2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)最新文献_第10页

Investigation of mass transport in a spiral microfluidic network with an expansion chamber 带膨胀腔的螺旋微流控网络中质量输运的研究

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Pub Date : 2017-05-01 DOI: 10.1109/ITHERM.2017.7992458

R. Arayanarakool, L. Balasubramaniam, Samuel David Marshall, Wang Heng, Bing Li, P. Lee, Peter C. Y. Chen

{"title":"Investigation of mass transport in a spiral microfluidic network with an expansion chamber","authors":"R. Arayanarakool, L. Balasubramaniam, Samuel David Marshall, Wang Heng, Bing Li, P. Lee, Peter C. Y. Chen","doi":"10.1109/ITHERM.2017.7992458","DOIUrl":"https://doi.org/10.1109/ITHERM.2017.7992458","url":null,"abstract":"In this work, we proposed the new design of two spiral networks interconnected with an expansion chamber to create vortex and disruption of the laminar boundary of intermingled streams which can efficiently boost mass transport in the microchannel. Confocal microscope is used to observe the mixing and fluid motion in the microchannel. We observed the evolution of Dean vortices along the spiral inlet channel and the disruption of stream boundary at the expansion chamber which are further pulled along the outlet spiral channel resulting in higher mixing efficiency compared to that without chamber. Laminar flow of two fluids still maintained at the end of the normal spiral networks but the perfect mixing can be achieved at a given flow rates (Re of 15 to 45) from our design. Furthermore, uniform mixing can be obtained even at the spiral channel with shorter channel length. Unlike other complex designs, the design of the expansion chamber does not increase the pressure drop of the microchannel system and its dimension is larger than that of the main channel allowing to be fabricated by using conventional fabrication approach.","PeriodicalId":387542,"journal":{"name":"2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130509975","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Simulation and experimental analysis of data centers in academic campus 高校校园数据中心仿真与实验分析

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Pub Date : 2017-05-01 DOI: 10.1109/ITHERM.2017.7992589

K. Choo, M. Ohadi, D. Cooper

引用次数: 0

High voltage stacked diode package with integrated thermal management 高压堆叠二极管封装集成热管理

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Pub Date : 2017-05-01 DOI: 10.1109/ITHERM.2017.7992583

L. Boteler, M. Hinojosa, V. A. Niemann, S. Miner, David Gonzalez-Nino

引用次数: 10

Multi-core server processors thermal analysis 多核服务器处理器热分析

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Pub Date : 2017-05-01 DOI: 10.1109/ITHERM.2017.7992504

Guoping Xu

{"title":"Multi-core server processors thermal analysis","authors":"Guoping Xu","doi":"10.1109/ITHERM.2017.7992504","DOIUrl":"https://doi.org/10.1109/ITHERM.2017.7992504","url":null,"abstract":"To improve computing performance for server systems, increase in the number of CPU cores is one of the primary design parameters, in addition to higher frequency and advanced process technology node adoption. CPU core count, size, physical distribution and power density on the processor die could have great impact on thermal and computing performance. A thermal analysis is performed to understand these effects with the modeling assumptions: 60 mm × 60 mm flip chip lidded package, single die at size of 25 mm × 25 mm and total power dissipation of 300W. The thermal model including package and heat sink is set up to analyze variables such as core count, distribution and power level/density. To keep the processor temperature from exceeding the junction limit, dynamic voltage and frequency scaling (DVFS) is commonly used. A method to correlate thermal and computing performance based on DVFS, is also explored when junction temperature hits the limit. The impact of multi-core processor design on thermal performance is translated into the impact on computing performance under thermal constraints. Thermal guidance on multi-core processor die floor plan to optimize computing performance is provided.","PeriodicalId":387542,"journal":{"name":"2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"93 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126200763","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Effect of storage on high strain rate mechanical properties of SAC105 at operating temperature up to 200°C 在工作温度高达200°C时，储存对SAC105高应变速率力学性能的影响

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Pub Date : 2017-05-01 DOI: 10.1109/ITHERM.2017.7992649

