Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318)最新文献_第8页

Establishment of accelerated corrosion testing conditions 加速腐蚀试验条件的建立

Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318) Pub Date : 2002-08-07 DOI: 10.1109/RAMS.2002.981714

L. Klyatis

引用次数: 9

Two-dimensional reliability modeling from warranty data 基于保修数据的二维可靠性建模

Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318) Pub Date : 2002-08-07 DOI: 10.1109/RAMS.2002.981654

Guangbin Yang, Z. Zaghati

{"title":"Two-dimensional reliability modeling from warranty data","authors":"Guangbin Yang, Z. Zaghati","doi":"10.1109/RAMS.2002.981654","DOIUrl":"https://doi.org/10.1109/RAMS.2002.981654","url":null,"abstract":"The failures of some systems depend on age and amount of accumulated usage. A common example of such systems is the automobile; the life of which is measured by both time in service and mileage. Warranty claims of the systems contain a large amount of information about reliability, such as failure times, usages and failure modes. Using warranty data to model reliability as a function of time and usage provides a more accurate and realistic estimator.This paper describes warranty data structure and censoring mechanism. A sequential regression method is proposed to model mileage accumulation from warranty claim data. The model and mileage failure data are used to evaluate the patterns of failure occurrences at different mileages. The paper then establishes the relationship between reliability and time in service and mileage. The unknown parameters are estimated by maximum likelihood method with time and mileage censoring. The reliability model is used to predict the number of warranty claims, and the number of failed vehicles which do not generate warranty claims due to mileage exceeding warranty limit. In the paper, an example is presented. The example shows that the predicted number of warranty claims has a good agreement with the actual number of claims.","PeriodicalId":395613,"journal":{"name":"Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318)","volume":"31 10","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120976148","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 29

QRAS - the Quantitative Risk Assessment System QRAS -定量风险评估系统

Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318) Pub Date : 2002-08-07 DOI: 10.1109/RAMS.2002.981666

F. Groen, C. Smidts, A. Mosleh

{"title":"QRAS - the Quantitative Risk Assessment System","authors":"F. Groen, C. Smidts, A. Mosleh","doi":"10.1109/RAMS.2002.981666","DOIUrl":"https://doi.org/10.1109/RAMS.2002.981666","url":null,"abstract":"This paper presents an overview of version 1.6 of QRAS, the Quantitative Risk Assessment System. QRAS is a PC-based software tool for conducting probabilistic risk assessments (PRA), which was developed to address needs held by NASA, but can be used in a wide range of industries. The software is different from other PRA tools in three key areas. First, QRAS bridges communication and skill gaps between managers, engineers, and risk analysts by using representations of the risk model and analysis results that are easy to comprehend by each of those groups. For that purpose, event sequence diagrams (ESD) are used as a replacement for event trees (ET) to model scenarios, and the quantification of events is possible through a set of quantification models familiar to engineers. In addition, QRAS' graphical user interface provides a more structured guidance than other tools in order to facilitate its use by nonexpert users. Second, QRAS includes a strong support for modeling approaches not typically found in tools developed for the nuclear industry, such as phased-mission modeling. Finally, QRAS applies leading edge reduced ordered binary decision diagram (ROBDD) technology for the accurate and efficient computation of risk results.","PeriodicalId":395613,"journal":{"name":"Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128479838","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 46

A reliability driven mission for Space Station 空间站的可靠性驱动任务

Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318) Pub Date : 2002-08-07 DOI: 10.1109/RAMS.2002.981707

M. Shooman, P. Sforza

{"title":"A reliability driven mission for Space Station","authors":"M. Shooman, P. Sforza","doi":"10.1109/RAMS.2002.981707","DOIUrl":"https://doi.org/10.1109/RAMS.2002.981707","url":null,"abstract":"The repair of the Hubble Space Telescope has validated the feasibility of repair in space. This paper proposes that the International Space Station be used as a repair base for the many communication, scientific and military satellites, in low Earth orbit, and that the Space Shuttle be used to retrieve such satellites. It is shown that the lifetime of such a satellite is primarily limited by the amount of propellant provided. Other major systems such as batteries and solar panels are designed so that there is a small probability of them failing before the satellite lifetime is reached. The primary components which fail infrequently before the end of design lifetime are the electromechanical components of the attitude control system. The electronics are shown to have a decreasing failure rate and a low probability of failure within the lifetime. It is proposed that the shuttle, (or in the future a space tug), be used to move any repairable satellite at the end of its mission to the Space Station. The cost for operating a satellite for one lifetime plus replenishment of propellant and replacement of electromechanical attitude control components, batteries and solar panels for a second lifetime is considerably less then launch of one satellite and launch of a replacement satellite. The cost per year of operation for replenishment/replacement can in the limit approach one half of the cost per year for the initial orbit boost plus a replacement orbit boost.","PeriodicalId":395613,"journal":{"name":"Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318)","volume":"148 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127512921","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

The use of indirect evidence for Bayesian reliability analysis 使用间接证据进行贝叶斯信度分析

Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318) Pub Date : 2002-08-07 DOI: 10.1109/RAMS.2002.981679

J.C. Lin

{"title":"The use of indirect evidence for Bayesian reliability analysis","authors":"J.C. Lin","doi":"10.1109/RAMS.2002.981679","DOIUrl":"https://doi.org/10.1109/RAMS.2002.981679","url":null,"abstract":"This paper presents an approach that has been used to incorporate indirect evidence in Bayesian reliability analysis for automobile products during the design phase. Since no field performance data is available during the design stage of the product life cycle, reliability prediction has to rely on information that is not completely applicable to the product population of interest or the ultimate customer usage environment. The use of this indirect evidence requires special treatment to compensate for the differences in reliability performance due to differences in the actual design, operating environment, etc. When all available and relevant information is considered and the indirect evidence is subject to Bayesian analysis, a much more realistic estimate of the product reliability performance is provided. This reliability analysis method facilitates not only the exploration and documentation of relevant information but also the development of consensus on the evaluation and application of expert information. In addition, it pen-nits the development of a reliability prediction for a new design before any testing has been done on the new product; this benefits the manufacturer in such areas as resource allocation during the development phase.","PeriodicalId":395613,"journal":{"name":"Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114271849","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 9

