, D. Sunderland
{"title":"Acceleration parameters and reliability of SiGe HBTs during long-term forward-biased operation","authors":"P. Rosenthal, B. Paine, N. T. Kubota, D. Sunderland","doi":"10.1109/ROCS.2004.184344","DOIUrl":"https://doi.org/10.1109/ROCS.2004.184344","url":null,"abstract":"We have conducted accelerated lifetesting on discrete HBTs fabricated with the IBM SiGe5HP HBT technology, and determined the dependence of the wear-out on emitter interconnect temperature and current density. The wearout occurred by degradation of DC current gain, /spl beta/, caused by increase of the base current. The characteristics and the parametric dependences of the /spl beta/ degradation were consistent with an electromigration (EM) mechanism originally developed by IBM. EM in the emitter interconnects causes compressive stress on the emitter semiconductor sufficient to alter the semiconductor energy band structure, leading to an increase in base current and associated reduction in /spl beta/. Utilizing our empirically determined acceleration parameters, we have estimated the worst-case expected changes in /spl beta/ during typical use conditions (125 /spl deg/C, J/sub i/=1.0 mA//spl mu/m/sup 2/). The results showed that after 20 years /spl beta/ would degrade by approximately 17/spl plusmn/1%. This degradation is insignificant for most IC applications, and we therefore conclude that this technology is highly reliable during long-term forward-active bias operation.","PeriodicalId":437858,"journal":{"name":"JEDEC (formerly the GaAs REL Workshop) ROCS Workshop, 2004.","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126484450","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
The impact of emitter fingers layout and geometry on InGaP HBT thermal resistance 射极指形布局和几何形状对InGaP高温热阻的影响
JEDEC (formerly the GaAs REL Workshop) ROCS Workshop, 2004. Pub Date : 1900-01-01 DOI: 10.1109/ROCS.2004.184342
E. Yu, D. Hill, L. Zhang, O. Hartin
{"title":"The impact of emitter fingers layout and geometry on InGaP HBT thermal resistance","authors":"E. Yu, D. Hill, L. Zhang, O. Hartin","doi":"10.1109/ROCS.2004.184342","DOIUrl":"https://doi.org/10.1109/ROCS.2004.184342","url":null,"abstract":"As InGaP heterojunction bipolar transistors are becoming widely used for wireless handset power amplifier applications, it is not only in the best interests of device and circuit reliability, but also for devices performance, to optimize thermal management through proper device design. In this work, we report a thermal analysis on multi emitter-finger HBT devices with various emitter finger geometry and layout options. Three techniques, including direct electrical measurement and extraction, high resolution (/spl sim/3 /spl mu/m) infared (IR) thermal imaging, as well as thermal simulation (ANSYS), were employed in the study.","PeriodicalId":437858,"journal":{"name":"JEDEC (formerly the GaAs REL Workshop) ROCS Workshop, 2004.","volume":"71 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132483068","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Reliability of GaAs PIN switches for high frequency and high power applications 用于高频和高功率应用的GaAs PIN开关的可靠性
JEDEC (formerly the GaAs REL Workshop) ROCS Workshop, 2004. Pub Date : 1900-01-01 DOI: 10.1109/ROCS.2004.184354
Xinxing Yang, P. Ersland, D. Hoag
{"title":"Reliability of GaAs PIN switches for high frequency and high power applications","authors":"Xinxing Yang, P. Ersland, D. Hoag","doi":"10.1109/ROCS.2004.184354","DOIUrl":"https://doi.org/10.1109/ROCS.2004.184354","url":null,"abstract":"M/A-COM's monolithic GaAs PIN diode integrated circuit process has been used in high frequency switching applications for many years. A recent application of this process identified a unique failure mode related to operation at high RF power and low frequency. Under these high power conditions, switch insertion loss was seen to increase, particularly at lower frequencies (below 10 GHz). In an effort to better understand this failure mode, a series of reliability experiments were performed. Subsequent changes to this process were also subjected to process reliability tests.","PeriodicalId":437858,"journal":{"name":"JEDEC (formerly the GaAs REL Workshop) ROCS Workshop, 2004.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130202785","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Minimizing gate lag of a planar high-power GaAs MESFET by Al/sub 2/O/sub 3/ passivation and optimized gate process Al/sub 2/O/sub 3/钝化及优化栅极工艺最小化平面大功率GaAs MESFET栅极滞后
JEDEC (formerly the GaAs REL Workshop) ROCS Workshop, 2004. Pub Date : 1900-01-01 DOI: 10.1109/ROCS.2004.184347
B. Yang, P. Ye, K. Ng, J. Bude, G. Wilk
