发布求助
文献互助 智能选刊 最新文献

International Report on Wafer Level Reliability Workshop最新文献

筛选
英文 中文
The Use of Special Purpose Assembly Test Chips for Evaluating Reliability in Packaged Devices 使用专用组装测试芯片评估封装器件的可靠性
International Report on Wafer Level Reliability Workshop Pub Date : 1900-01-01 DOI: 10.1109/IWLR.1992.657987
J. Sweet
{"title":"The Use of Special Purpose Assembly Test Chips for Evaluating Reliability in Packaged Devices","authors":"J. Sweet","doi":"10.1109/IWLR.1992.657987","DOIUrl":"https://doi.org/10.1109/IWLR.1992.657987","url":null,"abstract":"","PeriodicalId":395564,"journal":{"name":"International Report on Wafer Level Reliability Workshop","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116897144","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
High-frequency Test Structures For Wafer-level Reliability 晶圆级可靠性高频测试结构
International Report on Wafer Level Reliability Workshop Pub Date : 1900-01-01 DOI: 10.1109/IWLR.1992.657989
E. Snyder, D. V. Campbell, S. Swanson
{"title":"High-frequency Test Structures For Wafer-level Reliability","authors":"E. Snyder, D. V. Campbell, S. Swanson","doi":"10.1109/IWLR.1992.657989","DOIUrl":"https://doi.org/10.1109/IWLR.1992.657989","url":null,"abstract":"A series of unique self-stressing reliability test structures suitable for investigation of reliability concerns (hot carriers, electromigration, oxide breakdown) under realistic integrated circuit operating conditions are reported. These structures contain on-chip voltage-controlled oscillators. Using only DC signals, high-frequency (>lo0 MHz with nanosecond rise and fall times) wafer-level reliability characterizations are performed. This work describes these self-stressing structures with an example of a high-frequency, hot-carrier degradation performed at the wafer-level.","PeriodicalId":395564,"journal":{"name":"International Report on Wafer Level Reliability Workshop","volume":"74 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115719713","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Spectral Ellipsometry for In Situ Real-Time Measurement and Control 用于现场实时测量和控制的光谱椭偏仪
International Report on Wafer Level Reliability Workshop Pub Date : 1900-01-01 DOI: 10.1109/IWLR.1992.657993
W. Duncan, S. Henck, L. Loewenstein
{"title":"Spectral Ellipsometry for In Situ Real-Time Measurement and Control","authors":"W. Duncan, S. Henck, L. Loewenstein","doi":"10.1109/IWLR.1992.657993","DOIUrl":"https://doi.org/10.1109/IWLR.1992.657993","url":null,"abstract":"*Described is a spectral ellipsometer capable of precisely measuring thicknesses and compositions of multilayer structures, in situ and in real time. This spectral ellipsometer has been applied to wafer property monitoring during remote microwave plasma etching. Thicknesses, etch rates and compositions are fed back to a process host computer in real-time for single layer or multilayer film stacks of Si3N4, Si02, SiqN4 and Si02 mixtures, polycrystalline Si. It is noteworthy that unlike many other sensing techniques, interfaces can be anticipated using ellipsometry, allowing end pointing at any desired film thickness. Standard deviations for repeat thickness measurement are better than 0.04 nm for single layer films and about 0.2 nm for individual films within multilayer stacks. Spectral ellipsometry allows over determination of variables in multilayer stacks, hence, structure models and layer ,parameters can be verified using statistical methods. Spectral information also allows self calibration of incident angles.","PeriodicalId":395564,"journal":{"name":"International Report on Wafer Level Reliability Workshop","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115863138","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
The Isothermal Wafer Level Test for VLSl Interconnect Evaluation VLSl互连评估的等温晶圆水平测试
International Report on Wafer Level Reliability Workshop Pub Date : 1900-01-01 DOI: 10.1109/IWLR.1992.658004
R. Hijab, J. Yue