Warranty, product spectrum and customer role 保修，产品范围和客户角色

Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318) Pub Date : 2002-08-07 DOI: 10.1109/RAMS.2002.981692

M. Ramaswamy

引用次数: 1

Accelerated tests to simulate metal migration in hybrid circuits 模拟混合电路中金属迁移的加速试验

Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318) Pub Date : 2002-08-07 DOI: 10.1109/RAMS.2002.981661

S. D. Bhakta, D. Ph., Itron, Waseca, Scott Lundberg, Gary Mortensen

{"title":"Accelerated tests to simulate metal migration in hybrid circuits","authors":"S. D. Bhakta, D. Ph., Itron, Waseca, Scott Lundberg, Gary Mortensen","doi":"10.1109/RAMS.2002.981661","DOIUrl":"https://doi.org/10.1109/RAMS.2002.981661","url":null,"abstract":"The dominant form of metal migration (i.e. Ag) in thick films, is composed of electrodissolution, ion transport and electrodeposition steps. Depending on the product type and its operating environment, some of these mechanisms are dominant and could alone be used to essentially model the metal migration in hybrid circuits. In this study, the dominant root cause for Ag migration was accelerated using coupon tests with dilute NaCl, which simulates the effect of contaminants on the board. It was demonstrated that these tests could be used as a rapid screening procedure for the various pastes. The coupon tests were also substantiated with results from the product test in the temperature, humidity, bias (THB) tests, which demonstrated the effect of Pd on Ag migration. Weibull curves obtained from the coupon and THB data demonstrated the product robustness. This was also determined by using the THB data and acceleration factors using field monitoring programs and those published in literature. The coupon and THB data were used to initiate changes in product design and manufacturing, thereby increasing product reliability.","PeriodicalId":395613,"journal":{"name":"Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130254864","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 10

Prioritizing the purchase of spare parts using an approximate reasoning model 用近似推理模型确定备件采购的优先级

Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318) Pub Date : 2002-08-07 DOI: 10.1109/RAMS.2002.981614

S. Eisenhawer, T. Bott, J. W. Jackson

{"title":"Prioritizing the purchase of spare parts using an approximate reasoning model","authors":"S. Eisenhawer, T. Bott, J. W. Jackson","doi":"10.1109/RAMS.2002.981614","DOIUrl":"https://doi.org/10.1109/RAMS.2002.981614","url":null,"abstract":"The complexity of a spare parts prioritization model should be consonant with the amount and quality of data available to populate it. When production processes are new and the reliability database is sparse and represents primarily expert knowledge, an approximate reasoning (AR) based model is appropriate. AR models are designed to emulate the inferential processes used by experts in making judgments. The authors have designed and tested such a model for the planned component production process for nuclear weapons at Los Alamos National Laboratory. The model successfully represents the experts' knowledge concerning the frequency and consequences of a part failure. The use of linguistic variables provides an adaptable format for eliciting this knowledge and a consistent basis for valuing the effect on production of different parts. Ranking the parts for inclusion in a spare parts inventory is a straightforward transformation of the AR output. The basis for this ranking is directly traceable to the elicitation results. AR-based models are well-suited to prioritization problems with these characteristics.","PeriodicalId":395613,"journal":{"name":"Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129943202","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Improving design for reliability with in-service data analysis 通过在役数据分析改进可靠性设计

Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318) Pub Date : 2002-08-07 DOI: 10.1109/RAMS.2002.981677

I. James, J. Marshall, L. Walls

引用次数: 12

Reliability of lead-free solder interconnects-a review 无铅焊料互连的可靠性综述

Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318) Pub Date : 2002-08-07 DOI: 10.1109/RAMS.2002.981678

S. Tonapi, S. Gopakumar, P. Borgesen, K. Srihari

{"title":"Reliability of lead-free solder interconnects-a review","authors":"S. Tonapi, S. Gopakumar, P. Borgesen, K. Srihari","doi":"10.1109/RAMS.2002.981678","DOIUrl":"https://doi.org/10.1109/RAMS.2002.981678","url":null,"abstract":"This paper discusses reliability issues related to lead-free printed circuit board interconnects. A comprehensive review of the published literature was carried out, and complemented further by reliability experiments that have been conducted to understand the behavior of some of the lead-free alternatives. The failure mechanisms for lead-free flip chips during accelerated testing are discussed. Some of the metallurgical effects due to the change in soldering system are also reviewed. In the case of assembly of lead-free flip chips, solder joint properties were still found to depend on the reflow profile (peak temperature and time above the liquidus temperature). The ultimate shear strength of Sn/Ag/Cu (SAC) joints on Ni/Au-coated substrate pads proved very sensitive to small changes in peak temperature and time above liquidus. A similar effect was not observed on Cu/OSP pads. The reflow profile with a lower peak temperature and a lower time above the liquidus temperature gave slightly lower shear strength of joints between two Ni-pads, while the profile with a higher peak temperature and a higher time above the liquidus gave a considerably higher strength. Not surprisingly, the fatigue resistance of both encapsulated and nonencapsulated Sn/Ag/Cu joints was significantly lower on Ni/Au-pads than on Cu/OSP.","PeriodicalId":395613,"journal":{"name":"Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122203790","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8