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Flexible Hybrid Electronics Using Fan‐Out Wafer‐Level Packaging

Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces Pub Date : 2021-12-03 DOI:10.1002/9781119793908.ch10
S. S. Iyer, A. Alam
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采用扇出晶圆级封装的柔性混合电子器件
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Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
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