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Next Generation Chip Embedding Technology for High Efficiency Power Modules and Power SiPs

Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces Pub Date : 2021-12-03 DOI:10.1002/9781119793908.ch7
Vikas Gupta, K. Essig, C. Chiu, M. Gerber
{"title":"Next Generation Chip Embedding Technology for High Efficiency Power Modules and Power SiPs","authors":"Vikas Gupta, K. Essig, C. Chiu, M. Gerber","doi":"10.1002/9781119793908.ch7","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":402683,"journal":{"name":"Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1002/9781119793908.ch7","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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用于高效率功率模块和功率sip的下一代芯片嵌入技术
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Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
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