F. L. Terry, J. Freudenberg, M. Elta, M. Giles, J. Grizzle, S. Lafortune, P. Kabamba, P. Khargonekar, S. Meerkov, D. Teneketzis
{"title":"Sensor-Based Control for Semiconductor Manufacturing Plasma EtchingAsA ProcessVehicle","authors":"F. L. Terry, J. Freudenberg, M. Elta, M. Giles, J. Grizzle, S. Lafortune, P. Kabamba, P. Khargonekar, S. Meerkov, D. Teneketzis","doi":"10.1109/IWLR.1992.657992","DOIUrl":"https://doi.org/10.1109/IWLR.1992.657992","url":null,"abstract":"","PeriodicalId":395564,"journal":{"name":"International Report on Wafer Level Reliability Workshop","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124394232","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"EEPROM-based Charging-Effects Sensors for Plasma Etching and Ion Implantation","authors":"W. Lutkaszek","doi":"10.1109/IWLR.1992.657991","DOIUrl":"https://doi.org/10.1109/IWLR.1992.657991","url":null,"abstract":"Conventional studies of damage effects associated with plasma-based processes and ion implantation have focused on characterization of the damage inflicted on typical IC structures and devices. Although essential, these studies provide little insight regarding the nature and magnitudes of the driving forces behind the damage, which is essential for the design of more benign wafer processing equipment, process optimization, etc. This talk describes the design, characterization, and application of re-usable, EEPROM-transistor-based, wafer-level, sensors intended to quantify the driving forces behind the damage, and to v unipolar monitors for capturing information about transients of opposite polarities; extended range UV monitors; and structures for characterization of process environment equivalent networks needed for damage modeling. Most of the sensors incorporated on the monitor wafers employ EEPROM transistors, due to their sensitivity to electrostatic and photo-electric effects, and due to their ability to remember critical attributes of these driving forces. Individual sensors are personalized for specific tasks by additional elements attached to the EEPROM transistors, and by suitable pre-conditioning and test techniques. Experimental results from plasma etching and high-current ion implant experiments are presented to illustrate the capabilities of these (CHARM2) monitors.","PeriodicalId":395564,"journal":{"name":"International Report on Wafer Level Reliability Workshop","volume":"64 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131278300","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Consistency Of Similarly Designed Wafer Level Reliability test Structures Produced In Multiple Fabrication Areas","authors":"T. Turner","doi":"10.1109/IWLR.1992.658006","DOIUrl":"https://doi.org/10.1109/IWLR.1992.658006","url":null,"abstract":"","PeriodicalId":395564,"journal":{"name":"International Report on Wafer Level Reliability Workshop","volume":"183 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114806892","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"The Influence Of Preoxidation Cleaning Chemistry And Wafer Substrate On Thin Gate Oxide Defect Density","authors":"B. Triplett, M. Tran, M. Aminzadeh","doi":"10.1109/IWLR.1992.657990","DOIUrl":"https://doi.org/10.1109/IWLR.1992.657990","url":null,"abstract":"","PeriodicalId":395564,"journal":{"name":"International Report on Wafer Level Reliability Workshop","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129717293","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Thin Film Cracking / Delamination Evaluation Using Assembly Test Chip","authors":"C. Hong","doi":"10.1109/IWLR.1992.658000","DOIUrl":"https://doi.org/10.1109/IWLR.1992.658000","url":null,"abstract":"We have utilized an Assembly Test Chip (ATC) to study die and packaging interaction during a new fab process development. This paper shows a case study of using ATC to evaluate 2 plastic-package specific failure mechanisms, Thin Film Cracking (TFC) and Thin Film Delamination (TFD). Special test structures have been designed and shown to be sensitive to TFC and TFD. Failures can be detected electrically by simple continuity test, as opposed to the conventional decap &visual technique. We find that Temperature Cycling induces TFC for large die size and Steam induces TFD for thin film stack. New process options have been developed in order to achieve optimum TFC and TFD performance, using the ATC.","PeriodicalId":395564,"journal":{"name":"International Report on Wafer Level Reliability Workshop","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114584040","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}