在工作温度高达200°C时,储存对SAC105高应变速率力学性能的影响

P. Lall, Vikas Yadav, J. Suhling, David Locker
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引用次数: 3

摘要

在高温环境中使用的电子设备,如石油和天然气行业的测井、汽车引擎盖下的应用、军事应用,可能会暴露在200°C左右的高温和高应变率下。以前,铅基钎料合金已用于此类应用,但由于健康问题,无铅钎料合金(SAC)的使用有所增加。高温冲击和振动载荷的应变速率一般在1-100次/秒,钻井温度可超过200℃。当无铅焊料暴露在热老化或高温下时,其性能可能会不断变化。SAC105无铅钎料合金在非常高的工作温度(150°C-200°C)下,在高应变速率下时效的影响尚无公布的数据。为了更好的设计、可靠性和工艺优化,我们需要更可靠、一致的焊料本构方程和材料性能。在此之前,许多研究者已经报道了SAC钎料合金在不同应变速率和温度下的材料性能。Lall报道了SAC钎料合金在工作温度高达125°C和高应变率(每秒1075次)下的机械性能[1-9]。许多本构模型被用于表征SAC钎料合金的材料性能。Anand本构模型被广泛用于描述SAC钎料合金以及Sn-Pb基钎料的变形行为。计算了SAC105和SAC305在高应变速率和高温下的Anand参数[4-9]。然而,在200°C的高应变率下,SAC105焊料在工作期间的anand参数测量没有先前的报道。在这项研究中,无铅SAC105在高温(25°C - 200°C)下的高应变率(10-75 /秒)下的力学性能和本构行为被测量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effect of storage on high strain rate mechanical properties of SAC105 at operating temperature up to 200°C
Electronic devices used in higher temperatures environments such as well logging in the oil and natural gas industries, under hood automotive applications, military applications may be exposed to very high temperatures around 200°C and high strain rates. Previously, lead based solder alloys have been used in such applications but due to health concern, use of lead-free solder alloys (SAC) has been increased. High temperature shock and vibration loads may be generally in the strain rate range of 1–100 per sec. Temperatures in drilling wells can exceed 200°C. Lead free solder material properties may keep evolving when they exposed to thermal aging or high temperatures. There are no published data for effect of aging of SAC105 leadfree solder alloy at high strain rate at very high operating temperature (150°C-200°C). For better design, reliability and process optimization, we need more reliable, consistent solder constitutive equations and material properties. Previously, Materials properties for SAC solder alloys at different strain rates and temperatures have been reported by many researchers. Mechanical properties for SAC solder alloys at operating temperatures up to 125°C and high strain rates (1075 per sec) have been reported by Lall for aged and unaged solder [1-9]. Many constitutive models have been used to represent the material behavior for SAC solder alloys. Anand constitutive model is widely used to describe the deformation behavior for SAC solder alloys as well as Sn-Pb based solder. Anand parameters have been computed for SAC105 and SAC305 for high strain rate and elevated temperature [4-9]. However, there is no prior reported measurement of anand parameters for SAC105 solders during operation at 200°C, at high strain rate. In this study, mechanical properties and constitutive behavior of lead free SAC105 has been measured for high strain rate (10–75 per sec) at elevated temperature (25°C–200°C) for thermal aged samples.
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