无铅焊料互连的可靠性综述

S. Tonapi, S. Gopakumar, P. Borgesen, K. Srihari
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引用次数: 8

摘要

本文讨论了与无铅印刷电路板互连有关的可靠性问题。对已发表的文献进行了全面的审查,并进一步进行了可靠性实验,以了解一些无铅替代品的行为。讨论了无铅倒装芯片在加速测试过程中的失效机理。本文还评述了由于焊接系统的改变而引起的一些冶金效应。在组装无铅倒装芯片的情况下,焊点性能仍然取决于回流曲线(峰值温度和高于液相温度的时间)。结果表明,镀镍/镀金衬底上Sn/Ag/Cu (SAC)接头的极限抗剪强度对液相线以上峰值温度和时间的微小变化非常敏感。在Cu/OSP衬垫上没有观察到类似的效果。峰值温度较低、峰值温度高于液相线时间较短的回流曲线使两ni -pad接头的抗剪强度略低,而峰值温度较高、峰值温度高于液相线时间较长的回流曲线使接头的抗剪强度显著提高。不出意外的是,在Ni/ au焊盘上封装和未封装的Sn/Ag/Cu接头的抗疲劳性能明显低于Cu/OSP焊盘。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Reliability of lead-free solder interconnects-a review
This paper discusses reliability issues related to lead-free printed circuit board interconnects. A comprehensive review of the published literature was carried out, and complemented further by reliability experiments that have been conducted to understand the behavior of some of the lead-free alternatives. The failure mechanisms for lead-free flip chips during accelerated testing are discussed. Some of the metallurgical effects due to the change in soldering system are also reviewed. In the case of assembly of lead-free flip chips, solder joint properties were still found to depend on the reflow profile (peak temperature and time above the liquidus temperature). The ultimate shear strength of Sn/Ag/Cu (SAC) joints on Ni/Au-coated substrate pads proved very sensitive to small changes in peak temperature and time above liquidus. A similar effect was not observed on Cu/OSP pads. The reflow profile with a lower peak temperature and a lower time above the liquidus temperature gave slightly lower shear strength of joints between two Ni-pads, while the profile with a higher peak temperature and a higher time above the liquidus gave a considerably higher strength. Not surprisingly, the fatigue resistance of both encapsulated and nonencapsulated Sn/Ag/Cu joints was significantly lower on Ni/Au-pads than on Cu/OSP.
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