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International Report on Wafer Level Reliability Workshop最新文献

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Application of CMOS-Compatible Micro-Hotplates for In-situ Process Monitors cmos兼容微热板在现场过程监控中的应用
International Report on Wafer Level Reliability Workshop Pub Date : 1992-12-31 DOI: 10.1109/IWLR.1992.657994
J. Suehle, M. Gaitan
{"title":"Application of CMOS-Compatible Micro-Hotplates for In-situ Process Monitors","authors":"J. Suehle, M. Gaitan","doi":"10.1109/IWLR.1992.657994","DOIUrl":"https://doi.org/10.1109/IWLR.1992.657994","url":null,"abstract":"A CMOS-compatible micromechanical structure that can be used as an in-situ sensor for monitoring and controlling the deposition of films is reported. This micro-hotplate structure is fabricated by the micromachining of commercial CMOS-technology wafers or chips and the deposition of additional films. This device is comprised of a polysilicon resistor for heating, an aluminum plate for temperature sensing, and four top aluminum contacts that provide electrical connection to sensing materials or to films that are being deposited. Arrays of micro-hotplates have been fabricated and used to study film growth at several substrate temperatures. A matrix of experiments can be performed during one deposition cycle using such an array of structures. Examples will be presented using the microhotplate: to monitor substrate temperature during aluminum sputtering, to monitor film resistivity during deposition, and to sense the presence of gas species.","PeriodicalId":395564,"journal":{"name":"International Report on Wafer Level Reliability Workshop","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-12-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132733564","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Building In Reliability For Packaging And Assembly 为包装和装配建立可靠性
International Report on Wafer Level Reliability Workshop Pub Date : 1900-01-01 DOI: 10.1109/IWLR.1992.657985
C. Shirley
{"title":"Building In Reliability For Packaging And Assembly","authors":"C. Shirley","doi":"10.1109/IWLR.1992.657985","DOIUrl":"https://doi.org/10.1109/IWLR.1992.657985","url":null,"abstract":"Rapidly evolving package technology, especially plastic package technology, combined with shortening silicon process and product development cycles, demands increasingly rapid integration of package technology with silicon technology. On the other hand, package reliability evaluation still requires repeated cycles of fabrication, environmental test, and analysis. This forces parallel, modular, highly accelerated evaluation of the major reliability interactions between silicon and package. We survey the major technology trends, and how these affect siliconlpackage interactions inportant to reliability. Development cycle time may be reduced by replacing 85/85 with HAST and by using assemblyoriented test chips. A key area for future development is the development of models for the prediction of reliability, which will reduce the testing required.","PeriodicalId":395564,"journal":{"name":"International Report on Wafer Level Reliability Workshop","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124789734","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Customer and Summary Report Management Acceptance Of Bir Group Discussion 客户和总结报告管理对Bir小组讨论的接受
International Report on Wafer Level Reliability Workshop Pub Date : 1900-01-01 DOI: 10.1109/IWLR.1992.658011
B. Vasquez, D. Crook
{"title":"Customer and Summary Report Management Acceptance Of Bir Group Discussion","authors":"B. Vasquez, D. Crook","doi":"10.1109/IWLR.1992.658011","DOIUrl":"https://doi.org/10.1109/IWLR.1992.658011","url":null,"abstract":"","PeriodicalId":395564,"journal":{"name":"International Report on Wafer Level Reliability Workshop","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126134349","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Wafer Level IC Burn-in As A Step Towards Bir 晶圆级IC老化是迈向Bir的一步
International Report on Wafer Level Reliability Workshop Pub Date : 1900-01-01 DOI: 10.1109/IWLR.1992.657999
