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The Use of Special Purpose Assembly Test Chips for Evaluating Reliability in Packaged Devices

International Report on Wafer Level Reliability Workshop Pub Date : 1900-01-01 DOI:10.1109/IWLR.1992.657987
J. Sweet
{"title":"The Use of Special Purpose Assembly Test Chips for Evaluating Reliability in Packaged Devices","authors":"J. Sweet","doi":"10.1109/IWLR.1992.657987","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":395564,"journal":{"name":"International Report on Wafer Level Reliability Workshop","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Report on Wafer Level Reliability Workshop","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IWLR.1992.657987","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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使用专用组装测试芯片评估封装器件的可靠性
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International Report on Wafer Level Reliability Workshop
International Report on Wafer Level Reliability Workshop
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