P. Lall, Vikas Yadav, J. Suhling, David Locker

{"title":"Effect of storage on high strain rate mechanical properties of SAC105 at operating temperature up to 200°C","authors":"P. Lall, Vikas Yadav, J. Suhling, David Locker","doi":"10.1109/ITHERM.2017.7992649","DOIUrl":"https://doi.org/10.1109/ITHERM.2017.7992649","url":null,"abstract":"Electronic devices used in higher temperatures environments such as well logging in the oil and natural gas industries, under hood automotive applications, military applications may be exposed to very high temperatures around 200°C and high strain rates. Previously, lead based solder alloys have been used in such applications but due to health concern, use of lead-free solder alloys (SAC) has been increased. High temperature shock and vibration loads may be generally in the strain rate range of 1–100 per sec. Temperatures in drilling wells can exceed 200°C. Lead free solder material properties may keep evolving when they exposed to thermal aging or high temperatures. There are no published data for effect of aging of SAC105 leadfree solder alloy at high strain rate at very high operating temperature (150°C-200°C). For better design, reliability and process optimization, we need more reliable, consistent solder constitutive equations and material properties. Previously, Materials properties for SAC solder alloys at different strain rates and temperatures have been reported by many researchers. Mechanical properties for SAC solder alloys at operating temperatures up to 125°C and high strain rates (1075 per sec) have been reported by Lall for aged and unaged solder [1-9]. Many constitutive models have been used to represent the material behavior for SAC solder alloys. Anand constitutive model is widely used to describe the deformation behavior for SAC solder alloys as well as Sn-Pb based solder. Anand parameters have been computed for SAC105 and SAC305 for high strain rate and elevated temperature [4-9]. However, there is no prior reported measurement of anand parameters for SAC105 solders during operation at 200°C, at high strain rate. In this study, mechanical properties and constitutive behavior of lead free SAC105 has been measured for high strain rate (10–75 per sec) at elevated temperature (25°C–200°C) for thermal aged samples.","PeriodicalId":387542,"journal":{"name":"2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"61 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129215797","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Thermal conductivity measurements on suspended diamond membranes using picosecond and femtosecond time-domain thermoreflectance 利用皮秒和飞秒时域热反射测量悬浮金刚石膜的热导率

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Pub Date : 2017-05-01 DOI: 10.1109/ITHERM.2017.7992555

R. Cheaito, A. Sood, Luke Yates, Thomas L. Bougher, Zhe Cheng, M. Asheghi, S. Graham, K. Goodson

引用次数: 7

Numerical and experimental thermal performance analysis of two different types of air cooled electronic chassis developed for military aviation platform 军用航空平台两种不同类型风冷电子底盘热性能的数值与实验分析

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Pub Date : 2017-05-01 DOI: 10.1109/ITHERM.2017.7992544

Murat Parlak, A. Akyol, Oguzhan Efe

{"title":"Numerical and experimental thermal performance analysis of two different types of air cooled electronic chassis developed for military aviation platform","authors":"Murat Parlak, A. Akyol, Oguzhan Efe","doi":"10.1109/ITHERM.2017.7992544","DOIUrl":"https://doi.org/10.1109/ITHERM.2017.7992544","url":null,"abstract":"Because of exposing challenging environmental conditions such as extreme ambient temperatures, high humidity, salt fog and dust, electronic units in military systems have substantially different design constraints than others. Hence it should be taken serious precautions to prevent electronics and mechanics from these environmental threats. This study is aimed to provide numerical approach to tackle the extreme environmental conditions and obtain high cooling performance for an electronical device. In accordance with the purpose, two different chassis design alternatives have been proposed. First, cold plate fin (heat sink) design is carried out with several fin type iterations considering the temperature and pressure drop values and it gives rise to a compact product with high cooling rate. Second, using the exactly the same fin configuration, the chassis is externally cooled where corrugated plain fin (air to air HX) is used to make the unit as bright as possible with easy production. In mechanical aspect, both designs are very different from each other but they serve the same purpose using the same electronic components, cold plates and cooling fan. All numerical analysis have been carried out by using ANSYS Fluent ® software and prototypes are tested in the laboratory by measuring the temperature at critical points. Besides, in terms of engineering point view, advantages and disadvantages of both designs are discussed in detail.","PeriodicalId":387542,"journal":{"name":"2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"299 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122414077","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Embedded two-phase cooling of high heat flux electronics on silicon carbide (SiC) using thin-film evaporation and an enhanced delivery system (FEEDS) manifold-microchannel cooler 利用薄膜蒸发和增强型输送系统(FEEDS)歧管-微通道冷却器在碳化硅(SiC)上实现高热流密度电子器件的嵌入式两相冷却

