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Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces最新文献

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Adaptive Patterning and M‐Series for High Density Integration 高密度积分的自适应模式和M系列
Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces Pub Date : 2021-12-03 DOI: 10.1002/9781119793908.ch5
Benedict A. San Jose, Cliff Sandstrom, J. Kellar, Craig W. Bishop, T. Olson
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引用次数: 4
Fan‐Out Wafer and Panel Level Packaging Market and Technology Trends 扇出晶圆和面板级封装市场和技术趋势
Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces Pub Date : 2021-12-03 DOI: 10.1002/9781119793908.ch1
Santosh Kumar, F. Shoo, Stéphane Elisabeth
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引用次数: 1
Flexible Hybrid Electronics Using Fan‐Out Wafer‐Level Packaging 采用扇出晶圆级封装的柔性混合电子器件
Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces Pub Date : 2021-12-03 DOI: 10.1002/9781119793908.ch10
S. S. Iyer, A. Alam
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引用次数: 0
Polylithic Integrated Circuits using 2.5D and 3D Heterogeneous Integration: Electrical and Thermal Design Considerations and Demonstrations 使用2.5D和3D异构集成的多片集成电路:电气和热设计考虑和演示
Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces Pub Date : 2021-12-03 DOI: 10.1002/9781119793908.ch11
Ting Zheng, Ankit Kaul, Sreejith Kochupurackal Rajan, M. Bakir
{"title":"Polylithic Integrated Circuits using 2.5D and 3D Heterogeneous Integration: Electrical and Thermal Design Considerations and Demonstrations","authors":"Ting Zheng, Ankit Kaul, Sreejith Kochupurackal Rajan, M. Bakir","doi":"10.1002/9781119793908.ch11","DOIUrl":"https://doi.org/10.1002/9781119793908.ch11","url":null,"abstract":"","PeriodicalId":402683,"journal":{"name":"Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121608882","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Die Integration Technologies on Advanced Substrates Including Embedding and Cavities 先进基板上的模具集成技术，包括嵌入和空腔
Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces Pub Date : 2021-12-03 DOI: 10.1002/9781119793908.ch8
M. Leitgeb, Christian Vockenberger
{"title":"Die Integration Technologies on Advanced Substrates Including Embedding and Cavities","authors":"M. Leitgeb, Christian Vockenberger","doi":"10.1002/9781119793908.ch8","DOIUrl":"https://doi.org/10.1002/9781119793908.ch8","url":null,"abstract":"","PeriodicalId":402683,"journal":{"name":"Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces","volume":"105 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117183961","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Integrated Fan‐Out ( InFO ) for Mobile Computing 用于移动计算的集成扇出(InFO)
Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces Pub Date : 2021-12-03 DOI: 10.1002/9781119793908.ch3
Doug C. H. Yu, John Yeh, K. Yee, C. Tung
{"title":"Integrated\u0000 Fan‐Out\u0000 (\u0000 InFO\u0000 ) for Mobile Computing","authors":"Doug C. H. Yu, John Yeh, K. Yee, C. Tung","doi":"10.1002/9781119793908.ch3","DOIUrl":"https://doi.org/10.1002/9781119793908.ch3","url":null,"abstract":"","PeriodicalId":402683,"journal":{"name":"Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces","volume":"125 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124200805","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Integrated Fan‐Out (InFO) for High Performance Computing 集成风扇输出(InFO)用于高性能计算
Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces Pub Date : 2021-12-03 DOI: 10.1002/9781119793908.ch4
Doug C. H. Yu, John Yeh, K. Yee, C. Tung
{"title":"Integrated Fan‐Out (InFO) for High Performance Computing","authors":"Doug C. H. Yu, John Yeh, K. Yee, C. Tung","doi":"10.1002/9781119793908.ch4","DOIUrl":"https://doi.org/10.1002/9781119793908.ch4","url":null,"abstract":"","PeriodicalId":402683,"journal":{"name":"Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121858148","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Index 指数
Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces Pub Date : 2021-12-03 DOI: 10.1002/9781119793908.index
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引用次数: 0
Advanced Embedded Trace Substrate – A Flexible Alternative to Fan‐Out Wafer Level Packaging 先进的嵌入式痕迹基板-扇形晶圆级封装的灵活替代方案
Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces Pub Date : 2021-12-03 DOI: 10.1002/9781119793908.ch9
Shi-Ping Hsu, Byron Hsu, Adan Chou
{"title":"Advanced Embedded Trace Substrate – A Flexible Alternative to\u0000 Fan‐Out\u0000 Wafer Level Packaging","authors":"Shi-Ping Hsu, Byron Hsu, Adan Chou","doi":"10.1002/9781119793908.ch9","DOIUrl":"https://doi.org/10.1002/9781119793908.ch9","url":null,"abstract":"","PeriodicalId":402683,"journal":{"name":"Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127536129","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Next Generation Chip Embedding Technology for High Efficiency Power Modules and Power SiPs 用于高效率功率模块和功率sip的下一代芯片嵌入技术
Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces Pub Date : 2021-12-03 DOI: 10.1002/9781119793908.ch7
Vikas Gupta, K. Essig, C. Chiu, M. Gerber
{"title":"Next Generation Chip Embedding Technology for High Efficiency Power Modules and Power SiPs","authors":"Vikas Gupta, K. Essig, C. Chiu, M. Gerber","doi":"10.1002/9781119793908.ch7","DOIUrl":"https://doi.org/10.1002/9781119793908.ch7","url":null,"abstract":"","PeriodicalId":402683,"journal":{"name":"Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127001872","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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