J. Miller, V. Soorholtz, B. Vesquez
{"title":"Wafer Level IC Burn-in As A Step Towards Bir","authors":"J. Miller, V. Soorholtz, B. Vesquez","doi":"10.1109/IWLR.1992.657999","DOIUrl":"https://doi.org/10.1109/IWLR.1992.657999","url":null,"abstract":"","PeriodicalId":395564,"journal":{"name":"International Report on Wafer Level Reliability Workshop","volume":"433 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132387407","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Why focus on building-in reliability 为什么要关注内置可靠性
International Report on Wafer Level Reliability Workshop Pub Date : 1900-01-01 DOI: 10.1109/IWLR.1992.657982
B. Vasquez
{"title":"Why focus on building-in reliability","authors":"B. Vasquez","doi":"10.1109/IWLR.1992.657982","DOIUrl":"https://doi.org/10.1109/IWLR.1992.657982","url":null,"abstract":"","PeriodicalId":395564,"journal":{"name":"International Report on Wafer Level Reliability Workshop","volume":"53 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123169902","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Universal Qualification- A Qualification Strategy for SUPERASIC's 通用资格认证——SUPERASIC的资格认证策略
International Report on Wafer Level Reliability Workshop Pub Date : 1900-01-01 DOI: 10.1109/IWLR.1992.658005
R. Radojcic
{"title":"Universal Qualification- A Qualification Strategy for SUPERASIC's","authors":"R. Radojcic","doi":"10.1109/IWLR.1992.658005","DOIUrl":"https://doi.org/10.1109/IWLR.1992.658005","url":null,"abstract":"","PeriodicalId":395564,"journal":{"name":"International Report on Wafer Level Reliability Workshop","volume":"AES-9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121002539","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Assembly Level Reliability 装配级可靠性
International Report on Wafer Level Reliability Workshop Pub Date : 1900-01-01 DOI: 10.1109/IWLR.1992.657986
K. Mohan
{"title":"Assembly Level Reliability","authors":"K. Mohan","doi":"10.1109/IWLR.1992.657986","DOIUrl":"https://doi.org/10.1109/IWLR.1992.657986","url":null,"abstract":"","PeriodicalId":395564,"journal":{"name":"International Report on Wafer Level Reliability Workshop","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129145153","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Methodology for Designing-In Reliability 可靠性设计方法
International Report on Wafer Level Reliability Workshop Pub Date : 1900-01-01 DOI: 10.1109/IWLR.1992.658002
S. Veeraraghavan
{"title":"Methodology for Designing-In Reliability","authors":"S. Veeraraghavan","doi":"10.1109/IWLR.1992.658002","DOIUrl":"https://doi.org/10.1109/IWLR.1992.658002","url":null,"abstract":"","PeriodicalId":395564,"journal":{"name":"International Report on Wafer Level Reliability Workshop","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129636288","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The Forecast Of The Gate Oxide Reliability On The Wafer Level 晶圆级栅氧化可靠性的预测
International Report on Wafer Level Reliability Workshop Pub Date : 1900-01-01 DOI: 10.1109/IWLR.1992.657997
B. Lisenker
{"title":"The Forecast Of The Gate Oxide Reliability On The Wafer Level","authors":"B. Lisenker","doi":"10.1109/IWLR.1992.657997","DOIUrl":"https://doi.org/10.1109/IWLR.1992.657997","url":null,"abstract":"","PeriodicalId":395564,"journal":{"name":"International Report on Wafer Level Reliability Workshop","volume":"603 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116172896","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Building-in Reliability at SGC-THOMSON Microelectronics SGC-THOMSON微电子的内置可靠性
International Report on Wafer Level Reliability Workshop Pub Date : 1900-01-01 DOI: 10.1109/IWLR.1992.657983
H. Hoang
{"title":"Building-in Reliability at SGC-THOMSON Microelectronics","authors":"H. Hoang","doi":"10.1109/IWLR.1992.657983","DOIUrl":"https://doi.org/10.1109/IWLR.1992.657983","url":null,"abstract":"","PeriodicalId":395564,"journal":{"name":"International Report on Wafer Level Reliability Workshop","volume":"03 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129774134","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
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