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Pub Date : 2017-05-01 DOI: 10.1109/ITHERM.2017.7992511

Daniel G. Bae, R. Mandel, S. Dessiatoun, S. Rajgopal, Samantha P. Roberts, M. Mehregany, M. Ohadi

{"title":"Embedded two-phase cooling of high heat flux electronics on silicon carbide (SiC) using thin-film evaporation and an enhanced delivery system (FEEDS) manifold-microchannel cooler","authors":"Daniel G. Bae, R. Mandel, S. Dessiatoun, S. Rajgopal, Samantha P. Roberts, M. Mehregany, M. Ohadi","doi":"10.1109/ITHERM.2017.7992511","DOIUrl":"https://doi.org/10.1109/ITHERM.2017.7992511","url":null,"abstract":"This work presents experimental results of a two-phase, embedded cooling system for high heat flux electronics on silicon carbide (SiC) substrates. The system uses a thin-Film Evaporation and Enhanced fluid Delivery System (FEEDS) Manifold-Microchannel (MMC) cooler. SiC-based high power electronics are gaining momentum due to SiC's desirable electrical and thermal performance. For example, single-crystalline SiC shows thermal conductivities exceeding 350 W/m-K, which is several times higher than that of silicon. Accordingly, FEEDS MMC coolers were fabricated and embedded onto SiC substrates by etching deep-trench (with aspect ratios around 5) microchannels into the substrates. Previous studies on FEEDS MMC on silicon have reached high heat fluxes above 1 kW/cm2 at 45% vapor quality with R245fa at 30°C saturation temperature. In comparison, the SiC devices here show better thermal performance, exhibiting cooling of 1 kW/cm2 and up to ∼85% exit vapor quality. The system was also tested with single-phase mode to validate system performance via comparison to CFD simulations, before two-phase tests were performed. Microfabrication of the SiC channels are also discussed.","PeriodicalId":387542,"journal":{"name":"2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122808144","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 24

Performance study of motorcycle driving-beam LED headlight with different heat sink models and LED pitch 不同散热器型号及LED间距下摩托车前照灯性能研究

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Pub Date : 2017-05-01 DOI: 10.1109/ITHERM.2017.7992566

R. Sundar, N. V. Sarma

{"title":"Performance study of motorcycle driving-beam LED headlight with different heat sink models and LED pitch","authors":"R. Sundar, N. V. Sarma","doi":"10.1109/ITHERM.2017.7992566","DOIUrl":"https://doi.org/10.1109/ITHERM.2017.7992566","url":null,"abstract":"The automotive industry is making a transition to LEDs as the primary lighting source for many applications. The adoption of LEDs for forward lighting is met with hurdles like proper heat dissipation and high initial cost. In this project the problem of heat dissipation has been addressed and its effect on the headlight performance was also studied. A simple 7” round driving beam headlight was modelled with a heat sink for this project. In order to dissipate the heat effectively two methods were adopted: 1. Insertion of a heat pipe in heatsink and 2. Modification of LED pitch. So a total of four models — 1)headlight without heat pipe, 2)headlight with heat pipe, 3)headlight with modified LED pitch and without heat pipe and 4)headlight with modified LED pitch and heat pipe; were thermally analysed in a CFD thermal simulation software tool-6SigmaET. The critical temperatures obtained from the thermal simulation were used to determine the luminous flux of each LED. Then using the luminous flux values of the LEDs the illuminance test, required for type approval of headlight as per AIS 010(Part 1), was simulated in TracePro software for the four headlight models. The variation in the illuminance value due to the different junction temperatures of the LED was studied using the above simulation. Finally, the reliability of each model of LED headlight was calculated using the Arrhenius equation and military handbook for electronic equipment-MIL HDBK-217F.","PeriodicalId":387542,"journal":{"name":"2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115452001","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Physical and Thermal Characterization of CVD Diamond: A Bottoms-up Review CVD金刚石的物理和热特性:自下而上的综述

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Pub Date : 2017-05-01 DOI: 10.1109/ITHERM.2017.8023958

F. Faili, Nicola Palmer, Seajin Oh, D. Twitchen

引用次数: 3