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Polylithic Integrated Circuits using 2.5D and 3D Heterogeneous Integration: Electrical and Thermal Design Considerations and Demonstrations

Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces Pub Date : 2021-12-03 DOI:10.1002/9781119793908.ch11
Ting Zheng, Ankit Kaul, Sreejith Kochupurackal Rajan, M. Bakir
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使用2.5D和3D异构集成的多片集成电路:电气和热设计考虑和演示
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Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
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