{"title":"Minimizing gate lag of a planar high-power GaAs MESFET by Al/sub 2/O/sub 3/ passivation and optimized gate process","authors":"B. Yang, P. Ye, K. Ng, J. Bude, G. Wilk","doi":"10.1109/ROCS.2004.184347","DOIUrl":"https://doi.org/10.1109/ROCS.2004.184347","url":null,"abstract":"This study demonstrates that using ALD grown Al/sub 2/O/sub 3/ as a surface passivation layer, and by controlling the Al/sub 2/O/sub 3/ over-etch time, the gate lag of a planar high power GaAs MESFET can be controlled to an undetectable level. In addition, more than 30 V higher Vbkd was achieved when the Al/sub 2/O/sub 3/ surface passivation layer was employed. These results indicate that the above reported GaAs MESFET device is very promising for wireless base station high-power amplifier applications.","PeriodicalId":437858,"journal":{"name":"JEDEC (formerly the GaAs REL Workshop) ROCS Workshop, 2004.","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121137654","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Studying yield and reliability relationships for metal defects 研究金属缺陷的良率和可靠性关系
JEDEC (formerly the GaAs REL Workshop) ROCS Workshop, 2004. Pub Date : 1900-01-01 DOI: 10.1109/ROCS.2004.184353
W. Roesch, D. Hamada
{"title":"Studying yield and reliability relationships for metal defects","authors":"W. Roesch, D. Hamada","doi":"10.1109/ROCS.2004.184353","DOIUrl":"https://doi.org/10.1109/ROCS.2004.184353","url":null,"abstract":"This paper investigates the reliability of GaAs circuits with an emphasis on liftoff metal shorting. There are several key results of this work: (1) we have continued the historical discussion of relationships between defects, yield, and reliability; (2) we have proposed the applicability of these quality and reliability aspects to metal defects; (3) we have introduced the dimension of physical space between metal as an amplifier of defect detection; (4) we have combined the physical amplification with voltage acceleration to measure defects; (5) we have used the defect data to demonstrate relationships between yield and reliability for structures of applicable sizes; (6) we have proposed a correlation between metal shorting defects and extrinsic capacitors. These results have unveiled the ability to measure defects and apply improvement techniques that have been established for other structures - such as capacitors. This opens opportunities for measuring, monitoring and screening in ways not previously discussed for compound semiconductor devices.","PeriodicalId":437858,"journal":{"name":"JEDEC (formerly the GaAs REL Workshop) ROCS Workshop, 2004.","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129293890","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
The effect of elevated temperature lifetest on low frequency noise performance in GaAs PHEMT dual gate MMICs [LNA example] 高温寿命试验对GaAs PHEMT双栅mmic低频噪声性能的影响[LNA示例]
JEDEC (formerly the GaAs REL Workshop) ROCS Workshop, 2004. Pub Date : 1900-01-01 DOI: 10.1109/ROCS.2004.184348
Y. Chou, L. Callejo, M. Biedenbander, K. Lee, B. Allen, R. Lai, Q. Kan, R. Grundbacher, D. Leung, D. Eng, T. Block, A. Oki
{"title":"The effect of elevated temperature lifetest on low frequency noise performance in GaAs PHEMT dual gate MMICs [LNA example]","authors":"Y. Chou, L. Callejo, M. Biedenbander, K. Lee, B. Allen, R. Lai, Q. Kan, R. Grundbacher, D. Leung, D. Eng, T. Block, A. Oki","doi":"10.1109/ROCS.2004.184348","DOIUrl":"https://doi.org/10.1109/ROCS.2004.184348","url":null,"abstract":"The dual gate layout configuration has become a versatile approach for compact and high performance MMIC design for commercial, and military/space applications. In this paper, we describe a method that was developed to lifetest compact (0.81 mm/sup 2/) dual gate GaAs PHEMT low noise amplifiers (LNAs) operating from DC to 1 GHz. The objective of the lifetest is to evaluate the effect of elevated temperature on low frequency noise performance from 10-40 MHz. The results exhibit a decrease of noise figure (NF) at 10-40 MHz (approximately 0.25 to 0.5 dB) in a dual gate LNA subjected to lifetest at T/sub ambient/ of 200/spl deg/C. This might be attributed to the gate leakage current reduction at either the interface of gate metal-AlGaAs or nitride-AlGaAs, thus possibly reducing the effect of generation-recombination (primary origin of low frequency noise). On the other hand, the change of noise figure at frequencies beyond 100 MHz is not noticeable. In summary, we have demonstrated a method to effectively lifetest a compact and high performance MMIC designed with a dual gate configuration.","PeriodicalId":437858,"journal":{"name":"JEDEC (formerly the GaAs REL Workshop) ROCS Workshop, 2004.","volume":"78 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128596724","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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