{"title":"The Isothermal Wafer Level Test for VLSl Interconnect Evaluation","authors":"R. Hijab, J. Yue","doi":"10.1109/IWLR.1992.658004","DOIUrl":"https://doi.org/10.1109/IWLR.1992.658004","url":null,"abstract":"","PeriodicalId":395564,"journal":{"name":"International Report on Wafer Level Reliability Workshop","volume":"76 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122541762","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Comparison Of A Rapid Wafer Level Gate Oxide Test To Tddb 快速晶圆级栅极氧化测试与Tddb的比较
International Report on Wafer Level Reliability Workshop Pub Date : 1900-01-01 DOI: 10.1109/IWLR.1992.657996
A.-R. Barakji, J. Yue, N. Bui, L. Toyoshiba
{"title":"Comparison Of A Rapid Wafer Level Gate Oxide Test To Tddb","authors":"A.-R. Barakji, J. Yue, N. Bui, L. Toyoshiba","doi":"10.1109/IWLR.1992.657996","DOIUrl":"https://doi.org/10.1109/IWLR.1992.657996","url":null,"abstract":"","PeriodicalId":395564,"journal":{"name":"International Report on Wafer Level Reliability Workshop","volume":"77 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124081936","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Design For Reliabiltiy 可靠性设计
International Report on Wafer Level Reliability Workshop Pub Date : 1900-01-01 DOI: 10.1109/IWLR.1992.657980
D. Rennels, Y. Tamir, V. Tyree
{"title":"Design For Reliabiltiy","authors":"D. Rennels, Y. Tamir, V. Tyree","doi":"10.1109/IWLR.1992.657980","DOIUrl":"https://doi.org/10.1109/IWLR.1992.657980","url":null,"abstract":"","PeriodicalId":395564,"journal":{"name":"International Report on Wafer Level Reliability Workshop","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126806846","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Summary Report: Wafer Level Reliability Testing Discussion Group 摘要报告:晶圆级可靠性测试讨论小组
International Report on Wafer Level Reliability Workshop Pub Date : 1900-01-01 DOI: 10.1109/IWLR.1992.658008
K. Boyko, J. Miller
{"title":"Summary Report: Wafer Level Reliability Testing Discussion Group","authors":"K. Boyko, J. Miller","doi":"10.1109/IWLR.1992.658008","DOIUrl":"https://doi.org/10.1109/IWLR.1992.658008","url":null,"abstract":"","PeriodicalId":395564,"journal":{"name":"International Report on Wafer Level Reliability Workshop","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129717929","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Generic Test Structure Heater Design And Characterization 一种通用测试结构加热器的设计与表征
International Report on Wafer Level Reliability Workshop Pub Date : 1900-01-01 DOI: 10.1109/IWLR.1992.657988
C. Messick, T. Turner
{"title":"A Generic Test Structure Heater Design And Characterization","authors":"C. Messick, T. Turner","doi":"10.1109/IWLR.1992.657988","DOIUrl":"https://doi.org/10.1109/IWLR.1992.657988","url":null,"abstract":"","PeriodicalId":395564,"journal":{"name":"International Report on Wafer Level Reliability Workshop","volume":"36 10","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114047949","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Wafer Level Autoclave 晶圆级高压灭菌器
International Report on Wafer Level Reliability Workshop Pub Date : 1900-01-01 DOI: 10.1109/IWLR.1992.658001
A. Matosevich, B. Lisenker
{"title":"Wafer Level Autoclave","authors":"A. Matosevich, B. Lisenker","doi":"10.1109/IWLR.1992.658001","DOIUrl":"https://doi.org/10.1109/IWLR.1992.658001","url":null,"abstract":"","PeriodicalId":395564,"journal":{"name":"International Report on Wafer Level Reliability Workshop","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131061551","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Thin Oxide Development And Monitoring vehicle 薄氧化物开发与监测车辆
International Report on Wafer Level Reliability Workshop Pub Date : 1900-01-01 DOI: 10.1109/IWLR.1992.657998
C. Messick
{"title":"Thin Oxide Development And Monitoring vehicle","authors":"C. Messick","doi":"10.1109/IWLR.1992.657998","DOIUrl":"https://doi.org/10.1109/IWLR.1992.657998","url":null,"abstract":"","PeriodicalId":395564,"journal":{"name":"International Report on Wafer Level Reliability Workshop","volume":"218 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122849761","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
首页 上一页 下一页 尾页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：481959085
Book学术官方微信